NT5CC256M16CN-FLB - 4Gb DDR3L SDRAM | Nanya Technology
Référence : NT5CC256M16CN-FLB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $10.1 | $1 010,00 |
| 500 | $9.3 | $4 650,00 |
| 1 000 | $8.6 | $8 600,00 |
NT5CC256M16CN-FLB Présentation
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining high bandwidth. It is part of the DDR3 memory family, which uses an 8n prefetch architecture and on-die termination (ODT) to improve signal integrity at high speeds. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical.
Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), programmable CAS latency (CL) of 9, 10, 11, and 13, and a self-refresh mode for low-power standby. The device supports auto precharge, write leveling, and ZQ calibration for improved signal integrity. It also includes a temperature sensor for thermal management, enabling dynamic refresh rate adjustment.
The NT5CC256M16CN-FLB uses a 30nm-class process technology, achieving high density with low power consumption. The FBGA package provides excellent thermal and electrical performance, with a thermal resistance of . The device is RoHS compliant and supports industrial temperature ranges from -40°C to +95°C (case temperature).
Typical applications include solid-state drives (SSDs), network routers, industrial PCs, automotive infotainment systems, and embedded computing platforms. Its low voltage and high speed make it ideal for power-sensitive designs that require high memory bandwidth.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal reflections. The device requires a stable 1.35V supply and a reference voltage (VREF) for the address/command bus.
Alternatives de remplacement direct pour NT5CC256M16CN-FLB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec NT5CC256M16CN-FLB (même facteur de forme et même empreinte) — différant par Package, Supply Voltage, Data Rate, Density, Memory Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
NT5CC256M16ER-FLB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
NT5CC256M16ER-EK
✅ Remplacement direct✓ En stock
$24 / unité
Voir la fiche technique →MT41K256M16HA-125
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.3636 / unité
Voir la fiche technique →K4B4G1646E-BYMA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.3182 / unité
Voir la fiche technique →IS43TR16512B-125K
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
NT5CC256M16CN-FLB Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Density | 4 Gb (256M x 16) |
| Tension d'alimentation | 1.35 V (DDR3L) |
| Débit de données | 1866 Mbps (PC3-14900) |
| I/O Width | 16 bits |
| Internal Banks | 8 |
| Latence CAS | 9, 10, 11, 13 |
| Burst Length | 8, 4 (with burst chop) |
| Boîtier | 96-ball FBGA |
| Température de fonctionnement | -40°C to +95°C (case) |
| RoHS | Compliant |
| Self-Refresh | Yes (auto and manual) |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
Configuration des broches de NT5CC256M16CN-FLB
| Broche A1 | VDD — Power supply (1.35V) |
| Broche A2 | DQ0 — Data I/O 0 |
| Broche A3 | DQ1 — Data I/O 1 |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ2 — Data I/O 2 |
| Broche B3 | DQ3 — Data I/O 3 |
| Broche C1 | VDDQ — I/O power supply |
| Broche C2 | DQ4 — Data I/O 4 |
| Broche C3 | DQ5 — Data I/O 5 |
| Broche D1 | VSSQ — I/O ground |
| Broche D2 | DQ6 — Data I/O 6 |
| Broche D3 | DQ7 — Data I/O 7 |
Applications typiques
NT5CC256M16CN-FLB convient pour 6 applications: Solid-State Drives (SSDs), Network Routers, Industrial PCs, Automotive Infotainment, Embedded Computing, Test and Measurement Equipment.
Solid-State Drives (SSDs)
The NT5CC256M16CN-FLB provides high-density, low-power memory for SSD controllers, enabling fast data caching and buffering. Its 1866 Mbps data rate ensures high throughput, while the 1.35V supply reduces power consumption, extending battery life in portable SSDs. The industrial temperature range supports rugged environments.
Recommandé
Network Routers
In network routers, the NT5CC256M16CN-FLB serves as packet buffer memory, handling high-speed data streams. Its high bandwidth and low latency are critical for routing decisions. The 96-ball FBGA package allows compact PCB layouts, and the 1.35V operation reduces heat generation in dense networking equipment.
Recommandé
Industrial PCs
The NT5CC256M16CN-FLB is ideal for industrial PCs requiring reliable memory in harsh environments. Its -40°C to +95°C operating range ensures functionality in extreme conditions. The low power consumption and high speed make it suitable for real-time control and data acquisition systems.
Recommandé
Automotive Infotainment
For automotive infotainment systems, the NT5CC256M16CN-FLB provides the memory bandwidth needed for navigation, multimedia, and connectivity features. Its automotive temperature grade and low power consumption are essential for in-vehicle electronics. The device supports fast boot times and smooth graphics rendering.
Recommandé
Embedded Computing
The NT5CC256M16CN-FLB is used in embedded computing modules for IoT gateways and edge devices. Its low voltage and high density enable compact designs with long battery life. The device's self-refresh and temperature sensor features support power management in always-on applications.
Recommandé
Test and Measurement Equipment
In test and measurement equipment, the NT5CC256M16CN-FLB provides high-speed data buffering for oscilloscopes and logic analyzers. Its high data rate and low latency ensure accurate signal capture. The industrial temperature range allows operation in lab and field environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour NT5CC256M16CN-FLB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | NT5CC256M16ER-FLB | NT5CC256M16ER-EK | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| CAS Latency | 9, 10, 11, 13 | 9, 10, 11, 13 | 9, 10, 11 | 9, 10, 11 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Industrial temperature range (vs NT5CC256M16ER-EK)
- Higher data rate (vs MT41K256M16HA-125)
- Same-brand drop-in (vs NT5CC256M16ER-FLB)
Notes de conception
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to reduce signal integrity issues. Follow the layout guidelines in the Nanya datasheet for impedance matching.
The FBGA package has a thermal resistance of [DATA_NEEDED: theta_JA]. Ensure adequate airflow or a heatsink if the device is operated at high temperatures and high data rates. Monitor the case temperature to stay within the -40°C to +95°C range.
Ensure the VREF voltage is properly generated and decoupled. Incorrect VREF can cause data corruption. Also, verify that the memory controller supports DDR3L (1.35V) operation; mixing with 1.5V DDR3 can damage the device.
Informations de conformité
RoHS compliance is indicated in the datasheet. Other compliance details are not specified in the provided data.
