IS43TR16256A-125KBL - 4Gb DDR3 SDRAM 256Mx16 | ISSI
Référence : IS43TR16256A-125KBL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.7273 | $32,73 |
| 10 | $23.6364 | $236,36 |
| 100 | $20.9091 | $2 090,91 |
| 500 | $20 | $10 000,00 |
| 1 000 | $19.0909 | $19 090,90 |
IS43TR16256A-125KBL Présentation
DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock signal, effectively doubling the data rate compared to DDR2. It is a key component in systems requiring high bandwidth and low latency, such as servers, routers, and embedded processors. DDR3 operates at lower voltages (1.5V or 1.35V for DDR3L) than previous generations, reducing power consumption.
Key features include a 4Gbit density, 16-bit I/O width, 800 MHz clock frequency, and a CAS latency of 11 (CL=11) at 1600MT/s. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4 (with burst chop). It also features auto refresh and self refresh modes for power saving. The 96-ball TWBGA package provides a compact footprint suitable for space-constrained designs.
The IS43TR16256A-125KBL uses a high-performance CMOS process and includes a DLL (Delay-Locked Loop) for precise timing alignment. It supports a burst length of 8 with a burst chop of 4, and features programmable read and write latencies. The device also includes a temperature-compensated self-refresh (TCSR) mode to reduce power consumption at high temperatures.
Typical applications include main memory for embedded systems, networking equipment (routers, switches), industrial PCs, and high-performance computing modules. Its 1.5V operation and 1600MT/s speed make it suitable for a wide range of DDR3-based designs.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines for DDR3 routing to maintain signal integrity. The device requires a 1.5V supply and a separate VDDQ supply, both with tight tolerance (±0.075V).
Alternatives de remplacement direct pour IS43TR16256A-125KBL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec IS43TR16256A-125KBL (même facteur de forme et même empreinte) — différant par Data Rate, Operating Temperature, Package, Supply Voltage, Burst Length.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
IS43TR16256AL-125KBL
✓ En stock
$5.6 / unité
Voir la fiche technique →MT41K256M16TW-093:P
✓ En stock
$15.5 / unité
Voir la fiche technique →MT41K256M16HA-125:E
✓ En stock
$3.1 / unité
Voir la fiche technique →IS43TR16256B-125KBL
📋 Alternative de référence (hors catalogue)
IS43TR16256A-125KBLI
📋 Alternative de référence (hors catalogue)
AS4C256M16D3L-12BIN
📋 Alternative de référence (hors catalogue)
IS43TR16256A-125KBL Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3 SDRAM |
| Taille de mémoire | 4Gbit (256M x 16) |
| Débit de données | 1600MT/s |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
| Supply Voltage (VDD) | 1.5V ± 0.075V |
| Supply Voltage (VDDQ) | 1.5V ± 0.075V |
| Latence CAS | 11 |
| Burst Length | 8 (with burst chop 4) |
| Boîtier | 96-TWBGA (9x13mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0°C to +95°C (Tc) |
| RoHS | Compliant |
| Nombre de broches | 96 |
| Organisation de la mémoire | 256M x 16 |
Configuration des broches de IS43TR16256A-125KBL
| Broche A1 | VDD — Power supply for core logic |
| Broche A2 | DQ0 — Data input/output bit 0 |
| Broche A3 | DQ1 — Data input/output bit 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output bit 2 |
| Broche A6 | DQ3 — Data input/output bit 3 |
| Broche A7 | VDDQ — Power supply for I/O |
| Broche A8 | DQ4 — Data input/output bit 4 |
| Broche A9 | DQ5 — Data input/output bit 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output bit 6 |
| Broche A12 | DQ7 — Data input/output bit 7 |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ8 — Data input/output bit 8 |
| Broche B3 | DQ9 — Data input/output bit 9 |
| Broche B4 | VDD — Power supply for core logic |
| Broche B5 | DQ10 — Data input/output bit 10 |
| Broche B6 | DQ11 — Data input/output bit 11 |
| Broche B7 | VSS — Ground |
| Broche B8 | DQ12 — Data input/output bit 12 |
| Broche B9 | DQ13 — Data input/output bit 13 |
| Broche B10 | VDDQ — Power supply for I/O |
| Broche B11 | DQ14 — Data input/output bit 14 |
| Broche B12 | DQ15 — Data input/output bit 15 |
| Broche C1 | VDDQ — Power supply for I/O |
| Broche C2 | VSS — Ground |
| Broche C3 | VDD — Power supply for core logic |
| Broche C4 | VSS — Ground |
| Broche C5 | VDDQ — Power supply for I/O |
| Broche C6 | VSS — Ground |
| Broche C7 | VDD — Power supply for core logic |
| Broche C8 | VSS — Ground |
| Broche C9 | VDDQ — Power supply for I/O |
| Broche C10 | VSS — Ground |
| Broche C11 | VDD — Power supply for core logic |
| Broche C12 | VSS — Ground |
| Broche D1 | A0 — Address input bit 0 |
| Broche D2 | A1 — Address input bit 1 |
| Broche D3 | A2 — Address input bit 2 |
| Broche D4 | A3 — Address input bit 3 |
| Broche D5 | A4 — Address input bit 4 |
| Broche D6 | A5 — Address input bit 5 |
| Broche D7 | A6 — Address input bit 6 |
| Broche D8 | A7 — Address input bit 7 |
| Broche D9 | A8 — Address input bit 8 |
| Broche D10 | A9 — Address input bit 9 |
| Broche D11 | A10/AP — Address input bit 10 / Auto-precharge |
| Broche D12 | A11 — Address input bit 11 |
| Broche E1 | A12 — Address input bit 12 |
| Broche E2 | A13 — Address input bit 13 |
| Broche E3 | A14 — Address input bit 14 |
| Broche E4 | A15 — Address input bit 15 |
| Broche E5 | BA0 — Bank address bit 0 |
| Broche E6 | BA1 — Bank address bit 1 |
| Broche E7 | BA2 — Bank address bit 2 |
| Broche E8 | RAS# — Row address strobe |
| Broche E9 | CAS# — Column address strobe |
| Broche E10 | WE# — Write enable |
| Broche E11 | CS# — Chip select |
| Broche E12 | CKE — Clock enable |
| Broche F1 | ODT — On-die termination |
| Broche F2 | CK — Clock (positive) |
| Broche F3 | CK# — Clock (negative) |
| Broche F4 | VDD — Power supply for core logic |
| Broche F5 | VSS — Ground |
| Broche F6 | VDDQ — Power supply for I/O |
| Broche F7 | VSS — Ground |
| Broche F8 | VDD — Power supply for core logic |
| Broche F9 | VSS — Ground |
| Broche F10 | VDDQ — Power supply for I/O |
| Broche F11 | VSS — Ground |
| Broche F12 | VDD — Power supply for core logic |
| Broche G1 | DM0 — Data mask for byte 0 |
| Broche G2 | DQS0 — Data strobe for byte 0 |
| Broche G3 | DQS0# — Data strobe complement for byte 0 |
| Broche G4 | VSS — Ground |
| Broche G5 | VDDQ — Power supply for I/O |
| Broche G6 | VSS — Ground |
| Broche G7 | VDD — Power supply for core logic |
| Broche G8 | VSS — Ground |
| Broche G9 | VDDQ — Power supply for I/O |
| Broche G10 | VSS — Ground |
| Broche G11 | VDD — Power supply for core logic |
| Broche G12 | VSS — Ground |
| Broche H1 | DM1 — Data mask for byte 1 |
| Broche H2 | DQS1 — Data strobe for byte 1 |
| Broche H3 | DQS1# — Data strobe complement for byte 1 |
| Broche H4 | VSS — Ground |
| Broche H5 | VDDQ — Power supply for I/O |
| Broche H6 | VSS — Ground |
| Broche H7 | VDD — Power supply for core logic |
| Broche H8 | VSS — Ground |
| Broche H9 | VDDQ — Power supply for I/O |
| Broche H10 | VSS — Ground |
| Broche H11 | VDD — Power supply for core logic |
| Broche H12 | VSS — Ground |
| Broche J1 | VDDQ — Power supply for I/O |
| Broche J2 | VSS — Ground |
| Broche J3 | VDD — Power supply for core logic |
| Broche J4 | VSS — Ground |
| Broche J5 | VDDQ — Power supply for I/O |
| Broche J6 | VSS — Ground |
| Broche J7 | VDD — Power supply for core logic |
| Broche J8 | VSS — Ground |
| Broche J9 | VDDQ — Power supply for I/O |
| Broche J10 | VSS — Ground |
| Broche J11 | VDD — Power supply for core logic |
| Broche J12 | VSS — Ground |
| Broche K1 | VSS — Ground |
| Broche K2 | VDDQ — Power supply for I/O |
| Broche K3 | VSS — Ground |
| Broche K4 | VDD — Power supply for core logic |
| Broche K5 | VSS — Ground |
| Broche K6 | VDDQ — Power supply for I/O |
| Broche K7 | VSS — Ground |
| Broche K8 | VDD — Power supply for core logic |
| Broche K9 | VSS — Ground |
| Broche K10 | VDDQ — Power supply for I/O |
| Broche K11 | VSS — Ground |
| Broche K12 | VDD — Power supply for core logic |
| Broche L1 | VDD — Power supply for core logic |
| Broche L2 | VSS — Ground |
| Broche L3 | VDDQ — Power supply for I/O |
| Broche L4 | VSS — Ground |
| Broche L5 | VDD — Power supply for core logic |
| Broche L6 | VSS — Ground |
| Broche L7 | VDDQ — Power supply for I/O |
| Broche L8 | VSS — Ground |
| Broche L9 | VDD — Power supply for core logic |
| Broche L10 | VSS — Ground |
| Broche L11 | VDDQ — Power supply for I/O |
| Broche L12 | VSS — Ground |
Applications typiques
IS43TR16256A-125KBL convient pour 6 applications: Embedded Systems Main Memory, Networking Equipment, Industrial PCs, High-Performance Computing Modules, Consumer Electronics, Telecommunications Infrastructure.
Embedded Systems Main Memory
The IS43TR16256A-125KBL provides 4Gbit DDR3 SDRAM for embedded processors, offering high bandwidth and low latency. Its 1600MT/s data rate and 1.5V operation align with typical embedded memory controllers, enabling smooth multitasking and fast data access. The 96-TWBGA package fits compact PCB designs, and the device's auto-refresh and self-refresh modes help manage power in battery-powered or thermally constrained systems. Designers should ensure proper decoupling and signal integrity for reliable operation.
Recommandé
Networking Equipment
In routers, switches, and network appliances, the IS43TR16256A-125KBL serves as packet buffer memory, handling high-throughput data streams. Its 1600MT/s speed and 4Gbit density provide ample storage for queue management and forwarding tables. The device's on-die termination (ODT) improves signal integrity on high-speed buses, reducing reflections and crosstalk. The 1.5V supply is compatible with common networking ASICs, and the compact TWBGA package allows dense board layouts. For optimal performance, route DDR3 traces with matched lengths and controlled impedance.
Recommandé
Industrial PCs
Industrial PCs require reliable, long-lifetime memory for control and monitoring applications. The IS43TR16256A-125KBL offers 4Gbit capacity and 1600MT/s speed, supporting demanding industrial software. Its 0°C to +95°C operating temperature range suits typical industrial environments, and the 1.5V standard voltage ensures compatibility with industrial-grade chipsets. The device's self-refresh mode reduces power during idle periods, which is beneficial for energy-efficient designs. For harsh environments, consider the industrial temperature variant IS43TR16256A-125KBLI.
Recommandé
High-Performance Computing Modules
The IS43TR16256A-125KBL is used in compute modules and accelerators where high memory bandwidth is critical. Its 1600MT/s data rate and 16-bit interface provide fast data transfer for parallel processing tasks. The device's low latency (CL=11) reduces memory access delays, improving overall system performance. The 96-TWBGA package supports high-density board designs, and the 1.5V operation is standard for DDR3-based compute platforms. For multi-channel configurations, multiple devices can be used to increase bandwidth, but careful attention to signal integrity and power delivery is required.
Recommandé
Consumer Electronics
In consumer devices like smart TVs, set-top boxes, and gaming consoles, the IS43TR16256A-125KBL provides main memory for operating systems and applications. Its 4Gbit capacity supports multitasking and media playback, while the 1600MT/s speed ensures smooth performance. The 1.5V supply is compatible with consumer-grade SoCs, and the compact TWBGA package enables slim device designs. The device's low power consumption in self-refresh mode extends battery life in portable devices. For cost-sensitive designs, consider alternative DDR3 parts from Samsung or Micron.
Recommandé
Telecommunications Infrastructure
The IS43TR16256A-125KBL is used in base stations, switches, and telecom equipment for buffering and data processing. Its high speed and density support the large data volumes in telecom networks. The device's on-die termination and programmable latency allow fine-tuning for specific system requirements. The 1.5V operation is standard in telecom designs, and the 96-TWBGA package is suitable for high-reliability applications. For extended temperature requirements, the industrial variant IS43TR16256A-125KBLI is recommended. Proper ESD protection and power filtering are essential in this environment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour IS43TR16256A-125KBL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | IS43TR16256B-125KBL | IS43TR16256AL-125KBL | MT41K256M16TW-093 |
|---|---|---|---|---|
| Package | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | P: 96-FBGA (9x13) |
| Brand | ISSI | ISSI | ISSI | P: Micron |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | P: 4Gbit |
| Data Rate | 1600MT/s | 1600MT/s | 1600MT/s | P: 1866MT/s |
| Supply Voltage | 1.5V | 1.5V | 1.35V (DDR3L) | P: 1.35V (DDR3L) |
| CAS Latency | 11 | 11 | 11 | P: 13 |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | P: 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | P: Compliant |
Principaux différenciateurs
- Standard 1.5V DDR3 operation (vs MT41K256M16TW-093:P)
- Lower CAS latency (vs MT41K256M16TW-093:P)
- Same-brand drop-in availability (vs MT41K256M16TW-093:P)
Notes de conception
The IS43TR16256A-125KBL requires a 1.5V VDD and VDDQ supply with ±0.075V tolerance. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each VDD/VDDQ pin to minimize voltage ripple. Ensure the power plane has low inductance and adequate copper pour to handle transient currents during read/write operations.
For DDR3 routing, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) for DQ, DQS, and address/command lines. Match trace lengths within ±20 mils for data groups and ±100 mils for address/command to ensure signal integrity. Follow the layout guidelines in the ISSI datasheet for TWBGA package to avoid crosstalk and reflections.
The IS43TR16256A-125KBL has a maximum operating temperature of +95°C (Tc). Ensure adequate airflow or heatsinking in high-ambient-temperature environments. The 96-TWBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For industrial applications, consider the -I variant with extended temperature range.
Informations de conformité
RoHS compliant per distributor listings. Not AEC-Q100 qualified; industrial temperature variant available.
