H5AN4G6NBJR-UHC vs H5AN4G6NBJR-VKC 比較

詳細並排比較 H5AN4G6NBJR-UHC 由 SK hynix 與 H5AN4G6NBJR-VKC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN4G6NBJR-UHC H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC ✓ 啟用中
SK hynix
H5AN4G6NBJR-VKC H5AN4G6NBJR-VKC - 4Gb DDR4 SDRAM 2666Mbps x16 | SK Hynix

H5AN4G6NBJR-VKC - 4Gb DDR4 SDRAM 2666Mbps x16 | SK Hynix

H5AN4G6NBJR-VKC ✓ 啟用中

規格比較

參數 H5AN4G6NBJR-UHC H5AN4G6NBJR-VKC
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
記憶體容量 4 Gbit 4 Gbit
組織 256M x 16 —
Clock Frequency 1.6 GHz 1.6 GHz (internal reference per distributor data)
Supply Voltage (VDD) 1.14 V to 1.26 V 1.2 V nominal (1.14 V to 1.26 V)
Technology CMOS CMOS
工作溫度 -40C to +95C -40C to +95C
封裝 FBGA-96 (PBGA-96) FBGA-96 / TFBGA (PBGA96)
安裝類型 Surface Mount Surface Mount
Self Refresh Auto self-refresh —
Data Mask Function Yes (DM) —
Asynchronous Reset Yes (RESET_n) —
On-Die Termination Dynamic ODT —
ZQ Calibration Yes —
Write Leveling Yes —
CRC Function Yes (command/address CRC) —
RoHS 狀態 Compliant Compliant
Memory Organization — 256M x 16
資料速率 — 2666 Mbps
Operating Current — 38 mA (typical, per distributor data)
介面 — Parallel
Body Size — 13 mm, 1.2 mm profile, 0.8 mm ball pitch
Termination — Dynamic on-chip termination (ODT)
Calibration — ZQ calibration; write leveling
Protection Functions — Asynchronous reset; CRC; data mask
Refresh — Auto self-refresh
Packaging — Tray

資料表與資源

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