10M08DAF484C8G vs 10M25DAF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAF484C8G sa pamamagitan ng Intel at 10M25DAF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAF484C8G | 10M25DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8000 | — |
| Embedded Memory | 387,072 bits (378 Kbits) | — |
| User Flash | 1,540 Kbits | — |
| Maximum User I/O | 250 | — |
| ADC | 8-channel, 12-bit | Integrated 12-bit ADC (where enabled) |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| Process Technology | 55 nm | 55 nm CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Speed Grade | -C8 | -8 |
| Temperature ng Junction na Operasyon | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | — |
| DSP Blocks | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Uri ng Pagpapasok | — | Surface Mount |
| Temperature na Operasyon | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| Level ng MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |