EP20K400GC655-2 - 400K Gates APEX-20KC FPGA 655-BCPGA | Altera
MPN： EP20K400GC655-2 ✗ 停產EP20K400GC655-2 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing hardware designers to implement arbitrary digital logic that is re-programmable in the field. FPGAs sit hierarchically between simple programmable logic devices (PALs, GALs, CPLDs) and fixed-function ASICs, and APEX-20KC devices occupy the high-density end of that hierarchy by combining LUT-based logic, product-term logic, and embedded system blocks (ESBs) that double as dual-port RAM, CAM, or ROM.
Key differentiating specifications include MultiCore™ architecture integrating LUT logic, product-term logic, and embedded memory in a single fabric; high-speed LVDS I/O pairs for chip-to-chip serial links; 4 PLLs for clock conditioning and skew management; and embedded CAM for high-speed table lookup. The MultiVolt I/O interface allows direct connection to 1.8 V, 2.5 V, and 3.3 V buses without external level shifters, simplifying mixed-voltage board design.
Typical applications include telecommunications line cards, custom DSP datapaths, network protocol bridging, and embedded control for industrial automation where deterministic logic and high I/O count outweigh the cost of an ASIC. The ceramic CPGA package is preferred for high-reliability and military-temperature programs because of its hermeticity and superior thermal performance over plastic BGAs.
When designing with this device, allocate at least four PCB layers for controlled-impedance routing, provide decoupling of 0.1 µF + 10 µF near every VCCINT/VCCIO pin pair, and configure unused I/O pins as tri-state inputs with internal pull-up to minimize leakage. Because the APEX-20KC family has been EOL'd by Intel, plan second-source or migration to Cyclone/Stratix equivalents early in the design cycle.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not consolidated in the original APEX-20KC datasheet - useful for engineers maintaining legacy systems or qualifying alternate sources under PCN constraints.
直接替換替代品，適用於 EP20K400GC655-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400GC655-2 （相同外形與佔位） — 差異在於 Package Type, Mounting Type, Family, Process Technology, Package.
EP20K400GC655-1X
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400GC655-1V
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400GC655-1
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400GC652-1XV
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400GC655-2 最大額定值與電氣特性
| Series | APEX-20KC |
| Family | APEX 20K |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 400,000 |
| Logic Cells / Elements | 16,640 |
| Total RAM Bits | 212,992 |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -2 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 1.71 V to 1.89 V (MultiVolt) |
| LVDS Support | Yes |
| PLLs | 4 |
| 腳位數 | 655 |
| Package Type | 655-BCPGA (CPGA-655) |
| Package Dimensions | 62.48 x 62.48 mm |
| 安裝類型 | Through-Hole (CPGA) |
EP20K400GC655-2 62.48 x 62.48 mm 腳位配置指南
EP20K400GC655-2（62.48 x 62.48 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400GC655-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400GC655-2 適用於 6 應用s: Telecommunications Line Cards, Custom DSP Datapaths, Network Protocol Bridging, Industrial Control & Automation, High-Reliability / Military Embedded Computing, Embedded System-on-Programmable-Chip (SOPC) Integration.
Telecommunications Line Cards
The EP20K400GC655-2 is well-suited to legacy telecom line-card designs requiring high-density programmable logic in a hermetic CPGA package. Its 16,640 logic cells and 212,992 bits of embedded dual-port memory support custom framer/mapper datapaths, while the 200 MHz internal clock enables high-throughput STS/STM processing. The ceramic CPGA package withstands the higher operating temperatures and long service-life requirements of central-office equipment where plastic BGA parts may fail prematurely. Pair with serializer/deserializer companion chips for multi-gigabit backplane links.
推薦
Custom DSP Datapaths
With 200 MHz fabric and 16,640 logic elements, the EP20K400GC655-2 implements custom multi-channel DSP datapaths for baseband processing, FFT engines, and FIR filters. Embedded system blocks (ESBs) double as coefficient ROM or dual-port sample buffers, eliminating external SRAM in many designs. The MultiCore architecture allows mixing LUT-based datapath logic with product-term control logic in the same fabric. Designers can implement radix-4 or radix-8 FFT pipelines running at 100-150 MSPS in this part while still leaving logic headroom for control-plane processing.
推薦
Network Protocol Bridging
The EP20K400GC655-2 bridges between legacy telecom protocols (PDH, SDH/SONET) and modern Ethernet backplanes, supporting custom 8B/10B or 64B/66B encode/decode, framing, and rate adaptation. Four on-chip PLLs provide independent clock domains for the bridge, and the LVDS-capable MultiVolt I/O directly connects to 1.8 V PHY devices without level shifting. The 212,992 bits of embedded RAM are sufficient for elastic store buffers handling rate mismatches up to +/-100 ppm.
推薦
Industrial Control & Automation
The EP20K400GC655-2 implements deterministic motor-control, PLC, and process-control logic in industrial-automation systems. The -2 speed grade provides timing margin for synchronous I/O handling, and the ceramic CPGA package tolerates vibration and thermal cycling in factory-floor environments. Embedded memory blocks serve as deterministic lookup tables for PID controllers and PWM generation, while LUT logic implements custom fieldbus protocols (PROFIBUS, Modbus, CANopen) on the same fabric.
推薦
High-Reliability / Military Embedded Computing
The ceramic CPGA package makes the EP20K400GC655-2 a strong fit for high-reliability programs and military embedded computing where plastic BGAs are disqualified by hermeticity requirements. The 400K-gate density supports single-board computer (SBC) and signal-processing subsystems for avionics, naval, and ground-vehicle applications. Logic capacity is sufficient for MIL-STD-1553 bus controllers, radar front-end preprocessing, and secure-radio baseband. Designers should verify the operating temperature grade and MIL-STD screening with the distributor before procurement.
推薦
Embedded System-on-Programmable-Chip (SOPC) Integration
As one of the first PLDs marketed with system-on-a-programmable-chip integration, the EP20K400GC655-2 combines a Nios or custom soft-core processor with peripheral logic, memory controllers, and custom accelerators in a single fabric. The MultiCore architecture lets designers implement register-intensive control logic in LUT fabric while moving wide datapaths into product-term blocks, optimizing both area and timing. Embedded system blocks can be configured as dual-port RAM for processor data/cache scratchpad, providing 212,992 bits of single-cycle access memory.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400GC655-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400GC655-1X | EP20K400GC655-1V | EP20K400GC655-1 | EP20K400GC652-1XV |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 655-BCPGA (CPGA-655) | 655-BCPGA - same | 655-BCPGA - same | 655-BCPGA - same | 652-BGA - related family |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Cells | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Total RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Speed Grade | -2 | -1X (slower, -15%) | -1V (industrial temp, slower) | -1 (base speed) | -1XV (industrial, slower) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Hermetic ceramic CPGA package for high-reliability programs (對比EP20K400FC672-2 (672-FBGA))
- -2 speed grade for faster timing closure (對比EP20K400GC655-1 (base -1 speed grade))
- MultiCore architecture with embedded system blocks (對比EP20K400EBC652-2 (APEX-20KE BGA))
設計說明
The 655-CPGA package requires a through-hole socket or solder-mount receptacle with 62.48 x 62.48 mm PCB footprint. Allocate at least four PCB layers for controlled-impedance routing of LVDS pairs. Place 0.1 µF and 10 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair to minimize power-rail noise. Use a continuous ground plane on layer 2 directly beneath the CPGA to control return-current paths and reduce EMI on high-speed I/O.
Estimated: at a typical APEX-20KC junction-to-ambient thermal resistance of approximately 8-10 C/W for the CPGA-655 with a socketed heatsink, a 5 W dissipation would yield a 40-50 C junction temperature rise. In commercial enclosed systems, design for forced airflow of at least 200 LFM across the heatsink to maintain junction temperature below 100 C. The ceramic CPGA package has lower theta_JC than equivalent plastic BGAs, but the socket interface typically dominates overall thermal resistance.
Three common pitfalls for the EP20K400GC655-2: (1) do not assume the -2 speed grade supports every timing constraint - verify with Quartus timing analysis before committing to layout; (2) configure unused I/O pins as tri-state inputs with internal pull-up to minimize leakage and prevent floating inputs; (3) LVDS I/O pairs require 100-ohm differential termination at the receiver end - missing termination degrades signal integrity dramatically. Plan second-source or migration to Cyclone/Stratix equivalents early since the APEX-20KC family is end-of-life.
合規資訊
Compliance data not found in verified web sources. The CPGA-655 ceramic package and APEX-20KC family predate many modern compliance standards; verify with franchised distributor (Rochester Electronics) for specific program compliance requirements.
