W634GU6RB-11TR vs H5TC4G63CFR-H9A 对比

详细并排对比 W634GU6RB-11TR 出自 Winbond 和 H5TC4G63CFR-H9A 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Winbond
W634GU6RB-11TR W634GU6RB-11TR - 4Gb DDR3L SDRAM 933MHz | Winbond

W634GU6RB-11TR - 4Gb DDR3L SDRAM 933MHz | Winbond

W634GU6RB-11TR ✓ 量产中
SK hynix
H5TC4G63CFR-H9A H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix

H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix

H5TC4G63CFR-H9A ✓ 量产中

规格对比

参数 W634GU6RB-11TR H5TC4G63CFR-H9A
品牌 Winbond SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $32.00 $6.50
存储器类型 DDR3L SDRAM DDR3L SDRAM
存储容量 4Gbit (256M x 16) —
Clock Frequency 933 MHz —
数据速率 1866 MT/s [DATA_NEEDED: Data rate (e.g., 1866 Mbps)]
Access Time 20 ns —
电源电压 1.35V (1.5V compatible) —
接口 Parallel —
封装 96-VFBGA (7.5x13 mm) 96-ball TFBGA
工作温度 -40°C to +95°C —
CAS 延迟 13 [DATA_NEEDED: CAS latency]
存储组织 256M x 16 256M x 16
安装类型 Surface Mount —
RoHS 状态 Compliant Compliant
无卤 Yes —
Auto Self-Refresh Yes —
Write Leveling Yes —
ZQ Calibration Yes —
Dynamic ODT Yes —
Memory Density — 4Gb (4294967296 bit)
Supply Voltage (VDD) — 1.35V + 0.100 / - 0.067V
Supply Voltage (VDDQ) — 1.35V + 0.100 / - 0.067V
Number of Terminals — 96
Package Shape — RECTANGULAR
工作温度范围 — [DATA_NEEDED: Operating temperature range]
Lead-Free — Yes
无卤 — Yes
Burst Length — 8, 4 (with burst chop)
Differential Clock Inputs — Yes (CK, CK)
Differential Data Strobe — Yes (DQS, DQS)
On-Chip DLL — Yes
DM (Data Mask) — Yes

数据手册与资源

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