K4B4G1646E-BMK0 vs H5TC4G63AFR-PBA 比較
詳細並排比較 K4B4G1646E-BMK0 由 Samsung Electronics 與 H5TC4G63AFR-PBA 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4B4G1646E-BMK0 | H5TC4G63AFR-PBA |
|---|---|---|
| 品牌 | Samsung Electronics | SK hynix |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | — | $3.98 |
| Density | 4 Gb | 4Gb |
| 組織 | 256M x 16 | 256M x 16 |
| Speed Grade | 1600 Mbps | — |
| Voltage | 1.35 V | — |
| 工作溫度 | -40°C to +95°C | — |
| 封裝 | 96-FBGA | 96-ball FBGA |
| 介面 | Parallel | 16-bit I/O |
| Clock Frequency | 800 MHz | — |
| 資料速率 | 1600 Mbps | 1866 Mbps (PC3L-14900) |
| 記憶體類型 | DDR3L SDRAM | DDR3L SDRAM |
| 安裝類型 | Surface Mount | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| ZQ Calibration | Yes | Yes |
| Dynamic ODT | Yes | — |
| Data Mask | Yes | — |
| Supply Voltage (VDD/VDDQ) | — | 1.35V |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| Burst Length | — | 8 and 4 (with burst chop) |
| CAS Latency (CL) | — | 11, 12, 13 |
| 工作溫度範圍 | — | 0°C to +95°C (Tcase) |
| On-Die Termination (ODT) | — | Yes |
| Write Leveling | — | Yes |
| Auto Self-Refresh | — | Yes |
| Partial Array Self-Refresh | — | Yes |
| RoHS | — | Compliant |