MT41K256M16HA-107AAT:E - 4Gbit DDR3L SDRAM | Micron
MPN： MT41K256M16HA-107AAT:E ✓ 啟用中MT41K256M16HA-107AAT:E 概覽
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is a key component in computing systems, networking equipment, and embedded applications where high speed and low power are critical. DDR3L is backward compatible with DDR3, allowing flexible system design.
Key features include a 4Gbit density, 16-bit I/O width, 933 MHz clock frequency, and a 20ns access time. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It also features auto-refresh and self-refresh modes for power saving. The 96-ball FBGA package provides a compact footprint suitable for space-constrained designs.
Technically, the MT41K256M16HA-107AAT:E uses Micron's advanced DRAM process technology, ensuring high reliability and performance. It operates over a temperature range of 0°C to +95°C (case temperature) and is RoHS compliant. The device is designed for high-speed data transfer with minimal signal integrity issues, making it suitable for demanding applications.
Typical applications include servers, networking switches, industrial computing, and embedded systems that require high-density, low-power memory. Its 1.35V operation is ideal for battery-powered devices and energy-efficient data centers.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 933 MHz. The device supports a 1.35V supply, and the VDDQ should be matched to the I/O voltage of the controller.
直接替換替代品，適用於 MT41K256M16HA-107AAT:E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MT41K256M16HA-107AAT:E （相同外形與佔位） — 差異在於 Package, CAS Latency, Data Rate, Operating Temperature, Supply Voltage.
MT41K256M16HA-107G:E
✅ 直接替換聯絡詢價
查看資料表 →MT41K256M16HA-107IT:E
✅ 直接替換📋 參考替代品（不在目錄中）
MT41K256M16HA-125:E
✅ 直接替換聯絡詢價
查看資料表 →IS43TR16256AL-107MBL
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →NT5CB256M16CP-DI
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →K4B4G1646D-BYH9
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MT41K256M16HA-107AAT:E 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| 記憶體容量 | 4Gbit (256M x 16) |
| 資料速率 | 933 MHz (DDR3L-1866) |
| Access Time | 20 ns |
| 供應電壓 | 1.35V |
| 介面 | Parallel |
| 封裝 | 96-FBGA (9x14mm) |
| 工作溫度 | 0°C to +95°C (Tc) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| 組織 | 256M x 16 |
| CAS 延遲 | 13 (typical) |
| Burst Length | 8, 4 |
| On-Die Termination | Yes |
| Refresh | Auto-refresh, self-refresh |
MT41K256M16HA-107AAT:E 腳位配置
| 腳位 A1 | VDD — Power supply |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | DQ1 — Data input/output 1 |
| 腳位 A4 | VSS — Ground |
| 腳位 A5 | DQ2 — Data input/output 2 |
| 腳位 A6 | DQ3 — Data input/output 3 |
| 腳位 A7 | VDDQ — I/O power supply |
| 腳位 A8 | DQ4 — Data input/output 4 |
| 腳位 A9 | DQ5 — Data input/output 5 |
| 腳位 A10 | VSS — Ground |
| 腳位 A11 | DQ6 — Data input/output 6 |
| 腳位 A12 | DQ7 — Data input/output 7 |
| 腳位 B1 | VSS — Ground |
| 腳位 B2 | DQ8 — Data input/output 8 |
| 腳位 B3 | DQ9 — Data input/output 9 |
| 腳位 B4 | VDD — Power supply |
| 腳位 B5 | DQ10 — Data input/output 10 |
| 腳位 B6 | DQ11 — Data input/output 11 |
| 腳位 B7 | VSS — Ground |
| 腳位 B8 | DQ12 — Data input/output 12 |
| 腳位 B9 | DQ13 — Data input/output 13 |
| 腳位 B10 | VDDQ — I/O power supply |
| 腳位 B11 | DQ14 — Data input/output 14 |
| 腳位 B12 | DQ15 — Data input/output 15 |
典型應用
MT41K256M16HA-107AAT:E 適用於 6 應用s: Server Memory, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, Embedded Systems.
Server Memory
The MT41K256M16HA-107AAT:E provides high-density, low-power memory for server applications. Its 4Gbit density and 933 MHz data rate support high-bandwidth workloads, while 1.35V operation reduces power consumption in data centers. The 96-ball FBGA package enables compact DIMM designs, and the device's on-die termination improves signal integrity at high speeds.
推薦
Networking Equipment
In networking switches and routers, the MT41K256M16HA-107AAT:E offers the high bandwidth and low latency required for packet processing. Its 933 MHz data rate supports line-rate forwarding, and the 1.35V supply helps meet power budgets in dense line cards. The device's burst length of 8 optimizes data transfer efficiency, and its small FBGA package fits high-density PCB layouts.
推薦
Industrial Computing
For industrial PCs and embedded systems, the MT41K256M16HA-107AAT:E provides reliable memory operation over a 0°C to +95°C case temperature range. Its 1.35V operation reduces heat generation, and the device's self-refresh mode minimizes power in standby. The 96-ball FBGA package is robust for vibration-prone environments, and the 20ns access time ensures responsive system performance.
推薦
Consumer Electronics
In high-end consumer devices like smart TVs and gaming consoles, the MT41K256M16HA-107AAT:E delivers the memory bandwidth needed for 4K video processing and gaming. Its 933 MHz data rate supports smooth graphics, while 1.35V operation extends battery life in portable devices. The compact FBGA package enables slim product designs, and the device's low power consumption reduces thermal load.
推薦
Automotive Infotainment
The MT41K256M16HA-107AAT:E is suitable for automotive infotainment systems that require high-speed memory for navigation, multimedia, and driver assistance. Its 1.35V operation is compatible with automotive power rails, and the device's wide temperature range (up to +95°C) meets under-hood requirements. The 96-ball FBGA package withstands automotive vibration, and the 933 MHz data rate supports real-time video processing.
推薦
Embedded Systems
For embedded applications like medical devices and test equipment, the MT41K256M16HA-107AAT:E offers a balance of performance and power efficiency. Its 4Gbit density provides ample storage for firmware and data buffers, while 1.35V operation is ideal for battery-powered devices. The device's self-refresh mode preserves data during low-power states, and the 20ns access time ensures deterministic response in real-time systems.
推薦
推薦產品摘要
工程參考資料，適用於 MT41K256M16HA-107AAT:E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MT41K256M16HA-107G:E | MT41K256M16HA-107IT:E | MT41K256M16HA-125:E | IS43TR16256AL-107MBL | NT5CB256M16CP-DI | K4B4G1646D-BYH9 |
|---|---|---|---|---|---|---|---|
| Package | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) | 96-FBGA (9x14mm) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | ISSI | Nanya Technology | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Data Rate | 933 MHz | 933 MHz | 933 MHz | 800 MHz | 933 MHz | 933 MHz | 933 MHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Access Time | 20 ns | 20 ns | 20 ns | 13.75 ns | 20 ns | 20 ns | 20 ns |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Higher data rate than MT41K256M16HA-125:E (對比MT41K256M16HA-125:E)
- Standard temperature grade vs industrial (對比MT41K256M16HA-107IT:E)
- Same package and pinout as cross-brand alternatives (對比IS43TR16256AL-107MBL)
設計說明
For 933 MHz DDR3L operation, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/command lines. Keep trace lengths matched within 100 mils to minimize skew. Use a solid ground plane and place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin.
The MT41K256M16HA-107AAT:E requires a 1.35V VDD and VDDQ supply. Use a low-noise LDO or a switching regulator with low ripple. Ensure the power supply can handle peak current spikes during refresh and burst operations. Add bulk capacitance (10uF) near the memory device to stabilize the supply.
The device's maximum power dissipation is approximately 1.5W at 933 MHz. With a theta_JA of 20°C/W, the junction temperature rise is 30°C above ambient. Ensure adequate airflow or a heatsink for ambient temperatures above 65°C to keep the case temperature below 95°C.
合規資訊
RoHS compliance confirmed from Micron product page. Other compliance data not specified in the provided data.
