EP3SE260H780C4L vs EP3SE260H780C3 比較

詳細並排比較 EP3SE260H780C4L 由 Intel 與 EP3SE260H780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260H780C4L EP3SE260H780C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix III E —
Logic Elements 255,000 255,000
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) —
User I/O Count 488 —
封裝 780-ball FCBGA (HBGA 33x33 mm) 780-ball FCBGA (HBGA), flip-chip
Speed Grade C4 (middle/slow tier) C3
Core Voltage 0.9 V (nominal) —
工作接面溫度 0C to +85C (commercial) —
安裝類型 Surface Mount (flip-chip BGA) Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant (lead-free per datasheet) Compliant (per product listings)
Transceivers Up to 24 multi-gigabit transceivers —
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Device Family — Stratix III Enhanced (Stratix III E)
Series — EP3SE
Logic Array Blocks (LABs) — 10200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
User I/Os — 488
Operating Voltage (Core) — 0.9 V
Operating Voltage (Auxiliary) — 1.1 V
Process Technology — 65 nm CMOS
工作溫度 — Commercial, 0C to +85C
Maximum Core Frequency — 500 MHz
濕度敏感等級 (MSL) — 3 (168 hours)
Packaging Type — Tray
Configuration Memory Support — Fast passive parallel, JTAG, Active Serial

資料表與資源

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