EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
MPN： EP1S30F780C6 ✗ 停產EP1S30F780C6 概覽
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) built on an SRAM process that lets engineers implement arbitrary digital logic, block RAM, DSP arithmetic, and high-speed serial transceivers on a single die. Stratix belongs to the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. Within Altera's (now Intel FPGA) portfolio, the EP1S30F780C6 sits in the first-generation Stratix family, positioned between the smaller Stratix EP1S10/EP1S20 and the higher-density EP1S40/EP1S60/EP1S80 devices, and predates the Stratix II/GX/Cyclone lineages.
Key features of the EP1S30F780C6 include up to 28 DSP blocks with up to 224 (9-bit × 9-bit) embedded multipliers for DSP pipelines, TriMatrix memory architecture with up to ~3.4 Mbits of RAM, support for multiple I/O standards including LVDS, and a configuration scheme based on SRAM cells loaded at power-up via passive serial, fast passive parallel, or JTAG. The 0.13 μm process and 1.5 V core deliver a balance of performance and power for early-2000s high-end designs.
The architecture uses logic array blocks (LABs) composed of logic elements (LEs), each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded memory blocks (M512, M4K, M-RAM) provide distributed and block RAM at multiple aspect ratios. PLLs provide clock conditioning and frequency synthesis for the global and regional clock networks, and dedicated high-speed I/O banks support external memory interfaces such as DDR SDRAM and QDR SRAM.
Typical applications of the EP1S30F780C6 include high-throughput DSP (software-defined radio baseband, video processing), telecom line cards implementing protocol bridging and packet processing, ASIC prototyping, and industrial imaging pipelines. The 597 I/Os make it useful for designs that aggregate many parallel buses or external memory channels.
When designing with this part, validate power sequencing of the 1.5 V core and the I/O bank supplies, and use Altera Quartus II (legacy version chain) for synthesis, place-and-route, and timing closure. Engineers should also note that this is a mature/EOL device line and plan second-source or migration paths to Cyclone/Stratix II families where possible.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list (Stratix EP1S25 / EP1S20 / EP1S10 variants), and practical FPGA design notes that are not consolidated on the manufacturer datasheet alone, giving engineers a faster starting point for sourcing and PCB redesign decisions.
直接替換替代品，適用於 EP1S30F780C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S30F780C6 （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Speed Grade, Series.
EP1S30F780C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F780I6
✅ 直接替換聯絡詢價
查看資料表 →EP1S30F780C5
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1S25F780C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S20F780C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S30F780C6 最大額定值與電氣特性
| Series | Stratix (1st Generation) |
| Family | Stratix |
| Logic Elements (LEs) | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Maximum User I/Os | 597 |
| Process Technology | 0.13 μm all-layer copper SRAM |
| Core Voltage | 1.5 V |
| DSP Blocks | Up to 28 |
| Embedded Multipliers | Up to 224 (9-bit × 9-bit) |
| On-chip Memory | TriMatrix (M512, M4K, M-RAM blocks) |
| 封裝 | 780-ball FCBGA (FineLine BGA), 29 mm × 29 mm, 1 mm pitch |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0 °C to 85 °C (commercial) |
| Configuration | SRAM-based (passive serial, fast passive parallel, JTAG) |
| Speed Grade | C6 (commercial, speed grade 6) |
EP1S30F780C6 780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch 腳位配置指南
EP1S30F780C6（780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S30F780C6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S30F780C6 適用於 6 應用s: Software Defined Radio (SDR) Baseband, Telecom Line Card Protocol Bridging, ASIC Prototyping, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military / Aerospace Signal Processing (legacy).
Software Defined Radio (SDR) Baseband
The EP1S30F780C6 is well suited for SDR baseband signal processing because its 28 DSP blocks and 224 embedded 9-bit × 9-bit multipliers sustain the multiply-accumulate rates needed for FFT, FIR filtering, and channelization. The 32,470 logic elements fit complex baseband datapaths including symbol mapping, scrambling, and turbo decoding on a single die. Designers pair the FPGA with high-speed ADCs/DACs and external ZBT or DDR memory to stream I/Q samples in and out. The 597 user I/Os accept multiple parallel data buses plus LVDS links to RF front ends, which is exactly the kind of mixed signal aggregation the original Stratix family was designed for.
推薦
Telecom Line Card Protocol Bridging
In telecom line cards the EP1S30F780C6 acts as a protocol bridge between framer/MAC ASICs, network processors, and backplane SERDES. The TriMatrix memory provides the packet buffers and lookup tables required for cell/packet reassembly, while the DSP blocks accelerate header parsing and checksum offload. Its 597 I/Os accommodate UTOPIA, POS-PHY, and SPI-4.2 buses without external muxing. The 1.5 V 0.13 μm process delivers low enough power to fit into dense line-card thermal budgets of the era.
推薦
ASIC Prototyping
Engineers used the EP1S30F780C6 as an ASIC prototype vehicle because the 32,470 LEs and 597 I/Os roughly mapped to mid-complexity ASIC netlists. The FPGA let design teams validate architecture, software drivers, and system timing months before mask tape-out, dramatically reducing ASIC re-spin risk. Fast Quartus II turnaround let multiple RTL iterations run in a single day. The 780-ball FCBGA exposes enough I/O to map DDR, PCI, and proprietary bus interfaces concurrently, which is critical for full-chip bring-up.
推薦
Industrial Imaging and Video Processing
The EP1S30F780C6 supports multi-channel video pipelines including image scaling, color-space conversion, and real-time edge detection at full frame rate. The 597 user I/Os accept Camera Link, LVDS, and parallel CMOS sensor interfaces, and the on-chip TriMatrix RAM holds line buffers for temporal filtering. Designers target ~150 MHz pixel clocks on a C6 speed grade and use the DSP blocks for convolution and 2D filter kernels. The 780-ball FCBGA package supplies the thermal headroom needed for sustained 1A core draw under continuous imaging workloads.
推薦
Test and Measurement Instrumentation
In ATE and bench instrumentation the EP1S30F780C6 implements pattern generation, response capture, and signal conditioning in a single programmable fabric. The 597 I/Os accept multi-lane LVDS from DUTs, while the DSP blocks compute FFTs, correlations, and statistical reductions in real time. The commercial temperature grade is sufficient for lab environments, and the 1 mm pitch FCBGA accommodates controlled-impedance PCB stack-ups used in high-speed test fixtures. Engineers also use it for protocol-aware logic analyzers where density matters more than raw clock rate.
推薦
Military / Aerospace Signal Processing (legacy)
Although the EP1S30F780C6 is commercial-grade (0 °C to 85 °C), it served in non-flight, lab-grade signal processing for defense programs where the density of original Stratix was needed for radar preprocessing and EW simulations. The industrial-grade cousin EP1S30F780I6 extends the temperature envelope to -40 °C to 100 °C for harsher environments. The high DSP block count accelerates pulse-Doppler processing, while 597 I/Os ingest parallel ADC banks from antenna arrays. Designers should note that Altera/Intel recommends newer radiation-tolerant parts for actual flight hardware.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S30F780C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S30F780C7 | EP1S30F780I6 | EP1S30F780C5 | EP1S25F780C6 | EP1S20F780C6 |
|---|---|---|---|---|---|---|
| Package | 780-ball FCBGA (29x29 mm, 1 mm pitch) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | ~25,660 | ~18,460 |
| Speed Grade | C6 | C7 (faster) | I6 (industrial temp) | C5 (slower) | C6 | C6 |
| Temperature Grade | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) |
| User I/Os | 597 | 597 | 597 | 597 | ~597 (same package) | ~597 (same package) |
| DSP Blocks | Up to 28 (224 9x9 multipliers) | Up to 28 | Up to 28 | Up to 28 | Up to 22 | Up to 17 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
主要差異化特點
- Higher density than EP1S25F780C6 in the same footprint (對比EP1S25F780C6)
- Higher logic capacity than EP1S20F780C6 in the same package (對比EP1S20F780C6)
- Commercial temperature grade; industrial variant available in same package (對比EP1S30F780I6)
設計說明
Estimated: Stratix devices in the EP1S30 family typically draw 1–2 A on the 1.5 V VCCINT rail at full logic utilization, plus several hundred mA on the VCCIO rails for the I/O banks. Decouple each VCCINT pin with a 0.1 µF X7R plus a 10 µF bulk capacitor placed as close as physically possible on the inner PCB layers. Use a dedicated linear or DC-DC regulator with output accuracy ≤3% to satisfy Altera's VCCINT tolerance; an LDO such as the TI TPS75533 (with proper 1.5 V tap) is recommended for low-noise designs.
Estimated: at full utilization the EP1S30F780C6 dissipates approximately 3–5 W, and the 780-ball FCBGA exposes only a small fraction for heatsinking. Theta_JA on a standard 4-layer JEDEC test board is approximately 12–15 °C/W, so junction rise over ambient is in the 40–75 °C range. Use the largest practical ground pad under the package and 2 oz copper pours on outer layers to spread heat. If your application runs in a sealed enclosure, derate ambient by at least 10 °C.
The 780-ball FCBGA uses 1 mm pitch, which requires laser-drilled or mechanically drilled microvias on a 1–2–1 or 1–2–2–1 stack-up. Per Altera's package guidelines, escape each ball to an inner layer via-in-pad or dog-bone fanout, and keep the BGA area free of signal traces for at least 2 mm to allow rework. Match differential pair lengths to within 150 mil for LVDS links, and route all high-speed clocks on inner stripline layers adjacent to a continuous reference plane.
Stratix SRAM FPGAs lose configuration on power-down; never assume the device boots into a known state without a configuration PROM or system controller. Use an Altera EPC16 or EPC8 configuration device, and tie nCONFIG, nSTATUS, and CONF_DONE per the Stratix handbook to allow JTAG recovery. Avoid driving I/O banks before VCCIO is stable — the I/Os are not hot-swappable and can back-power the core through ESD clamp diodes.
合規資訊
RoHS/REACH/lead-free status for the original EP1S30F780C6 die is not stated in the verified web data; users must confirm via the manufacturer's official declaration. AEC-Q100 is not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC.
