K4RAH086VE-BCWM vs K4RBH086VB-BCQK 比較

詳細並排比較 K4RAH086VE-BCWM 由 Samsung Electronics 與 K4RBH086VB-BCQK 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4RAH086VE-BCWM K4RAH086VE-BCWM - DDR5 16Gb 5600Mbps DRAM | Samsung Electronics

K4RAH086VE-BCWM - DDR5 16Gb 5600Mbps DRAM | Samsung Electronics

K4RAH086VE-BCWM ✓ 啟用中
Samsung Electronics
K4RBH086VB-BCQK K4RBH086VB-BCQK - DDR5 16Gb 4800Mbps DRAM | Samsung

K4RBH086VB-BCQK - DDR5 16Gb 4800Mbps DRAM | Samsung

K4RBH086VB-BCQK ✓ 啟用中

規格比較

參數 K4RAH086VE-BCWM K4RBH086VB-BCQK
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
庫存狀態 In Stock —
單價 (USD) $7.60 —
記憶體類型 DDR5 SDRAM DDR5 SDRAM
Density 16 Gb 16 Gb
組織 2G x 8 2G x 8
資料速率 5600 Mbps 4800 Mbps
Supply Voltage (VDD) 1.1 V 1.1 V
封裝 82-ball FBGA FBGA-82
安裝類型 Surface Mount Surface Mount
工作溫度 0C to +85C [DATA_NEEDED: operating temperature range]
Generation DDR5 —
Bank Groups [DATA_NEEDED: bank group count] —
CAS 延遲 [DATA_NEEDED: CL at 5600 Mbps] —
VDDQ Voltage [DATA_NEEDED: VDDQ value] —
Refresh [DATA_NEEDED: refresh rate] [DATA_NEEDED: refresh rate 32ms/64ms]
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
生命週期狀態 Mass Production —
Manufacturer Samsung Electronics —
介面 — DDR5 (CA bus, ODECC)
On-die ECC — Yes
CAS Latency (CL) — [DATA_NEEDED: CAS latency at 4800 Mbps]
Power Supply Rails — VDD/VDDQ 1.1 V (PMIC on module)
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]
Packaging — [DATA_NEEDED: tray or tape and reel standard quantity]

資料表與資源

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