EP1SGX25DF800C5N - Stratix GX FPGA, 25K LEs, 8 Transceivers | Intel
MPN: EP1SGX25DF800C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220 | $2,200.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $158 | $158,000.00 |
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View Datasheet →EP1SGX25DF800C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Device Logic Elements | 25,660 (typical) |
| Transceiver Channels | 8 (full-duplex) |
| Maximum Transceiver Data Rate | 3.1875 Gbps per channel |
| Process Technology | 130 nm |
| Supply Voltage (Core) | 1.5 V typical |
| Package | FBGA-800 (FineLine BGA, 31x31 mm) |
| Speed Grade | C5 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Lead-Free / RoHS Status | Lead-free (N suffix) |
| On-Chip Memory (TriMatrix) | Approx. 2 Mbits total |
| PLLs | Up to 40 (device-wide) |
| Embedded 8b/10b Encoder/Decoder | Yes (one per transceiver channel) |
| PCI Express Hard IP | x1, x4 endpoints supported |
| DSP Blocks | Embedded multiplier blocks (family-wide) |
| Mounting Type | Surface Mount (BGA) |
| Development Software | Quartus II (legacy) |
EP1SGX25DF800C5N Pin Configuration
| Pin A1 | GND — Ground reference (FBGA ball) |
| Pin A2 | VCC — Core supply 1.5 V typical |
| Pin A3 | IO — General-purpose user I/O bank |
| Pin A4 | GXB_TX[0] — Transceiver 0 transmit (positive) |
| Pin A5 | GXB_TX[0] — Transceiver 0 transmit (negative) |
| Pin A6 | GXB_RX[0] — Transceiver 0 receive (positive) |
| Pin A7 | GXB_RX[0] — Transceiver 0 receive (negative) |
| Pin A8 | REFCLK — Transceiver reference clock input |
| Pin B1 | GND — Ground |
| Pin B2 | VCCIO — I/O bank supply |
| Pin B3 | IO — User I/O |
| Pin B4 | GXB_TX[1] — Transceiver 1 transmit (positive) |
| Pin B5 | GXB_TX[1] — Transceiver 1 transmit (negative) |
| Pin B6 | GXB_RX[1] — Transceiver 1 receive (positive) |
| Pin B7 | GXB_RX[1] — Transceiver 1 receive (negative) |
| Pin B8 | CONFIG_DONE — Configuration complete output |
| Pin C1 | MSEL[0] — Configuration mode select |
| Pin C2 | MSEL[1] — Configuration mode select |
| Pin C3 | nCONFIG — Configuration active-low reset |
| Pin C4 | nSTATUS — Configuration status output |
| Pin C5 | DCLK — Configuration clock input |
| Pin C6 | DATA0 — Configuration data input bit 0 |
| Pin C7 | GXB_TX[2] — Transceiver 2 transmit (positive) |
| Pin C8 | GXB_TX[2] — Transceiver 2 transmit (negative) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF800C5N is suitable for 6 applications: Gigabit Ethernet Line Card, PCI Express Endpoint Card, Serial ATA (SATA) Host Controller, Serial Backplane Interface (SPI/SFI/XSBI), Fibre Channel Storage Networking, High-Speed Serial Prototyping Bridge.
Gigabit Ethernet Line Card
The EP1SGX25DF800C5N's 8 embedded transceivers at 3.1875 Gbps and dedicated 8b/10b encoder/decoder blocks make it a natural fit for legacy gigabit Ethernet line cards. Each transceiver implements an SGMII or 1000BASE-X PMA, freeing the programmable fabric for MAC, IPv4/v6 forwarding, and queuing logic. With 25,660 logic elements available, a single device can handle multi-port gigabit switching with on-chip TriMatrix memory for packet buffering. Typical line-card designs pair this device with an external PHY or use the embedded SERDES with on-die CDR to drive backplane traces directly, reducing BOM cost versus a PHY-per-port architecture.
Recommended
PCI Express Endpoint Card
The EP1SGX25DF800C5N includes a hard PCI Express IP block that supports x1 and x4 endpoints, eliminating the soft-logic overhead that older FPGAs required. Combined with 3.125 Gbps-capable transceivers (PCIe Gen1 = 2.5 Gbps, which is well within range), the device delivers low-latency, low-power PCIe connectivity for server adapter cards and embedded compute modules. The 25K logic elements are sufficient for endpoint DMA engines, MSI-X interrupt logic, and protocol-aware accelerators. Designers should note that this family predates PCIe Gen2/3 hard IP; Gen2/3 designs should migrate to Stratix IV GX or Cyclone IV GX.
Recommended
Serial ATA (SATA) Host Controller
SATA I (1.5 Gbps) and SATA II (3.0 Gbps) both fall within the EP1SGX25DF800C5N's 600 Mbps to 3.1875 Gbps transceiver window, making this device an early-generation SATA implementation platform. The on-die CDR and 8b/10b encoding handle SATA's OOB (out-of-band) signaling primitives and PRBS patterns without external circuitry. With 8 channels, the device can implement a quad-port SATA controller or RAID engine. Designers targeting SATA III (6 Gbps) must migrate to Stratix IV GX or later, as 6 Gbps exceeds the SGX25's 3.1875 Gbps ceiling.
Recommended
Serial Backplane Interface (SPI/SFI/XSBI)
The EP1SGX25DF800C5N was designed specifically for SPI-3 (3.2 Gbps), SFI-4, and XSBI backplane standards used in telecom line cards and ATM/SONET equipment. Each transceiver's built-in CDR recovers clocks from degraded backplane signals, and the 8-channel grouping matches the typical 8-lane SPI-3 bus width exactly. The 25K logic elements can implement framer, deframer, and cell/packet processing in fabric, while the embedded DSP blocks accelerate scrambling and checksum operations. This remains a popular drop-in solution for sustaining legacy SONET/SDH equipment with no redesign budget.
Recommended
Fibre Channel Storage Networking
Fibre Channel rates of 1 Gbps and 2 Gbps fit comfortably within the EP1SGX25DF800C5N's 3.1875 Gbps ceiling, supporting FC-AL (Arbitrated Loop) and FC-SW (Switched Fabric) designs at 1.0625 and 2.125 Gbps line rates. The hard 8b/10b blocks encode FC's K28.5 comma characters without fabric overhead, and TriMatrix memory provides the FC frame buffers. Storage OEMs used this device in early 2 Gbps FC switches and HBAs. The 8 channels map naturally to a single FC switch port or 2-port HBA topology, with the remaining logic available for FC-SP authentication or FC-GS director services.
Recommended
High-Speed Serial Prototyping Bridge
The EP1SGX25DF800C5N serves as a versatile prototyping bridge for any application needing 600 Mbps to 3.1875 Gbps serial links with on-die CDR. The Quartus II toolchain with SignalTap logic analysis lets designers tap into transceiver PCS and PMA layers for protocol debugging - a capability that some newer families have removed or restricted. With 8 transceivers and 25K LEs, the device can implement a multi-protocol bridge (e.g., SGMII-to-XAUI) or a generic serdes test bench for SI verification. Engineers building custom ASICs use this part to validate PHY behavior before tape-out.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF800C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C5N | EP1SGX25DF672C5N | EP1SGX25DF1020C5 | EP1SGX25CF672C7 |
|---|---|---|---|---|---|
| Package | FBGA-800 (FineLine BGA) | FBGA-1020 | FBGA-672 | FBGA-1020 | FBGA-672 |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25,660 typical | 25,660 typical (same die) | 25,660 typical (same die) | 25,660 typical (same die) | 25,660 typical (same die) |
| Transceiver Channels | 8 (up to 3.1875 Gbps) | 8 (up to 3.1875 Gbps) | 8 (up to 3.1875 Gbps) | 8 (up to 3.1875 Gbps) | 8 (up to 3.1875 Gbps) |
| Speed Grade | C5 (commercial, mid) | C5 (same) | C5 (same) | C5 (same) | C7 (faster) |
| Lead-Free (N suffix) | Yes (lead-free) | Yes | Yes | No (with Pb) | No (with Pb) |
| PCI Express Hard IP | x1, x4 endpoints | x1, x4 endpoints | x1, x4 endpoints | x1, x4 endpoints | x1, x4 endpoints |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| User I/O Count (approx) | ~480 | ~640 | ~400 | ~640 | ~400 |
Key Differentiators
- 8 transceivers in FBGA-800 footprint vs. SGX40 family at FBGA-1020 (vs EP1SGX40DF1020C5N)
- Hard PCI Express IP block eliminates soft-logic overhead (vs Cyclone IV GX (EP4CGX30))
- 3.1875 Gbps data rate vs. 1 Gbps legacy FPGA SERDES (vs Cyclone (non-GX) FPGAs)
Design Notes
The EP1SGX25DF800C5N's FineLine BGA-800 package requires a high-layer-count PCB (typically 8 to 12 layers) with a dedicated ground plane adjacent to the transceiver balls to maintain 100-ohm differential impedance on GXB_TX/RX pairs. Estimated: with 31x31 mm package, the breakout region needs ~6 mm fan-out with 0.2 mm via-in-pad microvias. Use a low-loss dielectric (Df < 0.012 at 1 GHz) for backplane-side traces; the device supports up to 3.1875 Gbps which places it in the 3 dB insertion-loss envelope of standard FR-4 for runs under 20 inches.
Each transceiver channel requires a low-jitter reference clock, typically 100 MHz to 156.25 MHz depending on the protocol (PCIe uses 100 MHz, gigabit Ethernet uses 62.5 MHz or 125 MHz). Estimated jitter budget per Altera Stratix GX handbook: total TX jitter < 0.35 UI peak-to-peak at 3.125 Gbps with 8b/10b encoding. Use a dedicated PLL output for the reference clock buffer rather than a general-purpose clock pin, and route REFCLK as a 50-ohm SE controlled-impedance trace with no stubs.
Do not apply power to VCC before VCCIO is stable, or before MSEL configuration pins are tied to the correct mode-select value - this can cause high inrush on the I/O banks and trigger CMOS latch-up. Always configure unused transceivers to power-down mode (PCS reset, PMA in reset) via the Quartus II device options; leaving them in unknown state draws 30-50 mA per channel. Verify bitstream CRC after every configuration - the MSEL pins select the configuration scheme (Passive Serial, Passive Parallel, Fast Passive Parallel, JTAG), and a wrong MSEL setting causes silent configuration failure.
The FBGA-800 package has an estimated theta_JA of ~15 C/W with standard JEDEC JESD51-9 airflow of 200 LFM, but 8 active transceivers at 3.1875 Gbps can dissipate 1.5-2 W from the SERDES alone. Estimated total device power: 5-8 W typical for moderate logic utilization. Provide a thermal pad or thermal via array under the package center (4x4 via grid, 0.3 mm drill) and ensure the PCB has adequate copper area on top and inner layers for heat spreading.
Compliance Information
RoHS compliance inferred from N suffix (lead-free finish). REACH, halogen-free, and conflict-mineral declarations were not located in the verified data. Not AEC-Q100 qualified (commercial-grade FPGA).
