10M08DAF484C8G vs 10M25DAF484C8G 比較
詳細並排比較 10M08DAF484C8G 由 Intel 與 10M25DAF484C8G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M08DAF484C8G | 10M25DAF484C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8000 | — |
| Embedded Memory | 387,072 bits (378 Kbits) | — |
| User Flash | 1,540 Kbits | — |
| Maximum User I/O | 250 | — |
| ADC | 8-channel, 12-bit | Integrated 12-bit ADC (where enabled) |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| Process Technology | 55 nm | 55 nm CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| 封裝 | 484-ball FBGA (FineLine BGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Speed Grade | -C8 | -8 |
| 工作接面溫度 | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | — |
| DSP Blocks | Yes | — |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| MSL 等級 | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |