EP3SE50F780C4G vs EP3SE50F780C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4G sa pamamagitan ng Intel at EP3SE50F780C3G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE50F780C4G | EP3SE50F780C3G |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix III E enhanced FPGA |
| Series | Stratix III | Stratix III E |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | 5.49 Mbit (5,760,000 bit) |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | 1.1 V |
| Hanay ng Temperature na Operasyon | 0 C to +85 C (commercial) | — |
| Packhaging | 780-ball FBGA (FCBGA) | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | External (EPCS / flash) |
| Design Software | Quartus II | — |
| Manufacturer | — | Altera (now Intel) |
| Number of Logic Elements (LE) | — | 47,500 LE |
| Number of Adaptive Logic Modules (ALM) | — | 19,000 ALM |
| Number of User I/O | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Speed Grade | — | C3 |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (Flip-Chip) |
| Style ng Pagpapasok | — | SMD/SMT |
| Packaging | — | Tray |
| Katayuan ng Lifecycle | — | Not Recommended for New Designs (NRND) |