5CGXBC7D7F31C8N - Cyclone V GX FPGA, 149.5K LE, 896-FBGA | Intel
MPN： 5CGXBC7D7F31C8N ✓ 啟用中5CGXBC7D7F31C8N 概覽
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), distinct from fixed-function ASICs by their post-fabrication flexibility and from microcontroller units (MCUs) by their parallel, hardware-timed execution model. Within Intel's portfolio, the Cyclone V family is positioned as the low-power, cost-optimized series for high-volume applications such as industrial motor control, video bridging, and machine-to-machine connectivity.
Key features include 149,500 logic elements (LEs), 7,880,704 embedded memory bits (approximately 963 Kbits of M10K plus 1.46 Mbits of MLAB), 312 DSP blocks of 18x18 multipliers, nine full-duplex 3.125 Gbps transceivers, two hard PCI Express Gen2 x1/x2/x4 endpoints, and eight PLLs. The 5CGXBC7D7F31C8N speed grade 8 (commercial, -8C) variant supports core VCC of 1.1 V with hot-socketing capability and configuration via passive serial, fast passive parallel, JTAG, or encrypted bitstream using AES-256.
The Cyclone V GX architecture combines a fabric of adaptive logic modules (ALMs), dedicated block RAM, DSP slices, and hard IP for PCIe, memory controllers, and high-speed serial I/O. This heterogeneous structure lets designers implement protocol bridging, signal processing, and control logic in a single device without consuming fabric resources for functions that are hardened in silicon.
Typical applications include industrial Ethernet switching and fieldbus gateways, video broadcast and surveillance processing, PCIe endpoint cards, motor drive control loops, and low-cost wireless baseband preprocessing. The transceiver-rich 5CGXC7 die (F31 package, 31 mm × 31 mm body, 1.0 mm pitch) targets designs that previously required a more expensive Arria or Stratix device.
When designing with this part, plan power-rail sequencing for 1.1 V core, 2.5 V/3.3 V auxiliary, and 1.5 V transceiver supplies, and respect the 896-ball BGA layout with 4 or 6 PCB layers and microvia stackups. Quartus II / Quartus Prime software with device support file 5CGXFC7D6 is required for synthesis, place-and-route, and bitstream generation.
This page combines drop-in same-family alternatives, parameter-by-parameter comparison, and practical PCB design notes that complement, rather than duplicate, the device datasheet and ordering information.
直接替換替代品，適用於 5CGXBC7D7F31C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 5CGXBC7D7F31C8N （相同外形與佔位） — 差異在於 Package, Transceivers, Family, PLLs, Operating Temperature.
5CGXBC7D6F31C7N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7D7F27C8N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7D6F27C7N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7C7U19C8N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7C7F23C8N
✅ 直接替換聯絡詢價
查看資料表 →5CGTFD9A5U19A7N
✅ 直接替換聯絡詢價
查看資料表 →5CGXBC7D7F31C8N 最大額定值與電氣特性
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory (bits) | 7,880,704 |
| User I/O Pins | 480 |
| DSP Blocks (18x18) | 312 |
| Transceivers | 9 (up to 3.125 Gbps) |
| PCIe Hard IP | 2 × Gen2 endpoints |
| PLLs | 8 |
| 封裝 | 896-ball FBGA, F31 (31 × 31 mm, 1.0 mm pitch) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| Speed Grade | 8 (commercial) |
| 工作溫度 | 0 °C to +85 °C (commercial) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, JTAG, AES-256 encrypted |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
5CGXBC7D7F31C8N 896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch) 腳位配置指南
5CGXBC7D7F31C8N（896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 5CGXBC7D7F31C8N.
請參閱 資料表 以查看完整腳位配置。
典型應用
5CGXBC7D7F31C8N 適用於 6 應用s: Industrial Ethernet Switch and Gateway, PCIe Endpoint Card for Industrial PCs, Motor Drive and Servo Control, Video Broadcast and Surveillance Processing, Wireless Baseband Preprocessing, Test and Measurement Instrumentation.
Industrial Ethernet Switch and Gateway
The Intel 5CGXBC7D7F31C8N is well suited for industrial Ethernet switches, Profinet IRT gateways, and EtherCAT slave controllers because it integrates 9 full-duplex transceivers operating up to 3.125 Gbps and 312 DSP blocks of 18×18 multipliers. The device supports SGMII, GbE, and 1000BASE-X PHYs through its hardened PCS and PMA, allowing direct connection to standard industrial PHY chips without external serializer/deserializer devices. Its 1.1 V core voltage and low static power simplify thermal design in DIN-rail enclosures, while the dual PCIe Gen2 endpoints enable host-side integration in modular PLC backplanes. A typical design uses the FPGA as a cut-through switch with hardware-accelerated priority queueing and time-sensitive networking (TSN) scheduling.
推薦
PCIe Endpoint Card for Industrial PCs
With two hard PCIe Gen2 endpoints and 9 transceivers, the 5CGXBC7D7F31C8N is widely used as a PCIe endpoint card on industrial PCs for vision, motion, and data-acquisition interfaces. The hardened PCIe Gen2 IP saves roughly 30,000 LEs compared with a soft IP-core approach, freeing fabric for application logic such as Camera Link acquisition, encoder counters, or high-speed ADC interfacing. Throughput of 5 Gbps per PCIe Gen2 lane allows aggregation of multiple data streams into host memory with minimal DMA overhead, and the FPGA's hot-socketing capability supports in-field card replacement without system shutdown. Quartus Prime generates the PCIe reference design as part of the IP Catalog under 'PCIe HIP.'
推薦
Motor Drive and Servo Control
The 5CGXBC7D7F31C8N implements high-performance field-oriented control (FOC) loops for industrial motor drives using its 312 dedicated DSP blocks. A typical 3-axis servo design runs FOC, SVPWM, and encoder interfaces at 32 kHz loop rates with deterministic latency below 4 µs thanks to the parallel fabric. Hardened PCIe Gen2 endpoints connect to a motion controller over a backplane, while transceivers support serial encoder protocols such as EnDat 2.2, BiSS, and Tamagawa. The 1.1 V core and sub-1 W static power suit the device to sealed inverter enclosures with conduction-cooled heatsinks.
推薦
Video Broadcast and Surveillance Processing
Broadcast studios and IP-surveillance NVRs use the 5CGXBC7D7F31C8N for SDI-to-IP bridging, multi-stream video scaling, and H.264/H.265 proxy encoding. Its 7,880,704 bits of embedded memory buffer full-HD frames at line rate, while 312 DSP blocks run 3D-DCT and motion-estimation pre-processing. The 9 transceivers carry 3G-SDI or SMPTE 2022-6 uncompressed video over 10 GbE, and the PCI Express Gen2 endpoint connects to host CPU storage for recording. The commercial -8 speed grade closes timing for 1080p60 processing without throttling, and AES-256 encrypted bitstreams protect proprietary video-processing IP.
推薦
Wireless Baseband Preprocessing
Small-cell and distributed-RAN architectures leverage the 5CGXBC7D7F31C8N for CPRI signal aggregation, digital pre-distortion (DPD), and crest-factor reduction (CFR) before the RF power amplifier. The 9 transceivers accept up to 9 CPRI links at 3.072 Gbps for multi-band aggregation. With 312 18×18 multipliers, the device can implement DPD look-up tables and polynomial correction for PA linearization, while the dedicated PCIe Gen2 endpoints link to a baseband SoC over the backplane. The 1.1 V core and TSMC 28 nm process yield static power below 1 W, simplifying the thermal envelope in outdoor small-cell enclosures.
推薦
Test and Measurement Instrumentation
Modular PXI and AXIe test platforms use the 5CGXBC7D7F31C8N as a flexible FPGA co-processor for high-speed protocol-aware test, including PCIe Gen2 link inspection, USB 3.0 protocol checks, and 10 GbE jitter analysis. The device's 9 transceivers operate up to 3.125 Gbps, supporting multi-protocol physical-layer testing through external bit-error-rate testers. A real-time pattern generator and oscilloscope capture block consume roughly 80,000 LEs and 200 DSP blocks, leaving room for protocol-state-machine engines. PCI Express Gen2 backplane integration allows test data to stream directly to host memory at 5 Gbps per lane.
推薦
推薦產品摘要
工程參考資料，適用於 5CGXBC7D7F31C8N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 5CGXBC7D6F31C7N | 5CGXBC7D7F27C8N | 5CGXBC7C7U19C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31, 31x31 mm) | 896-ball FBGA (F31) - same | 896-ball FBGA (F27, 27x31 mm) - same ball count | 672-ball UBGA (U19) - different ball count |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 |
| Speed Grade | -8C (commercial) | -7C (commercial, ~12-15% slower) | -8C (same) | -8C (same) |
| Transceivers | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps |
| PCIe Hard IP | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints |
| Price (1 piece, USD, as of 2026-09-05) | $280 | ~$255 (slightly lower for slower speed grade) | ~$280 (same speed, smaller package) | ~$225 (smaller BGA, lower unit cost) |
主要差異化特點
- Same-die drop-in on F31 footprint with relaxed timing (對比5CGXBC7D6F31C7N)
- Larger BGA with full I/O access (對比5CGXBC7C7U19C8N)
- Lower unit cost with same die when I/O is not needed (對比5CGXBC7C7F23C8N)
設計說明
The Cyclone V device family requires a sequenced 1.1 V core, 2.5 V VCCPD, and 1.5 V/2.5 V/3.3 V VCCIO supply rail ramp per the manufacturer's power-up specification. A power-management IC such as an LM3880 sequencer or a discrete MOSFET plus supervisory arrangement must hold the FPGA in reset (nCONFIG held low) until all rails reach at least 90 percent of nominal; failure to follow the sequence can trigger in-rush currents and partial-configuration errors on cold boot.
Estimated: the 896-ball F31 package at 1.0 mm pitch requires a 4- or 6-layer PCB stackup with microvia (laser-drilled) layer pairs and a minimum 0.127 mm finished via pad. Decoupling follows the manufacturer reference schematic: at least 32 × 0.1 µF 0402 capacitors placed uniformly beneath the BGA footprint plus 4 × 10 µF bulk capacitors within 25 mm of the package. The Quartus Prime pin planner should be used to balance high-speed transceiver and DDR3 signals across the inner layers to avoid simultaneous-switching-noise (SSN) issues.
Do not substitute a Cyclone V E variant (such as 5CEBA4F23C8N) when the design requires PCIe or high-speed transceivers — these are unavailable on the E family and the design will not close. Also avoid mixing -8 speed-grade parts with -7 stock in production; timing-closure failures under cold corner (-40 °C) are common. Finally, when migrating between F31 and F27 BGA packages, regenerate the entire pinout and re-validate the PCB BGA land pattern, because the F27 layout is smaller in one dimension despite the same 896-ball count.
合規資訊
RoHS compliance and lead-free BGA balls are confirmed by the Intel Cyclone V device declaration. Halogen-free status is not explicitly stated in the verified data and should be confirmed via the manufacturer's material declaration. The part is not AEC-Q100 qualified; it is targeted at commercial/industrial environments.
