EP1K50TI144-1X - 50K Gate ACEX 1K FPGA, 144-LQFP | Intel / Altera
MPN: EP1K50TI144-1X ✗ Cuối đờiEP1K50TI144-1X Tóm tắt
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), embedded memory blocks (EABs / ESBs in ACEX 1K), and programmable routing. FPGAs belong to the semiconductor hierarchy: programmable logic IC -> PLD -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are configured by the user after manufacture using an HDL bitstream and a vendor toolchain (Quartus for ACEX 1K), making them ideal for prototyping, low-volume production, and glue-logic consolidation.
Key features of the EP1K50TI144-1X include on-chip SRAM-based configuration (volatile, requires external configuration device on power-up), embedded array blocks (EABs) for efficient memory and multiplier implementation, multi-volt I/O support for interfacing to 2.5 V, 3.3 V, and 5 V systems, and an industrial operating temperature range (-40 C to +85 C) suitable for factory and outdoor equipment. The ACEX 1K architecture combines look-up-table based logic fabric with EAB memory, giving it a hybrid advantage over pure LUT-based contemporaries.
In the broader ACEX 1K portfolio the EP1K50 sits between the EP1K10 (10K gates) and EP1K100 (100K gates), making it a sweet spot for medium-complexity glue logic, bridge designs, and pre-ASIC prototyping. The "-1" speed grade is the slowest of three available grades and offers the lowest cost; the "-2" and "-3" grades provide higher Fmax but consume more power. The "X" suffix indicates industrial temperature grade and tape-and-reel packaging per the Altera ordering code convention.
Typical applications include industrial control glue logic, communication protocol bridges (UART/SPI/I2C consolidation), legacy peripheral replacement, test and measurement front-ends, and low-volume embedded control where a microcontroller's fixed peripherals are insufficient. Designers transitioning away from discrete 74-series TTL logic or older CPLDs use this part to consolidate 5 to 20 chips onto a single programmable device.
When designing with the EP1K50TI144-1X, plan for an external EPC configuration ROM (e.g., EPC2 or EPC4) on the board because the ACEX 1K configuration is volatile. Use the Quartus II design tool (legacy version 9.0 or later) for HDL entry, synthesis, and place-and-route; the bitstream must be reformatted if migrating to a different package.
This page synthesizes distributor pricing snapshots, drop-in package-compatible ACEX 1K family variants, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EP1K50TI144-1X — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K50TI144-1X (cùng hình factor và footprint) — khác nhau ở Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K50TI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K50TI144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K50TI144-1X Tỷ lệ tối đa & tính chất điện
| Family | ACEX 1K |
| Series | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Configurable Logic Blocks (CLBs) | 360 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Number of Terminals | 144 |
| Package Code | QFP / TQFP-144 (Industrial) |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | Gull Wing |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Tần số xung maksimum | 90 MHz |
| Nhiệt độ hoạt động | -40 C to +85 C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required |
| Kiểu lắp đặt | Surface Mount |
| Speed Grade | -1 (slowest, lowest cost) |
| Design Toolchain | Quartus II (legacy support) |
Cấu hình chân EP1K50TI144-1X
| Chân 1 | GND — Ground |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | I/O — User I/O pin (bank 1) |
| Chân 4 | I/O — User I/O pin (bank 1) |
| Chân 5 | I/O — User I/O pin (bank 1) |
| Chân 6 | I/O — User I/O pin (bank 1) |
| Chân 7 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 8 | I/O — User I/O pin (bank 1) |
| Chân 9 | I/O — User I/O pin (bank 1) |
| Chân 10 | I/O — User I/O pin (bank 1) |
| Chân 11 | I/O — User I/O pin (bank 1) |
| Chân 12 | I/O — User I/O pin (bank 1) |
| Chân 13 | GND — Ground |
| Chân 14 | I/O — User I/O pin (bank 1) |
| Chân 15 | I/O — User I/O pin (bank 1) |
| Chân 16 | I/O — User I/O pin (bank 1) |
| Chân 17 | I/O — User I/O pin (bank 1) |
| Chân 18 | I/O — User I/O pin (bank 1) |
| Chân 19 | I/O — User I/O pin (bank 1) |
| Chân 20 | I/O — User I/O pin (bank 1) |
| Chân 21 | VCCINT — Core supply voltage (2.5 V) |
| Chân 22 | GND — Ground |
| Chân 23 | I/O — User I/O pin (bank 2) |
| Chân 24 | I/O — User I/O pin (bank 2) |
| Chân 25 | I/O — User I/O pin (bank 2) |
| Chân 26 | I/O — User I/O pin (bank 2) |
| Chân 27 | I/O — User I/O pin (bank 2) |
| Chân 28 | I/O — User I/O pin (bank 2) |
| Chân 29 | I/O — User I/O pin (bank 2) |
| Chân 30 | I/O — User I/O pin (bank 2) |
| Chân 31 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 32 | I/O — User I/O pin (bank 2) |
| Chân 33 | I/O — User I/O pin (bank 2) |
| Chân 34 | I/O — User I/O pin (bank 2) |
| Chân 35 | I/O — User I/O pin (bank 2) |
| Chân 36 | GND — Ground |
| Chân 37 | I/O — User I/O pin (bank 2) |
| Chân 38 | I/O — User I/O pin (bank 2) |
| Chân 39 | I/O — User I/O pin (bank 2) |
| Chân 40 | I/O — User I/O pin (bank 2) |
| Chân 41 | I/O — User I/O pin (bank 2) |
| Chân 42 | I/O — User I/O pin (bank 2) |
| Chân 43 | VCCINT — Core supply voltage (2.5 V) |
| Chân 44 | GND — Ground |
| Chân 45 | I/O — User I/O pin (bank 3) |
| Chân 46 | I/O — User I/O pin (bank 3) |
| Chân 47 | I/O — User I/O pin (bank 3) |
| Chân 48 | I/O — User I/O pin (bank 3) |
| Chân 49 | I/O — User I/O pin (bank 3) |
| Chân 50 | I/O — User I/O pin (bank 3) |
| Chân 51 | I/O — User I/O pin (bank 3) |
| Chân 52 | I/O — User I/O pin (bank 3) |
| Chân 53 | I/O — User I/O pin (bank 3) |
| Chân 54 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 55 | I/O — User I/O pin (bank 3) |
| Chân 56 | I/O — User I/O pin (bank 3) |
| Chân 57 | I/O — User I/O pin (bank 3) |
| Chân 58 | I/O — User I/O pin (bank 3) |
| Chân 59 | GND — Ground |
| Chân 60 | I/O — User I/O pin (bank 3) |
| Chân 61 | I/O — User I/O pin (bank 3) |
| Chân 62 | I/O — User I/O pin (bank 3) |
| Chân 63 | I/O — User I/O pin (bank 3) |
| Chân 64 | I/O — User I/O pin (bank 3) |
| Chân 65 | I/O — User I/O pin (bank 3) |
| Chân 66 | VCCINT — Core supply voltage (2.5 V) |
| Chân 67 | GND — Ground |
| Chân 68 | I/O — User I/O pin (bank 4) |
| Chân 69 | I/O — User I/O pin (bank 4) |
| Chân 70 | I/O — User I/O pin (bank 4) |
| Chân 71 | I/O — User I/O pin (bank 4) |
| Chân 72 | I/O — User I/O pin (bank 4) |
| Chân 73 | I/O — User I/O pin (bank 4) |
| Chân 74 | I/O — User I/O pin (bank 4) |
| Chân 75 | I/O — User I/O pin (bank 4) |
| Chân 76 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 77 | I/O — User I/O pin (bank 4) |
| Chân 78 | I/O — User I/O pin (bank 4) |
| Chân 79 | I/O — User I/O pin (bank 4) |
| Chân 80 | I/O — User I/O pin (bank 4) |
| Chân 81 | GND — Ground |
| Chân 82 | I/O — User I/O pin (bank 4) |
| Chân 83 | I/O — User I/O pin (bank 4) |
| Chân 84 | I/O — User I/O pin (bank 4) |
| Chân 85 | I/O — User I/O pin (bank 4) |
| Chân 86 | I/O — User I/O pin (bank 4) |
| Chân 87 | VCCINT — Core supply voltage (2.5 V) |
| Chân 88 | GND — Ground |
| Chân 89 | I/O — User I/O pin (bank 5) |
| Chân 90 | I/O — User I/O pin (bank 5) |
| Chân 91 | I/O — User I/O pin (bank 5) |
| Chân 92 | I/O — User I/O pin (bank 5) |
| Chân 93 | I/O — User I/O pin (bank 5) |
| Chân 94 | I/O — User I/O pin (bank 5) |
| Chân 95 | I/O — User I/O pin (bank 5) |
| Chân 96 | I/O — User I/O pin (bank 5) |
| Chân 97 | I/O — User I/O pin (bank 5) |
| Chân 98 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 99 | I/O — User I/O pin (bank 5) |
| Chân 100 | I/O — User I/O pin (bank 5) |
| Chân 101 | I/O — User I/O pin (bank 5) |
| Chân 102 | I/O — User I/O pin (bank 5) |
| Chân 103 | GND — Ground |
| Chân 104 | I/O — User I/O pin (bank 5) |
| Chân 105 | I/O — User I/O pin (bank 5) |
| Chân 106 | I/O — User I/O pin (bank 5) |
| Chân 107 | I/O — User I/O pin (bank 5) |
| Chân 108 | I/O — User I/O pin (bank 5) |
| Chân 109 | VCCINT — Core supply voltage (2.5 V) |
| Chân 110 | GND — Ground |
| Chân 111 | I/O — User I/O pin (bank 6) |
| Chân 112 | I/O — User I/O pin (bank 6) |
| Chân 113 | I/O — User I/O pin (bank 6) |
| Chân 114 | I/O — User I/O pin (bank 6) |
| Chân 115 | I/O — User I/O pin (bank 6) |
| Chân 116 | I/O — User I/O pin (bank 6) |
| Chân 117 | I/O — User I/O pin (bank 6) |
| Chân 118 | I/O — User I/O pin (bank 6) |
| Chân 119 | I/O — User I/O pin (bank 6) |
| Chân 120 | VCCIO6 — I/O bank 6 supply voltage |
| Chân 121 | I/O — User I/O pin (bank 6) |
| Chân 122 | I/O — User I/O pin (bank 6) |
| Chân 123 | I/O — User I/O pin (bank 6) |
| Chân 124 | I/O — User I/O pin (bank 6) |
| Chân 125 | GND — Ground |
| Chân 126 | I/O — User I/O pin (bank 6) |
| Chân 127 | I/O — User I/O pin (bank 6) |
| Chân 128 | I/O — User I/O pin (bank 6) |
| Chân 129 | I/O — User I/O pin (bank 6) |
| Chân 130 | I/O — User I/O pin (bank 6) |
| Chân 131 | nCONFIG — Configuration control (active-low reset) |
| Chân 132 | nSTATUS — Configuration status (active-low) |
| Chân 133 | CONF_DONE — Configuration done (open-drain) |
| Chân 134 | MSEL0 — Configuration mode select 0 |
| Chân 135 | MSEL1 — Configuration mode select 1 |
| Chân 136 | TCK — JTAG test clock |
| Chân 137 | TMS — JTAG test mode select |
| Chân 138 | TDI — JTAG test data in |
| Chân 139 | TDO — JTAG test data out |
| Chân 140 | CLK0 — Dedicated global clock input 0 |
| Chân 141 | CLK1 — Dedicated global clock input 1 |
| Chân 142 | CLK2/DATA0 — Dedicated clock / data input |
| Chân 143 | CLK3/DATA1 — Dedicated clock / data input |
| Chân 144 | GND — Ground |
Ứng dụng tiêu biểu
EP1K50TI144-1X phù hợp cho 6 Áp dụngs: Industrial Glue Logic Consolidation, Legacy Peripheral Bridge (UART/SPI/I2C), Pre-ASIC Prototyping Platform, Test and Measurement Front-End, Communication Protocol Consolidation, Legacy System Maintenance / EOL Replacement.
Industrial Glue Logic Consolidation
The EP1K50TI144-1X is widely used to consolidate 5 to 20 discrete 74-series TTL or HC logic chips onto a single programmable device in industrial control cabinets. With 50,000 equivalent gates and 2,880 logic elements, it provides enough capacity for complex state machines, address decoding, and bus steering logic, while its 102 user I/O pins support direct connection to many parallel peripherals. Industrial temperature grade (-40 C to +85 C) ensures reliable operation in factory floor enclosures where ambient temperatures can fluctuate widely. Compared to discrete logic, the FPGA reduces PCB area, lowers assembly cost, and enables late-stage design changes without board rework. Designers pair it with an EPC configuration ROM and a 2.5 V LDO regulator on a compact industrial backplane.
Được đề xuất
Legacy Peripheral Bridge (UART/SPI/I2C)
Many factory automation and test systems use the EP1K50TI144-1X as a bridge between mismatched serial protocols (UART to SPI, I2C to parallel, RS-232 to RS-485). The FPGA's flexible I/O banks can interface with 2.5 V, 3.3 V, and 5 V peripherals in the same design, while the embedded array blocks (EABs) provide small FIFO buffers for protocol rate matching. Industrial temperature rating and the 144-pin TQFP's proven reliability make this part common in long-lifecycle equipment that must operate for 15+ years. The volatile SRAM configuration requires an EPC configuration ROM on the board, but the resulting design can be updated in the field by reprogramming the ROM.
Được đề xuất
Pre-ASIC Prototyping Platform
Design teams use the EP1K50TI144-1X as a low-cost pre-ASIC prototype target because Quartus II synthesis results transfer cleanly to larger ACEX 1K devices or to Cyclone IV ASIC replacements. With 50K gates and 90 MHz Fmax at the -1 speed grade, the device validates DSP datapaths, embedded processor cores (Nios), and bus architectures before committing to a masked ASIC. The 144-pin TQFP is easy to hand-solder during early bring-up, and the industrial temperature grade allows prototype validation in harsh environments. Although the part is now obsolete, existing engineering inventory supports many legacy prototype platforms still in production use.
Được đề xuất
Test and Measurement Front-End
Test equipment manufacturers integrate the EP1K50TI144-1X into bench instruments such as logic analyzers, protocol analyzers, and custom ATE platforms because its high I/O count and reconfigurable fabric allow one board to support multiple test personalities. The 102 user I/Os can fan out to multiple DUT connectors, while embedded array blocks implement capture buffers and trigger logic. The industrial temperature grade supports lab-to-floor deployment, and the 144-pin TQFP package is straightforward to assemble on multilayer test backplanes. Engineers write custom test personalities in VHDL or Verilog and recompile via Quartus II, dramatically shortening test-program development cycles.
Được đề xuất
Communication Protocol Consolidation
Embedded networking equipment uses the EP1K50TI144-1X to consolidate custom packet processing, framing, and error-correction logic that would otherwise require multiple CPLDs and discrete FIFOs. The FPGA's EAB blocks implement small CAMs and lookup tables for protocol headers, while general logic handles CRC and framing. Multi-volt I/O support allows direct connection to 3.3 V PHYs and 5 V legacy buses. The industrial temperature range is critical for outdoor telecom and roadside cabinet installations where commercial-grade parts would fail.
Được đề xuất
Legacy System Maintenance / EOL Replacement
Because the EP1K50TI144-1X is now obsolete, industrial customers with installed equipment use it primarily as a form-fit-function replacement board for legacy systems that cannot be redesigned. Authorized distributors, brokers (Octopart-listed vendors, Vemeko, Vyrian), and OEM surplus channels carry remaining stock. For new designs, Intel recommends migrating to MAX 10 (10M08SCE144) or Cyclone IV (EP4CE6E22C8N) in similar TQFP packages, which offer comparable or greater logic density, non-volatile configuration, and active toolchain support. Designers porting legacy ACEX 1K designs should plan a Quartus II to Quartus Prime migration path before committing to the modern replacement.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K50TI144-1X — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K50TI144-2N | EP1K50TI144-3N | EP1K30TI144-2N | EP1K30TI144-3N | EP1C6T144C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 5,980 |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (medium) | -3 (fastest) | -8 (Cyclone family) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 98 |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V core |
| Configuration Method | Volatile SRAM (EPC ROM required) | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM (AS mode) |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (active) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
Bảo phân biệt quan trọng
- Same die as EP1K50TI144-2N and -3N; only speed grade differs (vsEP1K50TI144-2N)
- Higher logic density than EP1K30TI144 family (vsEP1K30TI144-2N)
- Modern Cyclone alternative in same package (vsEP1C6T144C8N)
Ghi chú thiết kế
Estimated: The EP1K50TI144-1X core current at 90 MHz with typical utilization is approximately 100 mA from a 2.5 V rail. Provide at least three 0.1 uF ceramic decoupling capacitors near VCCINT pins (pins 21, 43, 66, 87, 109), plus one bulk 10 uF tantalum or ceramic capacitor. Each VCCIO bank (pins 7, 31, 54, 76, 98, 120) requires its own decoupling network sized for the I/O switching current. A linear LDO such as a 2.5 V regulator is acceptable for low-noise designs; for higher I/O switching loads, a switching regulator followed by an LDO provides better efficiency.
Route the JTAG chain (TCK, TMS, TDI, TDO) with impedance-controlled traces and keep them short (< 50 mm) to avoid signal integrity issues during in-system programming. Place the EPC configuration ROM within 50 mm of the FPGA's DATA/DCLK pins to meet ACEX 1K configuration timing. Provide a 1 kohm pull-up on nCONFIG and a 10 kohm pull-up on CONF_DONE per the Altera reference design. Decoupling capacitors must be placed as close as possible to the corresponding power pins to minimize supply inductance.
Do not leave MSEL0/MSEL1 floating; tie them to VCCINT or GND to select the correct configuration mode (typically AS mode for EPC1/EPC2). Ensure the EPC configuration ROM is correctly programmed before solder reflow because the ACEX 1K will not boot without valid configuration data. Verify that all VCCIO banks are powered even if unused, otherwise the FPGA's I/O pins enter indeterminate states. When migrating designs between speed grades, re-run Quartus II timing analysis because the -1, -2, and -3 grades have different Fmax and tCO specifications.
Estimated: At typical utilization (50% logic, 50% I/O toggling at 50 MHz) the EP1K50TI144-1X dissipates approximately 0.5 W, well within the TQFP-144's thermal envelope without a heatsink. Under worst-case utilization (100% logic at 90 MHz), dissipation can reach 1.0 to 1.5 W; in enclosed industrial enclosures with minimal airflow, attach a small clip-on heatsink or provide thermal vias under the package thermal pad. Industrial temperature grade (-40 C to +85 C) ensures reliable operation but does not substitute for proper thermal management.
Thông tin tuân thủ
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral status were not present in the verified distributor data. ACEX 1K parts are obsolete and predate modern compliance documentation standards; verify compliance with your supplier at the time of order.
