MPC8264AZUPJDB vs MPC8260AZUPJDB Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8264AZUPJDB sa pamamagitan ng NXP Semiconductors at MPC8260AZUPJDB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8264AZUPJDB MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors

MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors

MPC8264AZUPJDB ✓ Nakahanda
NXP Semiconductors
MPC8260AZUPJDB MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP

MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP

MPC8260AZUPJDB ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro MPC8264AZUPJDB MPC8260AZUPJDB
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Huling Pagbili
Core Architecture PowerPC G2 —
Number of Cores 1 —
Width ng Data Bus 32-bit 32-bit
Maksimum na Taktiko ng Oras 300 MHz 300 MHz
Package Type 480-TBGA (37.5 x 37.5 mm) —
Family PowerQUICC II (MPC82xx) —
Process Technology 0.25 micron HiP4 CMOS 0.25 micrometer CMOS (HiP4)
Instruction Cache 16 KB —
Data Cache 16 KB —
Communications Processor Module (CPM) Integrated Integrated (FCC, SCC, SMC)
Memory Controller SDRAM / SRAM / Flash support —
PCI Interface 32-bit PCI —
Ethernet Support 10/100 Mbps (FCC) —
Serial Communications SCC, FCC, MCC (multi-channel HDLC) —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Volte ng Pagbibigay [DATA_NEEDED: core and I/O voltage] —
Uri ng Pagpapasok Surface Mount (TBGA) Surface Mount
Tindminan RoHS Compliant unknown
Manufacturer — NXP Semiconductors
Series — PowerQUICC II (MPC8260A HiP4)
Core — PowerPC G2, single core
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Supply Voltage — 1.9 V to 2.2 V
I/O Supply Voltage — 3.3 V
Packhaging — 480-TBGA (37.5 x 37.5 mm)
External Bus — 60x bus, 64-bit data
Packaging — Tray
Lifecycle — End-of-Life / Last Time Buy (per NXP PCN)

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