EP3SE50F780C4G vs EP3SE50F780C3G 比較

詳細並排比較 EP3SE50F780C4G 由 Intel 與 EP3SE50F780C3G 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C4G EP3SE50F780C3G
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Family Stratix III E Stratix III E enhanced FPGA
Series Stratix III Stratix III E
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 5.76 Mbit (5760000 bit) 5.49 Mbit (5,760,000 bit)
Number of I/Os 488 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: LAB count from datasheet] —
Number of Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] —
Process Technology 40 nm TSMC —
Core Supply Voltage 1.1 V 1.1 V
工作溫度範圍 0 C to +85 C (commercial) —
封裝 780-ball FBGA (FCBGA) —
安裝類型 Surface Mount (SMD/SMT) —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
MSL 等級 MSL3 (per JEDEC J-STD-020) —
Configuration Memory SRAM-based (volatile, requires configuration device) External (EPCS / flash)
Design Software Quartus II —
Manufacturer — Altera (now Intel)
Number of Logic Elements (LE) — 47,500 LE
Number of Adaptive Logic Modules (ALM) — 19,000 ALM
Number of User I/O — 488
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
工作溫度 — 0C to +85C (Commercial)
Speed Grade — C3
封裝 / 外殼 — 780-BBGA, FCBGA (Flip-Chip)
安裝方式 — SMD/SMT
Packaging — Tray
生命週期狀態 — Not Recommended for New Designs (NRND)

資料表與資源

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