EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
MPN: EPF8452ATC100-3 ✗ Cuối đờiEPF8452ATC100-3 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
Bộ thay thế dễ dàng lắp đặt cho EPF8452ATC100-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF8452ATC100-3 (cùng hình factor và footprint) — khác nhau ở Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
EPF8452ATC100-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8282ATC100-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF6016ATC100-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8452AQC160-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF6024ATC100-10
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8452ATC100-3 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| Điện áp cung cấp | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Hộp | 100-pin TQFP (14x14 mm) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
Cấu hình chân EPF8452ATC100-3
| Chân 1 | I/O — User I/O bank 1 |
| Chân 2 | I/O — User I/O bank 1 |
| Chân 3 | I/O — User I/O bank 1 |
| Chân 4 | I/O — User I/O bank 1 |
| Chân 5 | I/O — User I/O bank 1 |
| Chân 6 | I/O — User I/O bank 1 |
| Chân 7 | VCCINT — Internal core supply (5 V) |
| Chân 8 | I/O — User I/O bank 1 |
| Chân 9 | I/O — User I/O bank 1 |
| Chân 10 | I/O — User I/O bank 1 |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O bank 1 |
| Chân 13 | I/O — User I/O bank 1 |
| Chân 14 | nSTATUS — Configuration status (open-drain) |
| Chân 15 | I/O — User I/O bank 2 |
| Chân 16 | I/O — User I/O bank 2 |
| Chân 17 | I/O — User I/O bank 2 |
| Chân 18 | I/O — User I/O bank 2 |
| Chân 19 | I/O — User I/O bank 2 |
| Chân 20 | I/O — User I/O bank 2 |
| Chân 21 | I/O — User I/O bank 2 |
| Chân 22 | GND — Ground |
| Chân 23 | VCCIO — I/O bank supply (5 V) |
| Chân 24 | I/O — User I/O bank 2 |
| Chân 25 | I/O — User I/O bank 2 |
| Chân 26 | I/O — User I/O bank 2 |
| Chân 27 | I/O — User I/O bank 2 |
| Chân 28 | CONF_DONE — Configuration complete (open-drain) |
| Chân 29 | I/O — User I/O bank 3 |
| Chân 30 | I/O — User I/O bank 3 |
| Chân 31 | I/O — User I/O bank 3 |
| Chân 32 | I/O — User I/O bank 3 |
| Chân 33 | I/O — User I/O bank 3 |
| Chân 34 | I/O — User I/O bank 3 |
| Chân 35 | GND — Ground |
| Chân 36 | VCCINT — Internal core supply (5 V) |
| Chân 37 | I/O — User I/O bank 3 |
| Chân 38 | I/O — User I/O bank 3 |
| Chân 39 | I/O — User I/O bank 3 |
| Chân 40 | nCONFIG — Configuration control (active-low) |
| Chân 41 | I/O — User I/O bank 4 |
| Chân 42 | I/O — User I/O bank 4 |
| Chân 43 | I/O — User I/O bank 4 |
| Chân 44 | I/O — User I/O bank 4 |
| Chân 45 | I/O — User I/O bank 4 |
| Chân 46 | I/O — User I/O bank 4 |
| Chân 47 | I/O — User I/O bank 4 |
| Chân 48 | GND — Ground |
| Chân 49 | VCCIO — I/O bank supply (5 V) |
| Chân 50 | I/O — User I/O bank 4 |
| Chân 51 | I/O — User I/O bank 4 |
| Chân 52 | I/O — User I/O bank 4 |
| Chân 53 | I/O — User I/O bank 4 |
| Chân 54 | I/O — User I/O bank 4 |
| Chân 55 | CLK0 — Global clock input 0 |
| Chân 56 | I/O — User I/O bank 5 |
| Chân 57 | I/O — User I/O bank 5 |
| Chân 58 | I/O — User I/O bank 5 |
| Chân 59 | I/O — User I/O bank 5 |
| Chân 60 | I/O — User I/O bank 5 |
| Chân 61 | I/O — User I/O bank 5 |
| Chân 62 | I/O — User I/O bank 5 |
| Chân 63 | GND — Ground |
| Chân 64 | VCCINT — Internal core supply (5 V) |
| Chân 65 | I/O — User I/O bank 5 |
| Chân 66 | I/O — User I/O bank 5 |
| Chân 67 | I/O — User I/O bank 5 |
| Chân 68 | MSEL0 — Configuration mode select 0 |
| Chân 69 | I/O — User I/O bank 6 |
| Chân 70 | I/O — User I/O bank 6 |
| Chân 71 | I/O — User I/O bank 6 |
| Chân 72 | I/O — User I/O bank 6 |
| Chân 73 | I/O — User I/O bank 6 |
| Chân 74 | I/O — User I/O bank 6 |
| Chân 75 | I/O — User I/O bank 6 |
| Chân 76 | GND — Ground |
| Chân 77 | VCCIO — I/O bank supply (5 V) |
| Chân 78 | I/O — User I/O bank 6 |
| Chân 79 | I/O — User I/O bank 6 |
| Chân 80 | I/O — User I/O bank 6 |
| Chân 81 | MSEL1 — Configuration mode select 1 |
| Chân 82 | I/O — User I/O bank 7 |
| Chân 83 | TDI — JTAG test data in |
| Chân 84 | TRST — JTAG test reset (active-low) |
| Chân 85 | TCK — JTAG test clock |
| Chân 86 | TMS — JTAG test mode select |
| Chân 87 | I/O — User I/O bank 7 |
| Chân 88 | I/O — User I/O bank 7 |
| Chân 89 | GND — Ground |
| Chân 90 | VCCINT — Internal core supply (5 V) |
| Chân 91 | I/O — User I/O bank 7 |
| Chân 92 | I/O — User I/O bank 7 |
| Chân 93 | I/O — User I/O bank 7 |
| Chân 94 | DATA0 — Configuration data input 0 |
| Chân 95 | I/O — User I/O bank 8 |
| Chân 96 | I/O — User I/O bank 8 |
| Chân 97 | I/O — User I/O bank 8 |
| Chân 98 | I/O — User I/O bank 8 |
| Chân 99 | CLK1 — Global clock input 1 |
| Chân 100 | TDO — JTAG test data out |
Ứng dụng tiêu biểu
EPF8452ATC100-3 phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
Được đề xuất
Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
Được đề xuất
Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
Được đề xuất
ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
Được đề xuất
Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
Được đề xuất
Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF8452ATC100-3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Highest-density FLEX 8000 device in TQFP-100 footprint (vsEPF8282ATC100-3)
- 5 V native supply without level shifting (vsEPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (vsEPF8452ATC100-3N)
Ghi chú thiết kế
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
Thông tin tuân thủ
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.