EP3SE260F1517C4N vs EP3SE260F1517I3 比較
詳細並排比較 EP3SE260F1517C4N 由 Intel 與 EP3SE260F1517I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517C4N | EP3SE260F1517I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Stratix® III E | — |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | 976 |
| 封裝 | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0°C to 85°C | — |
| Core Voltage | 0.9 V | 1.0 V typical |
| Process Node | 65 nm | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Operating Temperature Grade | — | Industrial |
| Junction Temperature Range | — | -40C to +125C |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |