EP3SL200H780I4 vs EP3SL200H780I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4 sa pamamagitan ng Intel at EP3SL200H780I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SL200H780I4 EP3SL200H780I4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III L Stratix III L
Family Stratix III Stratix III (Logic-rich variant)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 8,000
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4
Temperature ng Junction na Operasyon -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Tindminan RoHS Compliant Compliant
Design Tool Quartus II (legacy) / Quartus Prime —
Logic Elements — 200,000
Embedded Memory (bits) — 10,901,504
User I/Os — 488
Core Voltage — 1.1 V (0.86 V to 1.15 V range)
Fabric Frequency (typical) — 450 MHz
Hanay ng Temperature na Operasyon — -40C to +100C (industrial)
Packhaging — 780-ball FCBGA (Flip-Chip BGA, FineLine)
Uri ng Pagpapasok — Surface Mount (BGA)
Lead-Free — Yes (suffix N)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita