W25H02JVTBIM vs MT25QL02GCBB8E12-0AUT 比較
詳細並排比較 W25H02JVTBIM 由 Winbond 與 MT25QL02GCBB8E12-0AUT 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Micron Technology
MT25QL02GCBB8E12-0AUT - 2Gbit SPI NOR Flash 133MHz | Micron
MT25QL02GCBB8E12-0AUT ✓ 啟用中規格比較
| 參數 | W25H02JVTBIM | MT25QL02GCBB8E12-0AUT |
|---|---|---|
| 品牌 | Winbond | Micron Technology |
| 類別 | Memory ICs | Flash |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Density | 2 Gbit (256M x 8) | — |
| 記憶體類型 | Serial NOR Flash | NOR Flash, Serial (SPI) |
| 介面 | SPI / Dual SPI / Quad SPI / QPI / DTR | SPI, Dual SPI, Quad I/O |
| Maximum Clock Rate | 133 MHz | — |
| Equivalent Throughput (Quad DTR) | 416 MHz (50 MB/s) | — |
| Access Time | 7.5 ns | — |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | — |
| Sector Size | 4 KB uniform | — |
| Block Size | 32 KB and 64 KB | — |
| Program/Erase Endurance | 100,000 cycles per sector | — |
| Data Retention | 20 years | — |
| 封裝 | 24-ball TFBGA (8x6 mm) | 24-T-PBGA (6x8 mm) |
| 工作溫度 | -40C to +85C | -40C to +125C |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| 無鹵素 | Yes | — |
| JEDEC Manufacturer ID | 0xEF (Winbond) | — |
| Memory Capacity | — | 2 Gbit (256 MB) |
| 組織 | — | 256M x 8 |
| 最大時脈頻率 | — | 133 MHz |
| 供應電壓 | — | 2.7 V to 3.6 V |
| Programming Voltage | — | 3 V |
| Endurance | — | 100000 write/erase cycles |
| Qualification | — | AEC-Q100 (automotive) |
| 功能特色 | — | XIP, write enable latch, power-on reset, hardware/software write protection, absolute write protection, extended address access |
| Marking Code | — | RW340 |
| Supply Voltage Class | — | 3 V (MT25QL series) |
| Access Protocol Support | — | Standard/Dual-Output/Dual-I/O/Quad-Output/Quad-I/O SPI |