MPC8264AZUPJDB vs MPC8260AZUPJDB 比較
詳細並排比較 MPC8264AZUPJDB 由 NXP Semiconductors 與 MPC8260AZUPJDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors
MPC8264AZUPJDB ✓ 啟用中規格比較
| 參數 | MPC8264AZUPJDB | MPC8260AZUPJDB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 最後購買 |
| Core Architecture | PowerPC G2 | — |
| Number of Cores | 1 | — |
| 資料匯流排寬度 | 32-bit | 32-bit |
| 最大時脈頻率 | 300 MHz | 300 MHz |
| Package Type | 480-TBGA (37.5 x 37.5 mm) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Process Technology | 0.25 micron HiP4 CMOS | 0.25 micrometer CMOS (HiP4) |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Communications Processor Module (CPM) | Integrated | Integrated (FCC, SCC, SMC) |
| Memory Controller | SDRAM / SRAM / Flash support | — |
| PCI Interface | 32-bit PCI | — |
| Ethernet Support | 10/100 Mbps (FCC) | — |
| Serial Communications | SCC, FCC, MCC (multi-channel HDLC) | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 供應電壓 | [DATA_NEEDED: core and I/O voltage] | — |
| 安裝類型 | Surface Mount (TBGA) | Surface Mount |
| RoHS 狀態 | Compliant | unknown |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II (MPC8260A HiP4) |
| Core | — | PowerPC G2, single core |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Supply Voltage | — | 1.9 V to 2.2 V |
| I/O Supply Voltage | — | 3.3 V |
| 封裝 | — | 480-TBGA (37.5 x 37.5 mm) |
| External Bus | — | 60x bus, 64-bit data |
| Packaging | — | Tray |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |