H5TC4G63CFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63CFR-PBA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.39 | $10.39 |
| 10 | $9.5 | $95.00 |
| 100 | $8.2 | $820.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.5 | $6,500.00 |
Drop-in alternatives for H5TC4G63CFR-PBA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
H5TC4G63EFR-PBA
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63AFR-PBA
β Drop-Inβ 99,999 In Stock
$5.9 / Unit
View Datasheet βH5TC4G63CFR-RDA
β Drop-Inπ Reference alternative (not in catalog)
MT41K256M16RE-15E
β Drop-Inπ Reference alternative (not in catalog)
D2516EC4BXGGB
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-PBA Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Organization | 256M x 16 |
| Total Density | 4Gb |
| Supply Voltage (VDD/VDDQ) | 1.35V +0.100/-0.067V |
| Package | FBGA-96 (PBGA96) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] |
| Data Rate | [DATA_NEEDED: data rate (e.g., 1600 Mbps)] |
| CAS Latency | [DATA_NEEDED: CAS latency] |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Differential Clock Inputs | Yes (CK, CK) |
| Differential Data Strobe | Yes (DQS, DQS) |
| On-Die Termination (ODT) | Dynamic |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| Auto Self-Refresh | Yes |
| Data Mask (DM) | Yes |
H5TC4G63CFR-PBA Pin Configuration
| Pin A1 | VDD β Power supply |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | DQ1 β Data input/output 1 |
| Pin A4 | VSS β Ground |
| Pin A5 | DQ2 β Data input/output 2 |
| Pin A6 | DQ3 β Data input/output 3 |
| Pin A7 | VDDQ β I/O power supply |
| Pin A8 | DQ4 β Data input/output 4 |
| Pin A9 | DQ5 β Data input/output 5 |
| Pin A10 | VSS β Ground |
| Pin A11 | DQ6 β Data input/output 6 |
| Pin A12 | DQ7 β Data input/output 7 |
| Pin B1 | VSS β Ground |
| Pin B2 | DQS β Data strobe |
| Pin B3 | DQS# β Data strobe complement |
| Pin B4 | VDDQ β I/O power supply |
| Pin B5 | DM β Data mask |
| Pin B6 | VSS β Ground |
| Pin B7 | CK β Clock input |
| Pin B8 | CK# β Clock input complement |
| Pin B9 | VDD β Power supply |
| Pin B10 | CKE β Clock enable |
| Pin B11 | CS# β Chip select |
| Pin B12 | RAS# β Row address strobe |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-PBA is suitable for 6 applications: Laptop Memory, Networking Equipment, Industrial PCs, Embedded Systems, Servers and Data Centers, Consumer Electronics.
Laptop Memory
The H5TC4G63CFR-PBA is ideal for laptop memory modules due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and 256Mx16 organization provide sufficient capacity for mainstream laptops. The FBGA-96 package allows compact module designs, and the differential clock and strobe signals ensure reliable high-speed data transfer. When used in SODIMM modules, it supports dual-channel configurations for improved performance. The low voltage also reduces heat generation, which is critical in thin and light laptops.
Recommended
Networking Equipment
In networking equipment such as routers and switches, the H5TC4G63CFR-PBA provides high-density, low-power memory for packet buffering and routing tables. Its 1.35V operation reduces power consumption in always-on devices, and the 4Gb capacity supports large forwarding databases. The on-die termination and ZQ calibration improve signal integrity at high data rates, which is essential for reliable operation in noisy environments. The FBGA-96 package is suitable for compact line cards, and the differential clock inputs ensure precise timing for high-speed interfaces.
Recommended
Industrial PCs
The H5TC4G63CFR-PBA is well-suited for industrial PCs that require reliable, low-power memory in harsh environments. Its 1.35V operation reduces heat and power consumption, which is beneficial in sealed enclosures. The 4Gb density provides ample memory for industrial control applications, and the FBGA-96 package offers robustness against vibration. The device's support for auto self-refresh and write leveling ensures data integrity during temperature fluctuations. Industrial PCs can leverage the DDR3L interface for compatibility with a wide range of processors.
Recommended
Embedded Systems
For embedded systems, the H5TC4G63CFR-PBA offers a balance of capacity, power efficiency, and performance. Its 1.35V operation is ideal for battery-powered devices, and the 4Gb density supports complex applications like real-time data processing. The FBGA-96 package is compact, enabling small form-factor designs. The device's differential clock and data strobe improve signal integrity, which is critical for high-speed operation in space-constrained layouts. Embedded systems can benefit from the low power consumption to extend battery life.
Recommended
Servers and Data Centers
In servers and data centers, the H5TC4G63CFR-PBA can be used in memory modules for high-density, low-power operation. Its 1.35V voltage reduces power consumption, which is critical in large-scale deployments. The 4Gb density allows for high-capacity modules, and the FBGA-96 package supports standard DIMM designs. The device's on-die termination and ZQ calibration ensure signal integrity at high speeds, which is essential for server memory channels. The low operating voltage also reduces cooling requirements.
Recommended
Consumer Electronics
The H5TC4G63CFR-PBA is suitable for consumer electronics such as smart TVs, set-top boxes, and gaming consoles, where low power and high performance are required. Its 1.35V operation reduces energy consumption, and the 4Gb density supports multimedia applications. The FBGA-96 package is compact, enabling slim device designs. The differential clock and data strobe ensure reliable high-speed data transfer for video and audio processing. Consumer devices benefit from the low voltage to meet energy efficiency standards.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-PBA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63EFR-PBA | H5TC4G63AFR-PBA | H5TC4G63CFR-RDA | MT41K256M16RE-15E | D2516EC4BXGGB |
|---|---|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Micron | Samsung |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 1866 Mbps (from part number) | [DATA_NEEDED] |
| Operating Temperature | [DATA_NEEDED] | 0Β°C to +95Β°C (from LCSC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low voltage operation at 1.35V (vs MT41K256M16RE-15E)
- Lead-free and halogen-free (vs D2516EC4BXGGB)
- Proven reliability from SK Hynix (vs MT41K256M16RE-15E)
Design Notes
For high-speed DDR3L designs, maintain controlled impedance for DQ, DQS, and clock traces. Use 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within +/- 0.5mm for data and strobe pairs. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
Use the on-die termination (ODT) feature to improve signal integrity by matching impedance at the receiver. Configure ODT settings via the mode registers. Ensure the differential clock (CK/CK#) is routed as a tightly coupled pair with proper termination. Avoid stubs on high-speed traces to reduce reflections.
The H5TC4G63CFR-PBA operates at 1.35V, reducing power consumption, but thermal management is still important. Ensure adequate airflow or a thermal pad to the PCB for heat dissipation. The FBGA-96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. Keep the operating temperature within the specified range to ensure reliability.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. No AEC-Q100 qualification as it is a memory component.
