EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
MPN: EP1K30TI144-3N ✗ Cuối đờiEP1K30TI144-3N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
Bộ thay thế dễ dàng lắp đặt cho EP1K30TI144-3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K30TI144-3N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K30TI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2NGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-3N Tỷ lệ tối đa & tính chất điện
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| Hộp | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| Kiểu lắp đặt | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
Cấu hình chân EP1K30TI144-3N
| Chân 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| Chân 2 | I/O — User I/O pin 2 |
| Chân 3 | I/O — User I/O pin 3 |
| Chân 4 | I/O — User I/O pin 4 |
| Chân 5 | I/O — User I/O pin 5 |
| Chân 6 | I/O — User I/O pin 6 |
| Chân 7 | I/O — User I/O pin 7 |
| Chân 8 | I/O — User I/O pin 8 |
| Chân 9 | I/O — User I/O pin 9 |
| Chân 10 | I/O — User I/O pin 10 |
| Chân 11 | I/O — User I/O pin 11 |
| Chân 12 | I/O — User I/O pin 12 |
| Chân 13 | I/O — User I/O pin 13 |
| Chân 14 | I/O — User I/O pin 14 |
| Chân 15 | GND — Ground reference |
| Chân 16 | VCCINT — Core 2.5 V supply |
| Chân 17 | I/O — User I/O pin 17 |
| Chân 18 | I/O — User I/O pin 18 |
| Chân 19 | I/O — User I/O pin 19 |
| Chân 20 | I/O — User I/O pin 20 |
| Chân 21 | I/O — User I/O pin 21 |
| Chân 22 | I/O — User I/O pin 22 |
| Chân 23 | I/O — User I/O pin 23 |
| Chân 24 | I/O — User I/O pin 24 |
| Chân 25 | I/O — User I/O pin 25 |
| Chân 26 | I/O — User I/O pin 26 |
| Chân 27 | I/O — User I/O pin 27 |
| Chân 28 | I/O — User I/O pin 28 |
| Chân 29 | I/O — User I/O pin 29 |
| Chân 30 | I/O — User I/O pin 30 |
| Chân 31 | I/O — User I/O pin 31 |
| Chân 32 | I/O — User I/O pin 32 |
| Chân 33 | I/O — User I/O pin 33 |
| Chân 34 | GND — Ground reference |
| Chân 35 | I/O — User I/O pin 35 |
| Chân 36 | I/O — User I/O pin 36 |
| Chân 37 | I/O — User I/O pin 37 |
| Chân 38 | I/O — User I/O pin 38 |
| Chân 39 | I/O — User I/O pin 39 |
| Chân 40 | I/O — User I/O pin 40 |
| Chân 41 | I/O — User I/O pin 41 |
| Chân 42 | I/O — User I/O pin 42 |
| Chân 43 | VCCIO — I/O supply voltage (MultiVolt) |
| Chân 44 | I/O — User I/O pin 44 |
| Chân 45 | I/O — User I/O pin 45 |
| Chân 46 | I/O — User I/O pin 46 |
| Chân 47 | I/O — User I/O pin 47 |
| Chân 48 | I/O — User I/O pin 48 |
| Chân 49 | I/O — User I/O pin 49 |
| Chân 50 | I/O — User I/O pin 50 |
| Chân 51 | I/O — User I/O pin 51 |
| Chân 52 | I/O — User I/O pin 52 |
| Chân 53 | I/O — User I/O pin 53 |
| Chân 54 | I/O — User I/O pin 54 |
| Chân 55 | I/O — User I/O pin 55 |
| Chân 56 | I/O — User I/O pin 56 |
| Chân 57 | I/O — User I/O pin 57 |
| Chân 58 | I/O — User I/O pin 58 |
| Chân 59 | I/O — User I/O pin 59 |
| Chân 60 | I/O — User I/O pin 60 |
| Chân 61 | I/O — User I/O pin 61 |
| Chân 62 | I/O — User I/O pin 62 |
| Chân 63 | I/O — User I/O pin 63 |
| Chân 64 | I/O — User I/O pin 64 |
| Chân 65 | I/O — User I/O pin 65 |
| Chân 66 | I/O — User I/O pin 66 |
| Chân 67 | I/O — User I/O pin 67 |
| Chân 68 | I/O — User I/O pin 68 |
| Chân 69 | I/O — User I/O pin 69 |
| Chân 70 | I/O — User I/O pin 70 |
| Chân 71 | I/O — User I/O pin 71 |
| Chân 72 | I/O — User I/O pin 72 |
| Chân 73 | GND — Ground reference |
| Chân 74 | I/O — User I/O pin 74 |
| Chân 75 | I/O — User I/O pin 75 |
| Chân 76 | I/O — User I/O pin 76 |
| Chân 77 | I/O — User I/O pin 77 |
| Chân 78 | I/O — User I/O pin 78 |
| Chân 79 | I/O — User I/O pin 79 |
| Chân 80 | I/O — User I/O pin 80 |
| Chân 81 | I/O — User I/O pin 81 |
| Chân 82 | I/O — User I/O pin 82 |
| Chân 83 | I/O — User I/O pin 83 |
| Chân 84 | I/O — User I/O pin 84 |
| Chân 85 | I/O — User I/O pin 85 |
| Chân 86 | I/O — User I/O pin 86 |
| Chân 87 | I/O — User I/O pin 87 |
| Chân 88 | I/O — User I/O pin 88 |
| Chân 89 | I/O — User I/O pin 89 |
| Chân 90 | I/O — User I/O pin 90 |
| Chân 91 | I/O — User I/O pin 91 |
| Chân 92 | I/O — User I/O pin 92 |
| Chân 93 | I/O — User I/O pin 93 |
| Chân 94 | I/O — User I/O pin 94 |
| Chân 95 | I/O — User I/O pin 95 |
| Chân 96 | I/O — User I/O pin 96 |
| Chân 97 | I/O — User I/O pin 97 |
| Chân 98 | I/O — User I/O pin 98 |
| Chân 99 | I/O — User I/O pin 99 |
| Chân 100 | I/O — User I/O pin 100 |
| Chân 101 | I/O — User I/O pin 101 |
| Chân 102 | I/O — User I/O pin 102 |
| Chân 103 | DCLK — Dedicated configuration clock input |
| Chân 104 | DATA0 — Configuration data input (passive serial) |
| Chân 105 | nCONFIG — Configuration control (active-low reset) |
| Chân 106 | nSTATUS — Configuration status (active-low) |
| Chân 107 | CONF_DONE — Configuration complete (open-drain) |
| Chân 108 | TDI — JTAG Test Data In |
| Chân 109 | TDO — JTAG Test Data Out |
| Chân 110 | TMS — JTAG Test Mode Select |
| Chân 111 | TCK — JTAG Test Clock |
| Chân 112 | DEV_CLRn — Device clear (optional, may be unused) |
| Chân 113 | DEV_OE — Device output enable (optional) |
| Chân 114 | CLK0 — Dedicated clock input 0 / global |
| Chân 115 | CLK1 — Dedicated clock input 1 / global |
| Chân 116 | CLK2 — Dedicated clock input 2 / global |
| Chân 117 | GND — Ground reference |
| Chân 118 | VCCINT — Core 2.5 V supply |
| Chân 119 | CLK3 — Dedicated clock input 3 / global |
| Chân 120 | I/O — User I/O pin 120 |
| Chân 121 | I/O — User I/O pin 121 |
| Chân 122 | I/O — User I/O pin 122 |
| Chân 123 | I/O — User I/O pin 123 |
| Chân 124 | I/O — User I/O pin 124 |
| Chân 125 | I/O — User I/O pin 125 |
| Chân 126 | I/O — User I/O pin 126 |
| Chân 127 | I/O — User I/O pin 127 |
| Chân 128 | I/O — User I/O pin 128 |
| Chân 129 | I/O — User I/O pin 129 |
| Chân 130 | I/O — User I/O pin 130 |
| Chân 131 | I/O — User I/O pin 131 |
| Chân 132 | I/O — User I/O pin 132 |
| Chân 133 | I/O — User I/O pin 133 |
| Chân 134 | I/O — User I/O pin 134 |
| Chân 135 | I/O — User I/O pin 135 |
| Chân 136 | I/O — User I/O pin 136 |
| Chân 137 | I/O — User I/O pin 137 |
| Chân 138 | I/O — User I/O pin 138 |
| Chân 139 | I/O — User I/O pin 139 |
| Chân 140 | I/O — User I/O pin 140 |
| Chân 141 | I/O — User I/O pin 141 |
| Chân 142 | I/O — User I/O pin 142 |
| Chân 143 | I/O — User I/O pin 143 |
| Chân 144 | I/O — User I/O pin 144 |
Ứng dụng tiêu biểu
EP1K30TI144-3N phù hợp cho 6 Áp dụngs: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
Được đề xuất
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
Được đề xuất
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
Được đề xuất
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
Được đề xuất
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
Được đề xuất
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K30TI144-3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Highest speed grade in the EP1K30 family (vsEP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (vsEP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (vsEP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (vsEP1K10TI144-2N (smaller family member))
Ghi chú thiết kế
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
Thông tin tuân thủ
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
