H5TC4G63CFR-H9I - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
N.º da peça: H5TC4G63CFR-H9I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.5 | $4.250,00 |
| 1.000 | $7.2 | $7.200,00 |
H5TC4G63CFR-H9I Visão geral
DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture, transferring data on both edges of the clock. It is a key component in computing systems, providing high bandwidth and low power operation for main memory applications. The H5TC4G63CFR-H9I is part of the DDR3L family, which is widely used in servers, networking equipment, and embedded systems.
Key features include a 4Gb density, 16-bit data bus, and support for data rates up to 1866 Mbps (PC3-14900). The device operates from a 1.35V supply, with an I/O voltage of 1.35V. It features programmable CAS latency, burst lengths of 8 and 4, and on-die termination (ODT) for improved signal integrity. The industrial temperature grade ensures reliable operation in harsh environments.
The H5TC4G63CFR-H9I uses a high-performance CMOS process and advanced circuit design to achieve fast access times and low power consumption. It includes auto-refresh and self-refresh modes to minimize power in standby. The TFBGA package provides excellent thermal and electrical performance, making it suitable for space-constrained designs.
Typical applications include main memory for industrial PCs, networking routers, and embedded computing modules. Its low voltage and industrial temperature range make it ideal for applications requiring reliability and energy efficiency.
When designing with this device, ensure proper decoupling and signal integrity practices are followed. The DDR3L interface requires careful PCB layout to maintain signal quality at high speeds.
Alternativas drop-in para H5TC4G63CFR-H9I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com H5TC4G63CFR-H9I (mesmo formato e footprint) — diferindo em Package, Memory Type, Density, Supply Voltage, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
H5TC4G63CFR-H9L
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
H5TC4G63CFR-PBA
✅ Drop-In✓ Em estoque
$6.23 / unidade
Ver ficha técnica →H5TC4G63CFR-RDAR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
H5TQ4G63EFR-TEI
⚡ Mesmo encapsulamento📋 Alternativa de referência (fora do catálogo)
MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →H5TC4G63CFR-H9I Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4 Gb |
| Organização da memória | 256M x 16 |
| Tensão de alimentação | 1.35 V |
| I/O Voltage | 1.35 V |
| Taxa de dados | 1866 Mbps (PC3-14900) |
| Encapsulamento | 96-ball TFBGA |
| Temperature Grade | Industrial (-40°C to +95°C) |
| Number of Terminals | 96 |
| Memory Width | 16 bits |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
| RoHS Compliant | Yes |
| Latência CAS | Programmable (11, 12, 13) |
| Burst Length | 8 and 4 |
| On-Die Termination | Yes |
| Refresh Modes | Auto-refresh, Self-refresh |
Configuração de pinos do H5TC4G63CFR-H9I
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply (1.35V) |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
Aplicações típicas
H5TC4G63CFR-H9I é adequado para 6 aplicaçãos: Industrial PCs, Networking Equipment, Embedded Computing Modules, Automotive Infotainment, Medical Devices, Test and Measurement.
Industrial PCs
The H5TC4G63CFR-H9I provides 4Gb DDR3L memory for industrial PCs, offering high bandwidth and low power consumption. Its industrial temperature range (-40°C to +95°C) ensures reliable operation in factory automation and process control systems. The 1.35V operation reduces heat generation, improving system longevity. With a data rate of 1866 Mbps, it supports demanding real-time applications. The 96-ball TFBGA package allows compact designs, ideal for space-constrained industrial enclosures.
Recomendado
Networking Equipment
In networking routers and switches, the H5TC4G63CFR-H9I provides high-density, low-power memory for packet buffering and routing tables. Its 1866 Mbps data rate ensures fast data throughput, while 1.35V operation reduces power consumption in always-on equipment. The industrial temperature grade supports outdoor and harsh environments. The 16-bit wide interface simplifies PCB layout, and the TFBGA package offers good thermal performance for continuous operation.
Recomendado
Embedded Computing Modules
The H5TC4G63CFR-H9I is ideal for embedded computing modules such as single-board computers and COM Express. Its 4Gb density provides ample memory for operating systems and applications. The low 1.35V supply reduces power consumption, extending battery life in portable systems. The industrial temperature range ensures reliability in automotive and aerospace applications. The 96-ball TFBGA package enables compact module designs, and the high data rate supports multimedia processing.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the H5TC4G63CFR-H9I provides reliable memory for navigation, audio, and video processing. Its industrial temperature range (-40°C to +95°C) meets automotive requirements. The 1.35V operation reduces power consumption, important for vehicle electrical systems. The high data rate supports smooth multimedia playback. The TFBGA package withstands vibration and thermal cycling, making it suitable for in-vehicle electronics.
Recomendado
Medical Devices
The H5TC4G63CFR-H9I is used in medical devices such as patient monitors and diagnostic equipment, where reliable memory is critical. Its industrial temperature range ensures operation in various clinical environments. The low power consumption is beneficial for battery-powered portable devices. The high data rate supports real-time data processing. The lead-free and halogen-free construction meets medical environmental standards.
Recomendado
Test and Measurement
In test and measurement equipment, the H5TC4G63CFR-H9I provides high-speed memory for data acquisition and signal processing. Its 1866 Mbps data rate enables fast sampling and analysis. The industrial temperature range supports operation in lab and field environments. The 1.35V supply reduces power consumption, and the TFBGA package offers good signal integrity for high-frequency measurements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para H5TC4G63CFR-H9I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | H5TC4G63CFR-H9L | H5TC4G63CFR-PBA | H5TC4G63CFR-RDAR | H5TQ4G63EFR-TEI | MT41K256M16HA-125 | K4B4G1646E-BYMA |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Micron Technology | Samsung Electronics |
| Memory Type | DDR3L | DDR3L | DDR3L | DDR3L | DDR3 | DDR3L | DDR3L |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.5V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps (likely) | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1866 Mbps |
| Temperature Grade | Industrial (-40°C to +95°C) | Commercial (0°C to +95°C) | Industrial (likely) | Automotive (-40°C to +105°C) | Industrial (likely) | Industrial (option) | Industrial (option) |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
Principais diferenciais
- Industrial temperature grade (vs H5TC4G63CFR-H9L)
- Low voltage operation (1.35V) (vs H5TQ4G63EFR-TEI)
- High data rate (1866 Mbps) (vs MT41K256M16HA-125)
Notas de projeto
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 20 mils for data and address/command groups. Use a solid ground plane and place decoupling capacitors (0.1uF and 0.01uF) close to each VDD and VDDQ pin. Follow the layout guidelines in the SK hynix DDR3L design guide.
The H5TC4G63CFR-H9I requires a clean 1.35V supply. Use a low-noise LDO or a switching regulator with low ripple. Ensure the power supply can handle peak current during refresh and active modes. Add bulk capacitance (10uF) near the memory to handle transient currents.
The industrial temperature range (-40°C to +95°C) requires proper thermal management. Ensure adequate airflow or heatsinking in high-ambient environments. The TFBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature to avoid exceeding the maximum rating.
Informações de conformidade
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for this non-automotive part.
