NT5CC256M16CN-FLB - 4Gb DDR3L SDRAM | Nanya Technology
부품 번호: NT5CC256M16CN-FLB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $10.1 | $1,010.00 |
| 500 | $9.3 | $4,650.00 |
| 1,000 | $8.6 | $8,600.00 |
NT5CC256M16CN-FLB 개요
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining high bandwidth. It is part of the DDR3 memory family, which uses an 8n prefetch architecture and on-die termination (ODT) to improve signal integrity at high speeds. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical.
Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), programmable CAS latency (CL) of 9, 10, 11, and 13, and a self-refresh mode for low-power standby. The device supports auto precharge, write leveling, and ZQ calibration for improved signal integrity. It also includes a temperature sensor for thermal management, enabling dynamic refresh rate adjustment.
The NT5CC256M16CN-FLB uses a 30nm-class process technology, achieving high density with low power consumption. The FBGA package provides excellent thermal and electrical performance, with a thermal resistance of . The device is RoHS compliant and supports industrial temperature ranges from -40°C to +95°C (case temperature).
Typical applications include solid-state drives (SSDs), network routers, industrial PCs, automotive infotainment systems, and embedded computing platforms. Its low voltage and high speed make it ideal for power-sensitive designs that require high memory bandwidth.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal reflections. The device requires a stable 1.35V supply and a reference voltage (VREF) for the address/command bus.
드롭인 대체품: NT5CC256M16CN-FLB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: NT5CC256M16CN-FLB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Supply Voltage, Data Rate, Density, Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
NT5CC256M16ER-FLB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
NT5CC256M16ER-EK
✅ 드롭인✓ 재고 있음
$24 / 개
데이터시트 보기 →MT41K256M16HA-125
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.3636 / 개
데이터시트 보기 →K4B4G1646E-BYMA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.3182 / 개
데이터시트 보기 →IS43TR16512B-125K
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
NT5CC256M16CN-FLB 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| Density | 4 Gb (256M x 16) |
| 공급 전압 | 1.35 V (DDR3L) |
| 데이터 속도 | 1866 Mbps (PC3-14900) |
| I/O Width | 16 bits |
| Internal Banks | 8 |
| CAS 레이턴시 | 9, 10, 11, 13 |
| Burst Length | 8, 4 (with burst chop) |
| 패키지 | 96-ball FBGA |
| 동작 온도 | -40°C to +95°C (case) |
| RoHS | Compliant |
| Self-Refresh | Yes (auto and manual) |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
NT5CC256M16CN-FLB 핀 구성
| 핀 A1 | VDD — Power supply (1.35V) |
| 핀 A2 | DQ0 — Data I/O 0 |
| 핀 A3 | DQ1 — Data I/O 1 |
| 핀 B1 | VSS — Ground |
| 핀 B2 | DQ2 — Data I/O 2 |
| 핀 B3 | DQ3 — Data I/O 3 |
| 핀 C1 | VDDQ — I/O power supply |
| 핀 C2 | DQ4 — Data I/O 4 |
| 핀 C3 | DQ5 — Data I/O 5 |
| 핀 D1 | VSSQ — I/O ground |
| 핀 D2 | DQ6 — Data I/O 6 |
| 핀 D3 | DQ7 — Data I/O 7 |
일반적인 애플리케이션
NT5CC256M16CN-FLB 적합 용도: 6 애플리케이션s: Solid-State Drives (SSDs), Network Routers, Industrial PCs, Automotive Infotainment, Embedded Computing, Test and Measurement Equipment.
Solid-State Drives (SSDs)
The NT5CC256M16CN-FLB provides high-density, low-power memory for SSD controllers, enabling fast data caching and buffering. Its 1866 Mbps data rate ensures high throughput, while the 1.35V supply reduces power consumption, extending battery life in portable SSDs. The industrial temperature range supports rugged environments.
추천
Network Routers
In network routers, the NT5CC256M16CN-FLB serves as packet buffer memory, handling high-speed data streams. Its high bandwidth and low latency are critical for routing decisions. The 96-ball FBGA package allows compact PCB layouts, and the 1.35V operation reduces heat generation in dense networking equipment.
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Industrial PCs
The NT5CC256M16CN-FLB is ideal for industrial PCs requiring reliable memory in harsh environments. Its -40°C to +95°C operating range ensures functionality in extreme conditions. The low power consumption and high speed make it suitable for real-time control and data acquisition systems.
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Automotive Infotainment
For automotive infotainment systems, the NT5CC256M16CN-FLB provides the memory bandwidth needed for navigation, multimedia, and connectivity features. Its automotive temperature grade and low power consumption are essential for in-vehicle electronics. The device supports fast boot times and smooth graphics rendering.
추천
Embedded Computing
The NT5CC256M16CN-FLB is used in embedded computing modules for IoT gateways and edge devices. Its low voltage and high density enable compact designs with long battery life. The device's self-refresh and temperature sensor features support power management in always-on applications.
추천
Test and Measurement Equipment
In test and measurement equipment, the NT5CC256M16CN-FLB provides high-speed data buffering for oscilloscopes and logic analyzers. Its high data rate and low latency ensure accurate signal capture. The industrial temperature range allows operation in lab and field environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: NT5CC256M16CN-FLB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | NT5CC256M16ER-FLB | NT5CC256M16ER-EK | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| CAS Latency | 9, 10, 11, 13 | 9, 10, 11, 13 | 9, 10, 11 | 9, 10, 11 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Industrial temperature range (vs NT5CC256M16ER-EK)
- Higher data rate (vs MT41K256M16HA-125)
- Same-brand drop-in (vs NT5CC256M16ER-FLB)
설계 노트
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to reduce signal integrity issues. Follow the layout guidelines in the Nanya datasheet for impedance matching.
The FBGA package has a thermal resistance of [DATA_NEEDED: theta_JA]. Ensure adequate airflow or a heatsink if the device is operated at high temperatures and high data rates. Monitor the case temperature to stay within the -40°C to +95°C range.
Ensure the VREF voltage is properly generated and decoupled. Incorrect VREF can cause data corruption. Also, verify that the memory controller supports DDR3L (1.35V) operation; mixing with 1.5V DDR3 can damage the device.
규정 준수 정보
RoHS compliance is indicated in the datasheet. Other compliance details are not specified in the provided data.
