10AS066H4F34I3SG - 660K LE Arria 10 SX SoC FPGA | Intel
MPN： 10AS066H4F34I3SG ✓ 啟用中10AS066H4F34I3SG 概覽
A System on Chip (SoC) FPGA is a single silicon device that merges a programmable logic fabric with one or more hard processor cores, high-speed peripherals, and memory controllers. Within the broader taxonomy, this part sits in the chain SoC FPGA -> FPGA -> Programmable Logic Device (PLD) -> Integrated Circuit. The SoC architecture removes the need for a separate processor chip on the PCB, lowering BOM cost, shrinking board area, and reducing inter-chip latency while retaining full FPGA programmability.
The 10AS066H4F34I3SG delivers 660K logic elements, embedded hardened memory controllers, 28 nm transceivers, fractional PLLs, and PCIe Gen2/Gen3-capable hardened IP blocks. Its hard ARM Cortex-A9 dual-core subsystem supports symmetric multiprocessing with NEON SIMD media engine, ECC L1/L2 caches, and an integrated CoreSight debug and trace fabric. The integrated HPS exposes EMAC, USB 2.0 OTG, NAND/NOR flash controllers, and DDR3/4 memory interfaces with hardware ECC for reliability.
In system architecture the 10AS066H4F34I3SG is typically paired with external DDR3/DDR4 SDRAM, eMMC or NAND boot flash, and high-speed serial links to ASICs, FPGAs, or backplane transceivers. The 1152-FCBGA package enables the highest-pin-count configurations of the Arria 10 SX family, supporting up to 492 user I/Os at the I/O bank limit and multiple 10 Gbps transceiver channels routed from the FPGA side. The Arria 10 architecture is widely deployed in mid-range communications, video broadcast, industrial imaging, and defense applications.
Typical applications include 4K video processing pipelines, 10G/40G Ethernet aggregation, baseband DSP for wireless backhaul, industrial machine vision, and SoC-based control plane processors. The combination of hardened ARM cores and high-density FPGA fabric makes the part a strong fit when deterministic hardware acceleration must coexist with a Linux-class application processor.
When designing with this device, provide at least 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, follow the Intel Arria 10 pin connection guidelines, and use the Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. The 35 x 35 mm FCBGA requires ENIG surface finish, microvia or HDI PCB stack-up, and a high-current multi-rail power distribution network.
This page synthesizes distributor pricing, drop-in same-family variants, and design considerations that go beyond what a single manufacturer datasheet delivers, helping sourcing engineers and PCB designers compare options without manually cross-checking every part number.
直接替換替代品，適用於 10AS066H4F34I3SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS066H4F34I3SG （相同外形與佔位） — 差異在於 Package, Mounting Type, Operating Temperature, Logic Elements, Process Technology.
10AS066H4F34I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H4F34E3SG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H4F34E3LG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H4F34I4SGES
✅ 直接替換📋 參考替代品（不在目錄中）
10AS066H3F34I2SG
✅ 直接替換聯絡詢價
查看資料表 →XC7Z100-2FFG1156
✅ 直接替換📋 參考替代品（不在目錄中）
10AS066H4F34I3SG 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor System Clock | 1.5 GHz |
| 封裝 | 1152-ball FCBGA (35 mm x 35 mm) |
| User I/Os | 492 |
| 工作溫度 | Industrial (-40 C to +100 C) |
| 安裝類型 | Surface Mount |
| Device Family Tier | H4 (high-performance, mid-density, enhanced DSP and transceiver) |
| Hard Memory Controllers | Yes (DDR3/DDR4 with ECC) |
| Transceivers | 28 nm multi-gigabit transceivers |
| Design Tool | Intel Quartus Prime |
| RoHS | Compliant |
10AS066H4F34I3SG 1152-ball fcbga (35 mm x 35 mm) 腳位配置指南
10AS066H4F34I3SG（1152-ball fcbga (35 mm x 35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS066H4F34I3SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS066H4F34I3SG 適用於 6 應用s: 4K Video Processing and Broadcast, Wireless Baseband and Backhaul, Industrial Machine Vision, Defense and Avionics Signal Processing, Medical Imaging and Diagnostics, High-Performance Computing Acceleration.
4K Video Processing and Broadcast
The 10AS066H4F34I3SG is well suited to 4K video broadcast pipelines because its 660,000 logic elements and hardened DSP blocks can absorb real-time HEVC/H.264 encode-decode, color space conversion, frame-rate conversion, and deinterlacing workloads. The integrated dual-core ARM Cortex-A9 hard processor system at 1.5 GHz handles transport stream muxing, encryption, and ancillary data processing without burdening the FPGA fabric. The 1152-FCBGA package exposes up to 492 user I/Os and multiple multi-gigabit transceivers, enabling direct interfacing to SDI, HDMI, and 10G Ethernet reference designs. Compared with discrete FPGA + ASSP solutions, the SoC integration reduces board area and inter-chip latency.
推薦
Wireless Baseband and Backhaul
The 10AS066H4F34I3SG targets wireless baseband and backhaul designs where the FPGA fabric accelerates FFT/iFFT, channel coding, and crest-factor reduction while the dual ARM Cortex-A9 MPCore runs MAC/PHY scheduling and Linux networking stacks. The 20 nm process and 28 nm transceivers deliver the timing margin required for CPRI/OBSAI fronthaul and 10G/40G Ethernet aggregation. Industrial temperature grade enables deployment in outdoor and sealed enclosures used by mobile network operators. The SoC architecture reduces system bill of materials by combining a control-plane processor and high-throughput DSP accelerator into a single 1152-FCBGA package.
推薦
Industrial Machine Vision
The 10AS066H4F34I3SG is a good fit for industrial machine vision systems that combine high-speed image preprocessing with a Linux-class control plane. The FPGA fabric implements Bayer demosaicing, lens distortion correction, and real-time defect detection at line-scan or area-scan sensor rates, while the hard ARM Cortex-A9 subsystem runs the vision application stack over CoaXPress, Camera Link, or GigE Vision interfaces. The 492 user I/Os allow direct connection to multiple parallel image sensors and motor-control feedback paths. Industrial temperature grade (-40 C to +100 C) and long-life Intel Altera support make this part appropriate for factory-floor deployments.
推薦
Defense and Avionics Signal Processing
The 10AS066H4F34I3SG's 660K logic elements and hardened DSP blocks support radar, electronic-warfare, and signal-intelligence front-end processing where deterministic latency and high throughput are mandatory. The integrated ARM Cortex-A9 subsystem handles control-plane command parsing, health monitoring, and secure boot, while the FPGA fabric implements matched filters, beamforming, and pulse compression. The Arria 10 SX family supports anti-tamper and design-security features that defense integrators require. Operating from -40 C to +100 C industrial temperature, this part meets typical avionic environmental requirements when paired with a thermally engineered enclosure.
推薦
Medical Imaging and Diagnostics
The 10AS066H4F34I3SG fits medical imaging applications such as ultrasound beamforming, CT reconstruction back-ends, and digital X-ray pre-processors. Its 660K logic elements and DSP blocks implement parallel beamforming and filter-back-projection pipelines at clinical frame rates, while the hard ARM Cortex-A9 double-precision floating-point capable cores run image reconstruction, DICOM stack, and user interfaces. The SoC FPGA reduces the bill of materials compared to a discrete FPGA + external processor approach, important for medical device miniaturization. Industrial temperature grade and lead-free packaging satisfy regulatory requirements for medical equipment.
推薦
High-Performance Computing Acceleration
The 10AS066H4F34I3SG serves as a co-processor for high-performance compute appliances where PCIe Gen2/Gen3 connectivity and high-density FPGA acceleration are required. The dual-core ARM Cortex-A9 controls DMA, command queuing, and host communication via PCIe, while the FPGA fabric implements custom compute kernels such as financial Monte Carlo simulations, genomic alignment, or scientific FFTs. The 1152-FCBGA package enables routing of multi-gigabit transceivers for low-latency inter-card links inside accelerator chassis. The industrial operating temperature allows deployment in space-constrained edge-compute cabinets.
推薦
推薦產品摘要
工程參考資料，適用於 10AS066H4F34I3SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS066H4F34I3LG | 10AS066H4F34E3SG | 10AS066H4F34E3LG | 10AS066H4F34I4SGES | 10AS066H3F34I2SG | XC7Z100-2FFG1156 |
|---|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1156-FCBGA (35x35 class) - close but ball map differs |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 444,000 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 28 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 1.0 V |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | ~1 GHz |
| Speed / Temperature Grade | I3 (industrial) | I3L (industrial, lower power) | E3 (extended) | E3L (extended, lower power) | I4 (industrial, faster, ES) | I2 (industrial, slower) | Speed grade -2 industrial |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 362 |
主要差異化特點
- Highest-density Arria 10 SX with I3 speed grade in this footprint (對比10AS066H3F34I2SG)
- Integrated dual-core ARM Cortex-A9 hard processor system (對比XC7Z100-2FFG1156)
- RoHS-compliant industrial temperature grade F34 package (對比10AS066H4F34I4SGES)
設計說明
The 10AS066H4F34I3SG requires at least five separate supply rails: 0.9 V core (VCC, VCCP), 1.8 V/2.5 V/3.3 V auxiliary (VCCIO), dedicated transceiver supply (VCCR/VCCT), and a 1.8 V/3.3 V HPS supply. Estimated: with all logic and transceivers active, total board-level power can reach 20-25 W; the VCC core rail alone can demand 15 A under full utilization. Use a multi-phase controller with output inductors selected to keep ripple under 2% of the rail, and place decoupling capacitors as close as possible to the package balls.
The 1152-FCBGA package requires an HDI PCB stack-up with microvias to escape the 0.8 mm or 1.0 mm ball pitch. Designers should target at least 8-12 layers, an ENIG surface finish, and matched-length impedance-controlled traces for the multi-gigabit transceivers. The thermal pad (if present) must be soldered to the PCB using a via-array thermal relief pattern to ensure proper heat extraction from the high-density FPGA fabric.
Always configure unused transceiver channels per the Intel Arria 10 SX pin connection guidelines - floating or improperly terminated transceiver pins cause additional current draw and may corrupt adjacent channels. Decoupling caps must follow the reference design exactly; do not substitute non-recommended capacitors because the FPGA's power supply rejection is sensitive to ESR/ESL values.
Do not assume the HPS bootloader works without a properly programmed QSPI flash - the 10AS066H4F34I3SG expects a valid boot ROM image at POR. Engineers new to the Arria 10 SX often forget that the HPS and FPGA configuration bitstreams are stored separately; plan for both a golden image and a user image in flash to support fail-safe firmware updates.
合規資訊
RoHS-compliant per the manufacturer product page. Industrial temperature grade is for -40 C to +100 C junction. AEC-Q100 is not applicable (FPGA, not an automotive discrete).
