NT5CC256M16CN-FLB - 4Gb DDR3L SDRAM | Nanya Technology
料号： NT5CC256M16CN-FLB ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $10.1 | $1,010.00 |
| 500 | $9.3 | $4,650.00 |
| 1,000 | $8.6 | $8,600.00 |
NT5CC256M16CN-FLB 概述
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining high bandwidth. It is part of the DDR3 memory family, which uses an 8n prefetch architecture and on-die termination (ODT) to improve signal integrity at high speeds. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical.
Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), programmable CAS latency (CL) of 9, 10, 11, and 13, and a self-refresh mode for low-power standby. The device supports auto precharge, write leveling, and ZQ calibration for improved signal integrity. It also includes a temperature sensor for thermal management, enabling dynamic refresh rate adjustment.
The NT5CC256M16CN-FLB uses a 30nm-class process technology, achieving high density with low power consumption. The FBGA package provides excellent thermal and electrical performance, with a thermal resistance of . The device is RoHS compliant and supports industrial temperature ranges from -40°C to +95°C (case temperature).
Typical applications include solid-state drives (SSDs), network routers, industrial PCs, automotive infotainment systems, and embedded computing platforms. Its low voltage and high speed make it ideal for power-sensitive designs that require high memory bandwidth.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal reflections. The device requires a stable 1.35V supply and a reference voltage (VREF) for the address/command bus.
直接替换替代料： NT5CC256M16CN-FLB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： NT5CC256M16CN-FLB （相同外形与封装尺寸） ——差异在于 Package, Supply Voltage, Data Rate, Density, Memory Type.
快速对比工具——选择替代料号进行并排对比：
NT5CC256M16ER-FLB
✅ 直接替换📋 参考替代料（不在目录中）
NT5CC256M16ER-EK
✅ 直接替换✓ 有现货
$24 / 个
查看数据手册 →MT41K256M16HA-125
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.3636 / 个
查看数据手册 →K4B4G1646E-BYMA
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$14.3182 / 个
查看数据手册 →IS43TR16512B-125K
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
NT5CC256M16CN-FLB 最大额定值与电气特性
| 存储器类型 | DDR3L SDRAM |
| Density | 4 Gb (256M x 16) |
| 电源电压 | 1.35 V (DDR3L) |
| 数据速率 | 1866 Mbps (PC3-14900) |
| I/O Width | 16 bits |
| Internal Banks | 8 |
| CAS 延迟 | 9, 10, 11, 13 |
| Burst Length | 8, 4 (with burst chop) |
| 封装 | 96-ball FBGA |
| 工作温度 | -40°C to +95°C (case) |
| RoHS | Compliant |
| Self-Refresh | Yes (auto and manual) |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
NT5CC256M16CN-FLB 引脚配置
| 引脚 A1 | VDD — Power supply (1.35V) |
| 引脚 A2 | DQ0 — Data I/O 0 |
| 引脚 A3 | DQ1 — Data I/O 1 |
| 引脚 B1 | VSS — Ground |
| 引脚 B2 | DQ2 — Data I/O 2 |
| 引脚 B3 | DQ3 — Data I/O 3 |
| 引脚 C1 | VDDQ — I/O power supply |
| 引脚 C2 | DQ4 — Data I/O 4 |
| 引脚 C3 | DQ5 — Data I/O 5 |
| 引脚 D1 | VSSQ — I/O ground |
| 引脚 D2 | DQ6 — Data I/O 6 |
| 引脚 D3 | DQ7 — Data I/O 7 |
典型应用
NT5CC256M16CN-FLB 适用于 6 应用s: Solid-State Drives (SSDs), Network Routers, Industrial PCs, Automotive Infotainment, Embedded Computing, Test and Measurement Equipment.
Solid-State Drives (SSDs)
The NT5CC256M16CN-FLB provides high-density, low-power memory for SSD controllers, enabling fast data caching and buffering. Its 1866 Mbps data rate ensures high throughput, while the 1.35V supply reduces power consumption, extending battery life in portable SSDs. The industrial temperature range supports rugged environments.
推荐
Network Routers
In network routers, the NT5CC256M16CN-FLB serves as packet buffer memory, handling high-speed data streams. Its high bandwidth and low latency are critical for routing decisions. The 96-ball FBGA package allows compact PCB layouts, and the 1.35V operation reduces heat generation in dense networking equipment.
推荐
Industrial PCs
The NT5CC256M16CN-FLB is ideal for industrial PCs requiring reliable memory in harsh environments. Its -40°C to +95°C operating range ensures functionality in extreme conditions. The low power consumption and high speed make it suitable for real-time control and data acquisition systems.
推荐
Automotive Infotainment
For automotive infotainment systems, the NT5CC256M16CN-FLB provides the memory bandwidth needed for navigation, multimedia, and connectivity features. Its automotive temperature grade and low power consumption are essential for in-vehicle electronics. The device supports fast boot times and smooth graphics rendering.
推荐
Embedded Computing
The NT5CC256M16CN-FLB is used in embedded computing modules for IoT gateways and edge devices. Its low voltage and high density enable compact designs with long battery life. The device's self-refresh and temperature sensor features support power management in always-on applications.
推荐
Test and Measurement Equipment
In test and measurement equipment, the NT5CC256M16CN-FLB provides high-speed data buffering for oscilloscopes and logic analyzers. Its high data rate and low latency ensure accurate signal capture. The industrial temperature range allows operation in lab and field environments.
推荐
推荐产品汇总
工程参考数据： NT5CC256M16CN-FLB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | NT5CC256M16ER-FLB | NT5CC256M16ER-EK | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| CAS Latency | 9, 10, 11, 13 | 9, 10, 11, 13 | 9, 10, 11 | 9, 10, 11 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
关键差异点
- Industrial temperature range （对比 NT5CC256M16ER-EK)
- Higher data rate （对比 MT41K256M16HA-125)
- Same-brand drop-in （对比 NT5CC256M16ER-FLB)
设计说明
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to reduce signal integrity issues. Follow the layout guidelines in the Nanya datasheet for impedance matching.
The FBGA package has a thermal resistance of [DATA_NEEDED: theta_JA]. Ensure adequate airflow or a heatsink if the device is operated at high temperatures and high data rates. Monitor the case temperature to stay within the -40°C to +95°C range.
Ensure the VREF voltage is properly generated and decoupled. Incorrect VREF can cause data corruption. Also, verify that the memory controller supports DDR3L (1.35V) operation; mixing with 1.5V DDR3 can damage the device.
合规信息
RoHS compliance is indicated in the datasheet. Other compliance details are not specified in the provided data.
