EP3SE260H780C3N vs EP3SE260F1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3N sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ NakahandaIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE260H780C3N | EP3SE260F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | — |
| Number of Pins / Balls | 780 | — |
| Packhaging | 780-BBGA, FCBGA (H780) | 1152-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 °C to +85 °C (C grade, commercial) | 0 C to +85 C (Commercial) |
| Process Technology | 40 nm CMOS | 65 nm |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | — |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | Integrated high-speed transceivers |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | Yes (dedicated multiplier/accumulator) |
| Tindminan RoHS | Compliant (lead-free 'N' suffix) | Compliant |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | — |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |