EP1S30F780C7 - Stratix 32K LE FPGA, 780-FBGA | Altera / Intel
MPN： EP1S30F780C7 ⚠ 最後購買機會EP1S30F780C7 概覽
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic, routing, and I/O behavior are defined by configuration SRAM. FPGAs occupy the position of ASIC prototyping, hardware acceleration, and reconfigurable computing in the broader digital IC hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix-class FPGAs specifically target high-performance DSP and telecommunications signal chains.
Key features include 3,240 Kbits of embedded memory, dedicated DSP blocks supporting up to 224 18x18 multipliers, 12 transceiver channels (Rocket I/O) at up to 3.125 Gbps, and support for external DDR SDRAM and QDR II SRAM memory interfaces. The device also integrates a high-speed LVDS interface and a hard PCI-X core for direct bus connectivity in communication equipment.
Architecturally, the EP1S30F780C7 uses a logic-array-block (LAB) structure with each LAB containing 10 logic elements (LEs). Configuration is stored in SRAM, allowing in-system reprogrammability through JTAG or passive/active serial schemes. The 780-pin FCBGA package provides 597 usable I/O pins, organized into banks supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVPECL, and LVDS.
Typical applications include wired and wireless telecom baseband processing, high-speed serial interface bridging (XAUI, Fibre Channel, SONET), video and imaging pipelines, and ASIC prototyping for DSP and communications algorithms. The combination of dedicated multipliers and high-bandwidth memory makes this device especially well suited for OFDM and FFT-based designs.
Designers should pay close attention to power-supply sequencing, decoupling, and the 1 mm pitch BGA layout (29x29 mm body). Because configuration SRAM is volatile, an external configuration PROM such as an EPC16 or EPCS device is required for stand-alone boot. Static supply currents should be evaluated against the Stratix handbook power estimator spreadsheet.
This page synthesizes distributor pricing, drop-in equivalents from the same Stratix family, and practical board-design guidance not collected in any single datasheet — giving procurement and engineering teams one trustworthy decision point for this legacy but still-quotable device.
直接替換替代品，適用於 EP1S30F780C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S30F780C7 （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Process Technology, DSP Blocks.
EP1S30F780C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F780C6GA
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F780C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S25F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S25F780I6
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F780C7 最大額定值與電氣特性
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LE) | 32,470 |
| Total RAM Bits | 3,317,184 bits |
| Number of LABs | 3,247 |
| User I/O Count | 597 |
| Number of I/O Banks | 8 |
| Number of DLL/PLLs | 8 / 2 |
| Supply Voltage (Core) | 1.5 V |
| Supply Voltage (I/O) | Multiple banks, 1.5V-3.3V standards |
| Package Type | 780-BBGA, FCBGA (29 x 29 mm, 1 mm pitch) |
| Process Technology | 0.13 µm CMOS |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| 安裝類型 | Surface Mount (BGA) |
EP1S30F780C7 780-bbga, fcbga (29 x 29 mm, 1 mm pitch) 腳位配置指南
EP1S30F780C7（780-bbga, fcbga (29 x 29 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S30F780C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S30F780C7 適用於 6 應用s: Wired Telecom Baseband Processing, Wireless Base Station PHY Layer, High-Speed Serial Interface Bridging, Video and Imaging Pipelines, ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation.
Wired Telecom Baseband Processing
The EP1S30F780C7 is well suited to wired telecom baseband and channel-card designs, where the 32,470 logic elements, 224 dedicated 18x18 multipliers, and 3.3 Mbit of TriMatrix memory handle multi-carrier DSP and forward-error-correction pipelines. The 12 integrated Rocket I/O transceivers reach 3.125 Gbps, supporting OC-48, STM-16, and XAUI backplanes without external PHY chips. Designers route the FPGA between a TDM framer and a network processor, exploiting the on-chip EMIF to attach DDR SDRAM or QDR II SRAM for cell buffering.
推薦
Wireless Base Station PHY Layer
In wireless base stations the EP1S30F780C7 implements WCDMA, WiMAX, and LTE PHY functions by combining its DSP blocks for FFT / Viterbi with on-chip memory for soft-decision buffering. The 597 user I/Os allow connection to multiple analog front ends, while the LVDS-capable banks handle high-resolution ADC/DAC interfaces at hundreds of MSPS. Reference designs from Altera demonstrate complete transmit/receive chains on this device family.
推薦
High-Speed Serial Interface Bridging
The 12 Rocket I/O channels make the EP1S30F780C7 a flexible bridge for connecting cards that mix Fibre Channel, XAUI, Serial RapidIO, or PCI Express physical layers to legacy parallel backplanes. Designers can multiplex, de-multiplex, or protocol-convert between standards in a single chip, eliminating external bridges. The FPGA fabric provides the framing logic, while the transceivers handle line-coding and clock-data recovery.
推薦
Video and Imaging Pipelines
Video broadcast, surveillance, and medical imaging systems exploit the EP1S30F780C7's high I/O count to ingest parallel LVDS data from camera sensors, perform color-space conversion, scaling, and overlays in fabric, and drive DVI/HDMI or SDI outputs. With 597 I/Os and abundant RAM blocks, the device buffers full-HD frames in real time. Reference designs from Altera support SD-SDI, HD-SDI, and DVI/HDMI serialization directly from this FPGA family.
推薦
ASIC Prototyping and Emulation
Design teams use the EP1S30F780C7 as an ASIC prototype for mid-complexity ASICs targeting DSP and networking workloads. The 32K-LE fabric plus 597 I/Os emulate most ASIC cores in a single device, while embedded debug cores (SignalTap) provide real-time visibility. Compared to ASIC respins, prototype iteration cycles drop from weeks to hours, making this FPGA family a long-standing platform for early software bring-up.
推薦
Industrial Control and Test Instrumentation
The commercial-grade EP1S30F780C7 fits cost-sensitive industrial test instruments and motion controllers, where its parallel I/O, soft processor cores (Nios II), and dedicated multipliers handle DSP, quadrature decoding, and communication bridges. Designers use the 597 I/Os to drive displays, motor controllers, and external ADCs. For harsher environments, the same design can be ported to the industrial-rated EP1S30F780I6, keeping the same 780-FBGA footprint.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S30F780C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S30F780C6N | EP1S30F780C6GA | EP1S30F780C6 | EP1S30B956C6 | EP1S25F780C7 | EP1S25F780I6 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (29x29 mm, 1 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 956-BGA - different | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 24,060 (-26%) | 24,060 (-26%) |
| User I/O Count | 597 | 597 | 597 | 597 | 683 | 597 | 597 |
| Speed Grade | C7 (commercial, slower) | C6 (faster) | C6 (faster) | C6 (faster) | C6 (faster) | C7 (same) | I6 (industrial, slower) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C |
| Embedded RAM Bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 2,382,336 bits (-28%) | 2,382,336 bits (-28%) |
| Rocket I/O Channels | 12 | 12 | 12 | 12 | 20 | 12 | 12 |
主要差異化特點
- 32,470 LE is the highest density Stratix I in 780-BGA (對比EP1S25F780C7)
- Same die, faster speed grade (對比EP1S30F780C6)
- Industrial temperature drop-in (對比EP1S30F780I6)
設計說明
Stratix EP1S30 power is dominated by the 12 Rocket I/O transceivers and the 1.5 V core. Estimated: at 50% toggle rate and 8 active transceivers, total device dissipation can reach 8-10 W. Use the Stratix Power Estimator spreadsheet for your design; decoupling should include bulk 220 µF tantalum plus 0.1 µF / 0.01 µF ceramics near every VCC pin. Sequence 1.5 V core before 2.5 V PLL supply before 3.3 V I/O to avoid latch-up.
The 780-FBGA uses 1.0 mm pitch and requires an 8-12 layer PCB stack-up with microvia or via-in-pad technology for signal escape. Matched-length routing for the Rocket I/O serializer / deserializer pairs must hold within 0.15 mm (≈5 ps) of the target differential pair length, and characteristic impedance must be 100 Ω differential for the MGT lanes. Route all clock trees on inner layers and surround them with continuous ground pour.
Do not leave configuration-mode pins floating: tie MSEL pins to the correct logic level for the chosen configuration mode (AS, PS, JTAG). Use an external configuration PROM such as EPCS16 or EPC16 because the device's SRAM is volatile; a missing config device results in a non-booting board. Estimated: configuration bitstream for 32 K LE is typically ~7 Mbit, so the EPCS16 (16 Mbit) is the minimum safe choice.
Estimated: at 10 W dissipation on a 4-layer FR-4 board with the 780-FBGA, junction-to-ambient thermal resistance (θJA) is approximately 14 °C/W (per JEDEC JESD51), yielding ΔT of 140 °C above ambient. Use a thermal pad with 8 thermal vias underneath the exposed pad and consider an internal heat-spreader copper plane on top side. For sealed enclosures, derate by 25 % or specify the industrial I6 variant.
合規資訊
Original EP1S30F780C7 release pre-dated universal RoHS adoption; Pb-free variants (N suffix) exist within the family. REACH and halogen status not explicitly stated in the verified web data and should be confirmed via lot / date code. AEC-Q100 not applicable to FPGAs in this family.
