K4A4G085WD vs K4A4G085WG-BCWE 比較
詳細並排比較 K4A4G085WD 由 Samsung Electronics 與 K4A4G085WG-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A4G085WD | K4A4G085WG-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | $2.05 | — |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM (Volatile) |
| Die Generation | D-die | — |
| Density | 4 Gb | — |
| 組織 | 512M x 8 | — |
| 資料速率 | Up to 2400 Mbps (speed-grade dependent) | 3200 Mbps/pin |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| 封裝 | 78-ball FBGA | FBGA-78 (BCW) |
| 安裝類型 | Surface Mount | Surface Mount |
| Speed Grade (example) | -BCPB (DDR4-2400), -BCRC | — |
| 介面類型 | DDR4 (double data rate, source-synchronous) | — |
| Bank Group Architecture | Yes (DDR4 bank groups) | — |
| ODT | On-Die Termination (built-in) | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| CAS Latency (typical) | [DATA_NEEDED: CL per speed grade] | — |
| Refresh | [DATA_NEEDED: refresh interval] | [DATA_NEEDED: refresh rate specification] |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| 記憶體容量 | — | 4 Gb |
| Memory Organization | — | 512M x 8 |
| Speed Class | — | DDR4-3200 |
| Technology | — | D-die DDR4 |
| 介面 | — | Parallel (DDR4) |
| Burst Length | — | BL8 |
| DLL Mode | — | DLL Enabled (per datasheet timing) |
| Packaging | — | Tray |