K4S561633FZN75 vs K4S561633F-ZL75 比較

詳細並排比較 K4S561633FZN75 由 Samsung Electronics 與 K4S561633F-ZL75 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4S561633F-ZL75 K4S561633F-ZL75 - 256Mb Mobile SDRAM, 4x16Mx16, 133MHz, 54-BGA

K4S561633F-ZL75 - 256Mb Mobile SDRAM, 4x16Mx16, 133MHz, 54-BGA

K4S561633F-ZL75 Nrnd

規格比較

參數 K4S561633FZN75 K4S561633F-ZL75
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 NRND NRND
記憶體類型 Mobile SDRAM (Synchronous DRAM) Synchronous DRAM (Mobile SDRAM)
Density 256 Mbit (268,435,456 bits) 256 Mbit (268,435,456 bits)
組織 4 banks x 4,196,304 words x 16 bits 4 banks x 4,196,304 words x 16 bits (4M x 16 x 4 banks)
Clock Frequency 133 MHz —
資料速率 PC133 (SDRAM) —
Supply Voltage (VDD/VDDQ) 3.0 V (typ); 2.7 V-3.3 V range —
介面 LVCMOS —
CAS 延遲 Programmable, 2 or 3 Programmable, 2 or 3
Burst Length 1, 2, 4, 8, full page (programmable) 1, 2, 4, 8, Full Page
封裝 54-ball FBGA (54BOC) 54-ball FBGA (54-BOC) / TFBGA
工作溫度 Commercial grade (per -ZN75 suffix) [DATA_NEEDED: operating temperature grade]
Process Technology Samsung high-performance CMOS —
Refresh Auto-Refresh and Self-Refresh —
Power Modes Power-Down mode, Partial Array Self-Refresh (PASR) —
Lead-Free / RoHS Pb-free (lead-free) - per '-ZN' suffix —
Bank Architecture 4 internal banks —
Row Address A0-A12 (13-bit) —
Data Width x16 (DQ0-DQ15) —
Operating Frequency (max) — 133 MHz
Clock Access Time — 5.4 ns
Speed Grade — ZL75 (7.5 ns / CAS Latency 3, 133 MHz)
Supply Voltage (VDD) — 3.3 V
I/O Standard — LVCMOS-compatible
Number of Banks — 4
Burst Type — Sequential or Interleave
安裝類型 — Surface Mount
RoHS / Lead-Free — Pb-Free (per -L75 suffix)

資料表與資源

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