IS43TR16256A-125KBL - 4Gb DDR3 SDRAM 256Mx16 | ISSI
N.º da peça: IS43TR16256A-125KBL ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.7273 | $32,73 |
| 10 | $23.6364 | $236,36 |
| 100 | $20.9091 | $2.090,91 |
| 500 | $20 | $10.000,00 |
| 1.000 | $19.0909 | $19.090,90 |
IS43TR16256A-125KBL Visão geral
DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock signal, effectively doubling the data rate compared to DDR2. It is a key component in systems requiring high bandwidth and low latency, such as servers, routers, and embedded processors. DDR3 operates at lower voltages (1.5V or 1.35V for DDR3L) than previous generations, reducing power consumption.
Key features include a 4Gbit density, 16-bit I/O width, 800 MHz clock frequency, and a CAS latency of 11 (CL=11) at 1600MT/s. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4 (with burst chop). It also features auto refresh and self refresh modes for power saving. The 96-ball TWBGA package provides a compact footprint suitable for space-constrained designs.
The IS43TR16256A-125KBL uses a high-performance CMOS process and includes a DLL (Delay-Locked Loop) for precise timing alignment. It supports a burst length of 8 with a burst chop of 4, and features programmable read and write latencies. The device also includes a temperature-compensated self-refresh (TCSR) mode to reduce power consumption at high temperatures.
Typical applications include main memory for embedded systems, networking equipment (routers, switches), industrial PCs, and high-performance computing modules. Its 1.5V operation and 1600MT/s speed make it suitable for a wide range of DDR3-based designs.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines for DDR3 routing to maintain signal integrity. The device requires a 1.5V supply and a separate VDDQ supply, both with tight tolerance (±0.075V).
Alternativas drop-in para IS43TR16256A-125KBL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com IS43TR16256A-125KBL (mesmo formato e footprint) — diferindo em Data Rate, Operating Temperature, Package, Supply Voltage, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
IS43TR16256AL-125KBL
✓ Em estoque
$5.6 / unidade
Ver ficha técnica →MT41K256M16TW-093:P
✓ Em estoque
$15.5 / unidade
Ver ficha técnica →MT41K256M16HA-125:E
✓ Em estoque
$3.1 / unidade
Ver ficha técnica →IS43TR16256B-125KBL
📋 Alternativa de referência (fora do catálogo)
IS43TR16256A-125KBLI
📋 Alternativa de referência (fora do catálogo)
AS4C256M16D3L-12BIN
📋 Alternativa de referência (fora do catálogo)
IS43TR16256A-125KBL Classificações máximas e características elétricas
| Tipo de memória | DDR3 SDRAM |
| Tamanho da memória | 4Gbit (256M x 16) |
| Taxa de dados | 1600MT/s |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
| Supply Voltage (VDD) | 1.5V ± 0.075V |
| Supply Voltage (VDDQ) | 1.5V ± 0.075V |
| Latência CAS | 11 |
| Burst Length | 8 (with burst chop 4) |
| Encapsulamento | 96-TWBGA (9x13mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0°C to +95°C (Tc) |
| RoHS | Compliant |
| Número de pinos | 96 |
| Organização da memória | 256M x 16 |
Configuração de pinos do IS43TR16256A-125KBL
| Pino A1 | VDD — Power supply for core logic |
| Pino A2 | DQ0 — Data input/output bit 0 |
| Pino A3 | DQ1 — Data input/output bit 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output bit 2 |
| Pino A6 | DQ3 — Data input/output bit 3 |
| Pino A7 | VDDQ — Power supply for I/O |
| Pino A8 | DQ4 — Data input/output bit 4 |
| Pino A9 | DQ5 — Data input/output bit 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output bit 6 |
| Pino A12 | DQ7 — Data input/output bit 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output bit 8 |
| Pino B3 | DQ9 — Data input/output bit 9 |
| Pino B4 | VDD — Power supply for core logic |
| Pino B5 | DQ10 — Data input/output bit 10 |
| Pino B6 | DQ11 — Data input/output bit 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output bit 12 |
| Pino B9 | DQ13 — Data input/output bit 13 |
| Pino B10 | VDDQ — Power supply for I/O |
| Pino B11 | DQ14 — Data input/output bit 14 |
| Pino B12 | DQ15 — Data input/output bit 15 |
| Pino C1 | VDDQ — Power supply for I/O |
| Pino C2 | VSS — Ground |
| Pino C3 | VDD — Power supply for core logic |
| Pino C4 | VSS — Ground |
| Pino C5 | VDDQ — Power supply for I/O |
| Pino C6 | VSS — Ground |
| Pino C7 | VDD — Power supply for core logic |
| Pino C8 | VSS — Ground |
| Pino C9 | VDDQ — Power supply for I/O |
| Pino C10 | VSS — Ground |
| Pino C11 | VDD — Power supply for core logic |
| Pino C12 | VSS — Ground |
| Pino D1 | A0 — Address input bit 0 |
| Pino D2 | A1 — Address input bit 1 |
| Pino D3 | A2 — Address input bit 2 |
| Pino D4 | A3 — Address input bit 3 |
| Pino D5 | A4 — Address input bit 4 |
| Pino D6 | A5 — Address input bit 5 |
| Pino D7 | A6 — Address input bit 6 |
| Pino D8 | A7 — Address input bit 7 |
| Pino D9 | A8 — Address input bit 8 |
| Pino D10 | A9 — Address input bit 9 |
| Pino D11 | A10/AP — Address input bit 10 / Auto-precharge |
| Pino D12 | A11 — Address input bit 11 |
| Pino E1 | A12 — Address input bit 12 |
| Pino E2 | A13 — Address input bit 13 |
| Pino E3 | A14 — Address input bit 14 |
| Pino E4 | A15 — Address input bit 15 |
| Pino E5 | BA0 — Bank address bit 0 |
| Pino E6 | BA1 — Bank address bit 1 |
| Pino E7 | BA2 — Bank address bit 2 |
| Pino E8 | RAS# — Row address strobe |
| Pino E9 | CAS# — Column address strobe |
| Pino E10 | WE# — Write enable |
| Pino E11 | CS# — Chip select |
| Pino E12 | CKE — Clock enable |
| Pino F1 | ODT — On-die termination |
| Pino F2 | CK — Clock (positive) |
| Pino F3 | CK# — Clock (negative) |
| Pino F4 | VDD — Power supply for core logic |
| Pino F5 | VSS — Ground |
| Pino F6 | VDDQ — Power supply for I/O |
| Pino F7 | VSS — Ground |
| Pino F8 | VDD — Power supply for core logic |
| Pino F9 | VSS — Ground |
| Pino F10 | VDDQ — Power supply for I/O |
| Pino F11 | VSS — Ground |
| Pino F12 | VDD — Power supply for core logic |
| Pino G1 | DM0 — Data mask for byte 0 |
| Pino G2 | DQS0 — Data strobe for byte 0 |
| Pino G3 | DQS0# — Data strobe complement for byte 0 |
| Pino G4 | VSS — Ground |
| Pino G5 | VDDQ — Power supply for I/O |
| Pino G6 | VSS — Ground |
| Pino G7 | VDD — Power supply for core logic |
| Pino G8 | VSS — Ground |
| Pino G9 | VDDQ — Power supply for I/O |
| Pino G10 | VSS — Ground |
| Pino G11 | VDD — Power supply for core logic |
| Pino G12 | VSS — Ground |
| Pino H1 | DM1 — Data mask for byte 1 |
| Pino H2 | DQS1 — Data strobe for byte 1 |
| Pino H3 | DQS1# — Data strobe complement for byte 1 |
| Pino H4 | VSS — Ground |
| Pino H5 | VDDQ — Power supply for I/O |
| Pino H6 | VSS — Ground |
| Pino H7 | VDD — Power supply for core logic |
| Pino H8 | VSS — Ground |
| Pino H9 | VDDQ — Power supply for I/O |
| Pino H10 | VSS — Ground |
| Pino H11 | VDD — Power supply for core logic |
| Pino H12 | VSS — Ground |
| Pino J1 | VDDQ — Power supply for I/O |
| Pino J2 | VSS — Ground |
| Pino J3 | VDD — Power supply for core logic |
| Pino J4 | VSS — Ground |
| Pino J5 | VDDQ — Power supply for I/O |
| Pino J6 | VSS — Ground |
| Pino J7 | VDD — Power supply for core logic |
| Pino J8 | VSS — Ground |
| Pino J9 | VDDQ — Power supply for I/O |
| Pino J10 | VSS — Ground |
| Pino J11 | VDD — Power supply for core logic |
| Pino J12 | VSS — Ground |
| Pino K1 | VSS — Ground |
| Pino K2 | VDDQ — Power supply for I/O |
| Pino K3 | VSS — Ground |
| Pino K4 | VDD — Power supply for core logic |
| Pino K5 | VSS — Ground |
| Pino K6 | VDDQ — Power supply for I/O |
| Pino K7 | VSS — Ground |
| Pino K8 | VDD — Power supply for core logic |
| Pino K9 | VSS — Ground |
| Pino K10 | VDDQ — Power supply for I/O |
| Pino K11 | VSS — Ground |
| Pino K12 | VDD — Power supply for core logic |
| Pino L1 | VDD — Power supply for core logic |
| Pino L2 | VSS — Ground |
| Pino L3 | VDDQ — Power supply for I/O |
| Pino L4 | VSS — Ground |
| Pino L5 | VDD — Power supply for core logic |
| Pino L6 | VSS — Ground |
| Pino L7 | VDDQ — Power supply for I/O |
| Pino L8 | VSS — Ground |
| Pino L9 | VDD — Power supply for core logic |
| Pino L10 | VSS — Ground |
| Pino L11 | VDDQ — Power supply for I/O |
| Pino L12 | VSS — Ground |
Aplicações típicas
IS43TR16256A-125KBL é adequado para 6 aplicaçãos: Embedded Systems Main Memory, Networking Equipment, Industrial PCs, High-Performance Computing Modules, Consumer Electronics, Telecommunications Infrastructure.
Embedded Systems Main Memory
The IS43TR16256A-125KBL provides 4Gbit DDR3 SDRAM for embedded processors, offering high bandwidth and low latency. Its 1600MT/s data rate and 1.5V operation align with typical embedded memory controllers, enabling smooth multitasking and fast data access. The 96-TWBGA package fits compact PCB designs, and the device's auto-refresh and self-refresh modes help manage power in battery-powered or thermally constrained systems. Designers should ensure proper decoupling and signal integrity for reliable operation.
Recomendado
Networking Equipment
In routers, switches, and network appliances, the IS43TR16256A-125KBL serves as packet buffer memory, handling high-throughput data streams. Its 1600MT/s speed and 4Gbit density provide ample storage for queue management and forwarding tables. The device's on-die termination (ODT) improves signal integrity on high-speed buses, reducing reflections and crosstalk. The 1.5V supply is compatible with common networking ASICs, and the compact TWBGA package allows dense board layouts. For optimal performance, route DDR3 traces with matched lengths and controlled impedance.
Recomendado
Industrial PCs
Industrial PCs require reliable, long-lifetime memory for control and monitoring applications. The IS43TR16256A-125KBL offers 4Gbit capacity and 1600MT/s speed, supporting demanding industrial software. Its 0°C to +95°C operating temperature range suits typical industrial environments, and the 1.5V standard voltage ensures compatibility with industrial-grade chipsets. The device's self-refresh mode reduces power during idle periods, which is beneficial for energy-efficient designs. For harsh environments, consider the industrial temperature variant IS43TR16256A-125KBLI.
Recomendado
High-Performance Computing Modules
The IS43TR16256A-125KBL is used in compute modules and accelerators where high memory bandwidth is critical. Its 1600MT/s data rate and 16-bit interface provide fast data transfer for parallel processing tasks. The device's low latency (CL=11) reduces memory access delays, improving overall system performance. The 96-TWBGA package supports high-density board designs, and the 1.5V operation is standard for DDR3-based compute platforms. For multi-channel configurations, multiple devices can be used to increase bandwidth, but careful attention to signal integrity and power delivery is required.
Recomendado
Consumer Electronics
In consumer devices like smart TVs, set-top boxes, and gaming consoles, the IS43TR16256A-125KBL provides main memory for operating systems and applications. Its 4Gbit capacity supports multitasking and media playback, while the 1600MT/s speed ensures smooth performance. The 1.5V supply is compatible with consumer-grade SoCs, and the compact TWBGA package enables slim device designs. The device's low power consumption in self-refresh mode extends battery life in portable devices. For cost-sensitive designs, consider alternative DDR3 parts from Samsung or Micron.
Recomendado
Telecommunications Infrastructure
The IS43TR16256A-125KBL is used in base stations, switches, and telecom equipment for buffering and data processing. Its high speed and density support the large data volumes in telecom networks. The device's on-die termination and programmable latency allow fine-tuning for specific system requirements. The 1.5V operation is standard in telecom designs, and the 96-TWBGA package is suitable for high-reliability applications. For extended temperature requirements, the industrial variant IS43TR16256A-125KBLI is recommended. Proper ESD protection and power filtering are essential in this environment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para IS43TR16256A-125KBL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | IS43TR16256B-125KBL | IS43TR16256AL-125KBL | MT41K256M16TW-093 |
|---|---|---|---|---|
| Package | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | P: 96-FBGA (9x13) |
| Brand | ISSI | ISSI | ISSI | P: Micron |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | P: 4Gbit |
| Data Rate | 1600MT/s | 1600MT/s | 1600MT/s | P: 1866MT/s |
| Supply Voltage | 1.5V | 1.5V | 1.35V (DDR3L) | P: 1.35V (DDR3L) |
| CAS Latency | 11 | 11 | 11 | P: 13 |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | P: 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | P: Compliant |
Principais diferenciais
- Standard 1.5V DDR3 operation (vs MT41K256M16TW-093:P)
- Lower CAS latency (vs MT41K256M16TW-093:P)
- Same-brand drop-in availability (vs MT41K256M16TW-093:P)
Notas de projeto
The IS43TR16256A-125KBL requires a 1.5V VDD and VDDQ supply with ±0.075V tolerance. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each VDD/VDDQ pin to minimize voltage ripple. Ensure the power plane has low inductance and adequate copper pour to handle transient currents during read/write operations.
For DDR3 routing, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) for DQ, DQS, and address/command lines. Match trace lengths within ±20 mils for data groups and ±100 mils for address/command to ensure signal integrity. Follow the layout guidelines in the ISSI datasheet for TWBGA package to avoid crosstalk and reflections.
The IS43TR16256A-125KBL has a maximum operating temperature of +95°C (Tc). Ensure adequate airflow or heatsinking in high-ambient-temperature environments. The 96-TWBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For industrial applications, consider the -I variant with extended temperature range.
Informações de conformidade
RoHS compliant per distributor listings. Not AEC-Q100 qualified; industrial temperature variant available.
