H5TC4G63CFR-H9I - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
料号： H5TC4G63CFR-H9I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $7.2 | $7,200.00 |
H5TC4G63CFR-H9I 概述
DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture, transferring data on both edges of the clock. It is a key component in computing systems, providing high bandwidth and low power operation for main memory applications. The H5TC4G63CFR-H9I is part of the DDR3L family, which is widely used in servers, networking equipment, and embedded systems.
Key features include a 4Gb density, 16-bit data bus, and support for data rates up to 1866 Mbps (PC3-14900). The device operates from a 1.35V supply, with an I/O voltage of 1.35V. It features programmable CAS latency, burst lengths of 8 and 4, and on-die termination (ODT) for improved signal integrity. The industrial temperature grade ensures reliable operation in harsh environments.
The H5TC4G63CFR-H9I uses a high-performance CMOS process and advanced circuit design to achieve fast access times and low power consumption. It includes auto-refresh and self-refresh modes to minimize power in standby. The TFBGA package provides excellent thermal and electrical performance, making it suitable for space-constrained designs.
Typical applications include main memory for industrial PCs, networking routers, and embedded computing modules. Its low voltage and industrial temperature range make it ideal for applications requiring reliability and energy efficiency.
When designing with this device, ensure proper decoupling and signal integrity practices are followed. The DDR3L interface requires careful PCB layout to maintain signal quality at high speeds.
直接替换替代料： H5TC4G63CFR-H9I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： H5TC4G63CFR-H9I （相同外形与封装尺寸） ——差异在于 Package, Memory Type, Density, Supply Voltage, Burst Length.
快速对比工具——选择替代料号进行并排对比：
H5TC4G63CFR-H9L
✅ 直接替换📋 参考替代料（不在目录中）
H5TC4G63CFR-PBA
✅ 直接替换✓ 有现货
$6.23 / 个
查看数据手册 →H5TC4G63CFR-RDAR
✅ 直接替换📋 参考替代料（不在目录中）
H5TQ4G63EFR-TEI
⚡ 相同封装📋 参考替代料（不在目录中）
MT41K256M16HA-125
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.3636 / 个
查看数据手册 →K4B4G1646E-BYMA
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$14.3182 / 个
查看数据手册 →H5TC4G63CFR-H9I 最大额定值与电气特性
| 存储器类型 | DDR3L SDRAM |
| Density | 4 Gb |
| 存储组织 | 256M x 16 |
| 电源电压 | 1.35 V |
| I/O Voltage | 1.35 V |
| 数据速率 | 1866 Mbps (PC3-14900) |
| 封装 | 96-ball TFBGA |
| Temperature Grade | Industrial (-40°C to +95°C) |
| Number of Terminals | 96 |
| Memory Width | 16 bits |
| Lead-Free | Yes |
| 无卤 | Yes |
| RoHS Compliant | Yes |
| CAS 延迟 | Programmable (11, 12, 13) |
| Burst Length | 8 and 4 |
| On-Die Termination | Yes |
| Refresh Modes | Auto-refresh, Self-refresh |
H5TC4G63CFR-H9I 引脚配置
| 引脚 A1 | VDD — Power supply (1.35V) |
| 引脚 A2 | DQ0 — Data input/output 0 |
| 引脚 A3 | DQ1 — Data input/output 1 |
| 引脚 A4 | VSS — Ground |
| 引脚 A5 | DQ2 — Data input/output 2 |
| 引脚 A6 | DQ3 — Data input/output 3 |
| 引脚 A7 | VDD — Power supply (1.35V) |
| 引脚 A8 | DQ4 — Data input/output 4 |
| 引脚 A9 | DQ5 — Data input/output 5 |
| 引脚 A10 | VSS — Ground |
| 引脚 A11 | DQ6 — Data input/output 6 |
| 引脚 A12 | DQ7 — Data input/output 7 |
典型应用
H5TC4G63CFR-H9I 适用于 6 应用s: Industrial PCs, Networking Equipment, Embedded Computing Modules, Automotive Infotainment, Medical Devices, Test and Measurement.
Industrial PCs
The H5TC4G63CFR-H9I provides 4Gb DDR3L memory for industrial PCs, offering high bandwidth and low power consumption. Its industrial temperature range (-40°C to +95°C) ensures reliable operation in factory automation and process control systems. The 1.35V operation reduces heat generation, improving system longevity. With a data rate of 1866 Mbps, it supports demanding real-time applications. The 96-ball TFBGA package allows compact designs, ideal for space-constrained industrial enclosures.
推荐
Networking Equipment
In networking routers and switches, the H5TC4G63CFR-H9I provides high-density, low-power memory for packet buffering and routing tables. Its 1866 Mbps data rate ensures fast data throughput, while 1.35V operation reduces power consumption in always-on equipment. The industrial temperature grade supports outdoor and harsh environments. The 16-bit wide interface simplifies PCB layout, and the TFBGA package offers good thermal performance for continuous operation.
推荐
Embedded Computing Modules
The H5TC4G63CFR-H9I is ideal for embedded computing modules such as single-board computers and COM Express. Its 4Gb density provides ample memory for operating systems and applications. The low 1.35V supply reduces power consumption, extending battery life in portable systems. The industrial temperature range ensures reliability in automotive and aerospace applications. The 96-ball TFBGA package enables compact module designs, and the high data rate supports multimedia processing.
推荐
Automotive Infotainment
In automotive infotainment systems, the H5TC4G63CFR-H9I provides reliable memory for navigation, audio, and video processing. Its industrial temperature range (-40°C to +95°C) meets automotive requirements. The 1.35V operation reduces power consumption, important for vehicle electrical systems. The high data rate supports smooth multimedia playback. The TFBGA package withstands vibration and thermal cycling, making it suitable for in-vehicle electronics.
推荐
Medical Devices
The H5TC4G63CFR-H9I is used in medical devices such as patient monitors and diagnostic equipment, where reliable memory is critical. Its industrial temperature range ensures operation in various clinical environments. The low power consumption is beneficial for battery-powered portable devices. The high data rate supports real-time data processing. The lead-free and halogen-free construction meets medical environmental standards.
推荐
Test and Measurement
In test and measurement equipment, the H5TC4G63CFR-H9I provides high-speed memory for data acquisition and signal processing. Its 1866 Mbps data rate enables fast sampling and analysis. The industrial temperature range supports operation in lab and field environments. The 1.35V supply reduces power consumption, and the TFBGA package offers good signal integrity for high-frequency measurements.
推荐
推荐产品汇总
工程参考数据： H5TC4G63CFR-H9I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | H5TC4G63CFR-H9L | H5TC4G63CFR-PBA | H5TC4G63CFR-RDAR | H5TQ4G63EFR-TEI | MT41K256M16HA-125 | K4B4G1646E-BYMA |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Micron Technology | Samsung Electronics |
| Memory Type | DDR3L | DDR3L | DDR3L | DDR3L | DDR3 | DDR3L | DDR3L |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.5V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps (likely) | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1866 Mbps |
| Temperature Grade | Industrial (-40°C to +95°C) | Commercial (0°C to +95°C) | Industrial (likely) | Automotive (-40°C to +105°C) | Industrial (likely) | Industrial (option) | Industrial (option) |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
关键差异点
- Industrial temperature grade （对比 H5TC4G63CFR-H9L)
- Low voltage operation (1.35V) （对比 H5TQ4G63EFR-TEI)
- High data rate (1866 Mbps) （对比 MT41K256M16HA-125)
设计说明
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 20 mils for data and address/command groups. Use a solid ground plane and place decoupling capacitors (0.1uF and 0.01uF) close to each VDD and VDDQ pin. Follow the layout guidelines in the SK hynix DDR3L design guide.
The H5TC4G63CFR-H9I requires a clean 1.35V supply. Use a low-noise LDO or a switching regulator with low ripple. Ensure the power supply can handle peak current during refresh and active modes. Add bulk capacitance (10uF) near the memory to handle transient currents.
The industrial temperature range (-40°C to +95°C) requires proper thermal management. Ensure adequate airflow or heatsinking in high-ambient environments. The TFBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature to avoid exceeding the maximum rating.
合规信息
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for this non-automotive part.
