EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
Référence : EP1SGX25DF800I6N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1720 | $17 200,00 |
| 25 | $1620 | $40 500,00 |
| 50 | $1535 | $76 750,00 |
| 100 | $1450 | $145 000,00 |
EP1SGX25DF800I6N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy the high-performance, low-volume tier of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), bridging the gap between ASICs and microcontrollers for applications that demand parallel processing, deterministic timing, and reconfigurable hardware acceleration.
The Stratix GX architecture embeds up to 22 DSP blocks, TriMatrix memory with up to 2 Mbits of RAM, and high-speed I/O elements supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also integrates a hard PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II), and 8 source-synchronous channels for high-speed parallel expansion. The transceiver block supports multiple protocol data rates including 1.25 Gbps, 2.5 Gbps, and 3.1875 Gbps with built-in 8B/10B encoding.
Typical Stratix GX deployment scenarios include multi-gigabit serial backplanes in telecom switches, 10-Gigabit Ethernet MAC/PHY bridging, SONET/SDH framer interfaces, and custom high-speed bus bridges in storage and broadcast equipment. The -6 speed grade (I6N) indicates an industrial temperature range of -40C to +100C with a moderate speed bin suitable for production-grade designs.
When designing with this device, ensure that the high-speed transceiver channels are routed with controlled-impedance differential pairs (typically 100 ohm differential) and that the on-chip PLL reference clock jitter meets the protocol-specific mask. Adequate decoupling (bulk + 0.1 uF + 0.01 uF) is critical near the transceiver power pins. This page synthesizes distributor pricing, pin-compatible Stratix GX family members, and practical design notes not consolidated in the original Altera datasheet.
Alternatives de remplacement direct pour EP1SGX25DF800I6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25DF800I6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, DSP Blocks, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25DF800C6N
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1SGX25DF800C5N
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP1SGX25DF672C7N
✅ Remplacement direct✓ En stock
$245 / unité
Voir la fiche technique →EP1SGX25DF672I6N
✅ Remplacement direct✓ En stock
$298 / unité
Voir la fiche technique →EP1SGX25CF672I6
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP1SGX25DF800I6N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Transceiver Channels | 4 to 20 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps per channel |
| CDR / SERDES | Embedded clock-data recovery and SERDES |
| Memory | TriMatrix memory, up to 2 Mbits |
| DSP Blocks | Up to 22 DSP blocks |
| Hard IP | PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) |
| Source-Synchronous Channels | 8 channels |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Boîtier | 800-pin FineLine BGA (DF800) |
| Speed Grade | -6 (production grade) |
| Temperature Range | Industrial -40C to +100C |
| Protocol Support | Gigabit Ethernet, SONET/SDH, PCI Express, custom serial |
Guide de configuration des broches du EP1SGX25DF800I6N 800-pin fineline bga (df800)
Configuration des broches du EP1SGX25DF800I6N (boîtier 800-pin fineline bga (df800)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX25DF800I6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX25DF800I6N convient pour 7 applications: 10G / Multi-Gigabit Backplane Routing, SONET / SDH Framer Interfaces, Storage Area Network (SAN) Bridges, PCI Express Endpoint / Root Complex, Broadcast Video Processing, Industrial Test & Measurement Instrumentation, Aerospace & Defense High-Speed Links.
10G / Multi-Gigabit Backplane Routing
The EP1SGX25DF800I6N integrates up to 20 transceiver channels at 3.1875 Gbps each, providing the channel density needed for multi-gigabit serial backplanes in core routers, switches, and ATCA chassis. The on-chip CDR, 8B/10B encoder, and rate-matching FIFO simplify PHY implementation, eliminating the external SERDES ICs and reducing BOM cost by 30-50% versus a discrete transceiver approach.
Recommandé
SONET / SDH Framer Interfaces
The Stratix GX transceiver block supports OC-48 (2.488 Gbps) and OC-96 rates that map directly to SONET/SDH framer interfaces in optical transport equipment. The device's built-in 8B/10B coding, programmable pre-emphasis, and adjustable receiver equalization compensate for FR-4 backplane loss, while the industrial temperature grade (-40C to +100C) suits outdoor telecom cabinets.
Recommandé
Storage Area Network (SAN) Bridges
The EP1SGX25DF800I6N's high-speed transceivers enable SAS, SATA, Fibre Channel, and custom serial bridges for enterprise storage arrays. Its hard PCI Express endpoint PHY supports x4 PCIe at 10 Gbps aggregate, allowing direct host interface integration, while the TriMatrix memory blocks (up to 2 Mbits) provide buffering for protocol translation. The -6 industrial speed grade handles demanding thermal environments.
Recommandé
PCI Express Endpoint / Root Complex
The hard PCI Express PHY integrated in the Stratix GX family supports endpoint and root-complex configurations at x1 / x4 lane widths up to 2.5 Gbps per lane. This eliminates the need for an external PCIe PHY IC, reducing board area and BOM. Combined with the TriMatrix memory and 22 DSP blocks, the device serves as a complete PCIe card controller in test, instrumentation, and telecom applications.
Recommandé
Broadcast Video Processing
The Stratix GX DSP blocks and high-speed serial I/O make the EP1SGX25DF800I6N well suited for HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) video processing, frame synchronizers, and broadcast routers. The 8 source-synchronous channels support parallel LVDS interfaces to camera sensors and HDMI transmitters. Industrial temperature rating supports live-event broadcast equipment.
Recommandé
Industrial Test & Measurement Instrumentation
The industrial -40C to +100C temperature range and the high-speed transceivers of the EP1SGX25DF800I6N make it suitable for portable protocol analyzers, oscilloscope acquisition modules, and bit-error-rate testers in industrial labs. The on-chip DSP blocks accelerate real-time protocol decoding, while the 800-pin BGA package supports the high pin count required by parallel test interfaces.
Recommandé
Aerospace & Defense High-Speed Links
The EP1SGX25DF800I6N's industrial temperature range and rugged BGA package suit aerospace and defense applications such as avionics data buses, radar signal processing, and secure communications. The transceiver block supports custom serial protocols used in MIL-STD-1553 derivatives and proprietary high-speed links. Note that this is a commercial-grade part; full MIL-PRF qualification requires a different part designation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25DF800I6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25DF800C6N | EP1SGX25DF800C5N | EP1SGX25DF672C7N | EP1SGX25DF672I6N | EP1SGX25CF672I6 |
|---|---|---|---|---|---|---|
| Package | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-672 (DF672) | FineLine BGA-672 (DF672) | FineLine BGA-672 (CF672) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | -6 (production) | -6 (production) | -5 (slower) | -7 (faster) | -6 (production) | -6 (production) |
| Family / Family Member | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 |
| Pin Count | 800 | 800 | 800 | 672 | 672 | 672 |
| Lifecycle Status (2026) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Transceiver Data Rate | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps |
Principaux différenciateurs
- Industrial temperature grade with -6 speed (vs EP1SGX25DF800C6N)
- Faster speed grade with industrial temperature (vs EP1SGX25DF800C5N)
- Larger 800-pin BGA footprint with full transceiver count (vs EP1SGX25DF672C7N)
Notes de conception
Route all high-speed transceiver channels as 100 ohm differential pairs with controlled impedance. Use a stripline or microstrip stack-up with reference planes on adjacent layers; maintain 8x to 10x trace width to dielectric thickness for microstrip. The CDR performance depends on intra-pair skew below 5 ps, so use length matching within 0.5 mm across all TX/RX pairs. AC-couple the lines with 100 nF 0402 capacitors if the protocol requires it (PCIe, XAUI).
Place a 100 uF bulk tantalum plus 10 uF and 0.1 uF ceramic capacitors within 5 mm of each VCC/GND pin pair. The transceiver supply (VCCE_GXB) is sensitive to switching noise; isolate it from the logic supply with a ferrite bead and a dedicated regulator (Linear Technology LT1963-1.5 / equivalent). Insufficient decoupling is the #1 cause of marginal BER performance in production. Always verify VCCE_GXB ripple is below 50 mVpp at full data rate.
Do not exceed the Stratix GX maximum data rate of 3.1875 Gbps per channel - the -6 speed grade is the upper limit. Using 'fastest' prototype settings in Quartus can lead to non-deterministic bit errors in production. When migrating between EP1SGX25 DF800 and DF672 packages, the bitstream is identical but the configuration pin assignments and JTAG ID differ. Re-generate the SOF/POF file after each package change.
The 800-pin FineLine BGA has a thermal resistance of approximately 0.6 C/W junction-to-case with proper thermal via array. Use 4 thermal vias per pad array under the die footprint, connecting the BGA thermal pad to the inner ground plane. With a 30 W typical Stratix GX power dissipation, expect 18C junction rise above case temperature - well within the 100C industrial limit.
Informations de conformité
RoHS / lead-free per Altera product markings (Pb-free BGA finish). Reach compliance and conflict-minerals statement per Intel Product Change Notification archive. AEC-Q100 is not applicable - this is a logic IC for telecom and industrial. Halogen-free status [DATA_NEEDED].
