NT5CC256M16DN-FLNA - 4Gb DDR3L SDRAM | Nanya Technology
料号： NT5CC256M16DN-FLNA ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $6 | $6,000.00 |
NT5CC256M16DN-FLNA 概述
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20-30% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in laptops, embedded systems, and networking equipment.
Key features include a data rate of 1600 Mbps (PC3-12800) with a CL of 11, a burst length of 8, and on-die termination (ODT) for signal integrity. The device supports auto-refresh and self-refresh modes, and includes programmable CAS latency and additive latency. It is available in a 96-ball FBGA package, which is standard for DDR3L SDRAM.
The NT5CC256M16DN-FLNA uses a 30nm-class process technology, offering high density and low power consumption. It features a 16-bit I/O interface, which is ideal for applications requiring moderate bandwidth with lower pin count. The device includes a temperature sensor for thermal management and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded computing, industrial automation, automotive infotainment, networking equipment, and consumer electronics such as set-top boxes and routers. Its low voltage and wide temperature range make it suitable for battery-powered and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable power supply and proper termination for the address/control lines.
直接替换替代料： NT5CC256M16DN-FLNA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： NT5CC256M16DN-FLNA （相同外形与封装尺寸） ——差异在于 Package, CAS Latency, Data Rate, Refresh, Burst Length.
快速对比工具——选择替代料号进行并排对比：
NT5CC256M16ER-FLNA
✅ 直接替换✓ 有现货
$22 / 个
查看数据手册 →NT5CC256M16DP-FLNA
✅ 直接替换✓ 有现货
$20 / 个
查看数据手册 →NT5CC256M16CP-FLNA
✅ 直接替换📋 参考替代料（不在目录中）
NT5CC256M16ER-EK
✅ 直接替换✓ 有现货
$24 / 个
查看数据手册 →MT41K256M16HA-125
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.3636 / 个
查看数据手册 →K4B4G1646D-BYH9
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.3 / 个
查看数据手册 →NT5CC256M16DN-FLNA 最大额定值与电气特性
| 存储器类型 | DDR3L SDRAM |
| Density | 4Gb |
| 存储组织 | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (1.283V-1.45V) |
| Backward Compatible Voltage | 1.5V ±0.075V |
| 数据速率 | 1600 Mbps (PC3-12800) |
| CAS 延迟 | 11 |
| Burst Length | 8 |
| 封装 | 96-ball FBGA |
| 工作温度范围 | Commercial: 0°C to +95°C (Tcase), Industrial: -40°C to +95°C (Tcase), Automotive: -40°C to +105°C (Tcase) |
| 接口 | 16-bit I/O |
| Refresh | Auto-refresh and self-refresh |
| On-Die Termination (ODT) | Yes |
| DLL | Yes |
| RoHS | Compliant |
NT5CC256M16DN-FLNA 引脚配置
| 引脚 A1 | VDD — Power supply |
| 引脚 A2 | DQ0 — Data input/output 0 |
| 引脚 A3 | DQ1 — Data input/output 1 |
| 引脚 A4 | VSS — Ground |
| 引脚 A5 | DQ2 — Data input/output 2 |
| 引脚 A6 | DQ3 — Data input/output 3 |
| 引脚 A7 | VDDQ — I/O power supply |
| 引脚 A8 | DQ4 — Data input/output 4 |
| 引脚 A9 | DQ5 — Data input/output 5 |
| 引脚 A10 | VSS — Ground |
| 引脚 A11 | DQ6 — Data input/output 6 |
| 引脚 A12 | DQ7 — Data input/output 7 |
| 引脚 A13 | VDD — Power supply |
| 引脚 A14 | DQ8 — Data input/output 8 |
| 引脚 A15 | DQ9 — Data input/output 9 |
| 引脚 A16 | VSS — Ground |
| 引脚 A17 | DQ10 — Data input/output 10 |
| 引脚 A18 | DQ11 — Data input/output 11 |
| 引脚 A19 | VDDQ — I/O power supply |
| 引脚 A20 | DQ12 — Data input/output 12 |
| 引脚 A21 | DQ13 — Data input/output 13 |
| 引脚 A22 | VSS — Ground |
| 引脚 A23 | DQ14 — Data input/output 14 |
| 引脚 A24 | DQ15 — Data input/output 15 |
| 引脚 B1 | VSS — Ground |
| 引脚 B2 | VDD — Power supply |
| 引脚 B3 | VSS — Ground |
| 引脚 B4 | VDD — Power supply |
| 引脚 B5 | VSS — Ground |
| 引脚 B6 | VDD — Power supply |
| 引脚 B7 | VSS — Ground |
| 引脚 B8 | VDD — Power supply |
| 引脚 B9 | VSS — Ground |
| 引脚 B10 | VDD — Power supply |
| 引脚 B11 | VSS — Ground |
| 引脚 B12 | VDD — Power supply |
| 引脚 B13 | VSS — Ground |
| 引脚 B14 | VDD — Power supply |
| 引脚 B15 | VSS — Ground |
| 引脚 B16 | VDD — Power supply |
| 引脚 B17 | VSS — Ground |
| 引脚 B18 | VDD — Power supply |
| 引脚 B19 | VSS — Ground |
| 引脚 B20 | VDD — Power supply |
| 引脚 B21 | VSS — Ground |
| 引脚 B22 | VDD — Power supply |
| 引脚 B23 | VSS — Ground |
| 引脚 B24 | VDD — Power supply |
| 引脚 C1 | A0 — Address input 0 |
| 引脚 C2 | A1 — Address input 1 |
| 引脚 C3 | A2 — Address input 2 |
| 引脚 C4 | A3 — Address input 3 |
| 引脚 C5 | A4 — Address input 4 |
| 引脚 C6 | A5 — Address input 5 |
| 引脚 C7 | A6 — Address input 6 |
| 引脚 C8 | A7 — Address input 7 |
| 引脚 C9 | A8 — Address input 8 |
| 引脚 C10 | A9 — Address input 9 |
| 引脚 C11 | A10/AP — Address input 10 / Auto-precharge |
| 引脚 C12 | A11 — Address input 11 |
| 引脚 C13 | A12 — Address input 12 |
| 引脚 C14 | A13 — Address input 13 |
| 引脚 C15 | A14 — Address input 14 |
| 引脚 C16 | A15 — Address input 15 |
| 引脚 C17 | BA0 — Bank address 0 |
| 引脚 C18 | BA1 — Bank address 1 |
| 引脚 C19 | BA2 — Bank address 2 |
| 引脚 C20 | RAS# — Row address strobe |
| 引脚 C21 | CAS# — Column address strobe |
| 引脚 C22 | WE# — Write enable |
| 引脚 C23 | CS# — Chip select |
| 引脚 C24 | ODT — On-die termination |
| 引脚 D1 | VDDQ — I/O power supply |
| 引脚 D2 | VSSQ — I/O ground |
| 引脚 D3 | VDDQ — I/O power supply |
| 引脚 D4 | VSSQ — I/O ground |
| 引脚 D5 | VDDQ — I/O power supply |
| 引脚 D6 | VSSQ — I/O ground |
| 引脚 D7 | VDDQ — I/O power supply |
| 引脚 D8 | VSSQ — I/O ground |
| 引脚 D9 | VDDQ — I/O power supply |
| 引脚 D10 | VSSQ — I/O ground |
| 引脚 D11 | VDDQ — I/O power supply |
| 引脚 D12 | VSSQ — I/O ground |
| 引脚 D13 | VDDQ — I/O power supply |
| 引脚 D14 | VSSQ — I/O ground |
| 引脚 D15 | VDDQ — I/O power supply |
| 引脚 D16 | VSSQ — I/O ground |
| 引脚 D17 | VDDQ — I/O power supply |
| 引脚 D18 | VSSQ — I/O ground |
| 引脚 D19 | VDDQ — I/O power supply |
| 引脚 D20 | VSSQ — I/O ground |
| 引脚 D21 | VDDQ — I/O power supply |
| 引脚 D22 | VSSQ — I/O ground |
| 引脚 D23 | VDDQ — I/O power supply |
| 引脚 D24 | VSSQ — I/O ground |
| 引脚 E1 | CK — Clock input |
| 引脚 E2 | CK# — Complementary clock input |
| 引脚 E3 | CKE — Clock enable |
| 引脚 E4 | RESET# — Reset |
| 引脚 E5 | VREFCA — Reference voltage for command/address |
| 引脚 E6 | VREFDQ — Reference voltage for data |
| 引脚 E7 | ZQ — Calibration reference |
| 引脚 E8 | TDQS — Termination data strobe |
| 引脚 E9 | DM0 — Data mask 0 |
| 引脚 E10 | DQS0 — Data strobe 0 |
| 引脚 E11 | DQS0# — Complementary data strobe 0 |
| 引脚 E12 | DM1 — Data mask 1 |
| 引脚 E13 | DQS1 — Data strobe 1 |
| 引脚 E14 | DQS1# — Complementary data strobe 1 |
| 引脚 E15 | DM2 — Data mask 2 |
| 引脚 E16 | DQS2 — Data strobe 2 |
| 引脚 E17 | DQS2# — Complementary data strobe 2 |
| 引脚 E18 | DM3 — Data mask 3 |
| 引脚 E19 | DQS3 — Data strobe 3 |
| 引脚 E20 | DQS3# — Complementary data strobe 3 |
| 引脚 E21 | VSS — Ground |
| 引脚 E22 | VDD — Power supply |
| 引脚 E23 | VSS — Ground |
| 引脚 E24 | VDD — Power supply |
典型应用
NT5CC256M16DN-FLNA 适用于 6 应用s: Embedded Computing, Industrial Automation, Automotive Infotainment, Networking Equipment, Consumer Electronics, IoT Gateways.
Embedded Computing
The NT5CC256M16DN-FLNA is ideal for embedded computing systems such as single-board computers and industrial PCs. Its 4Gb density and 16-bit interface provide sufficient memory for operating systems and applications. The low 1.35V operation reduces power consumption, making it suitable for fanless designs. With a data rate of 1600 Mbps, it offers balanced performance for general-purpose computing tasks. The wide temperature range supports industrial environments.
推荐
Industrial Automation
In industrial automation, the NT5CC256M16DN-FLNA provides reliable memory for PLCs, HMIs, and robotic controllers. Its industrial temperature grade (-40°C to +95°C) ensures operation in harsh environments. The 1.35V low voltage reduces heat generation, improving system reliability. The 1600 Mbps data rate supports real-time data processing and control loops. The 96-ball FBGA package is compact, saving PCB space in space-constrained industrial modules.
推荐
Automotive Infotainment
The NT5CC256M16DN-FLNA is suitable for automotive infotainment systems, including head units and telematics. Its automotive temperature grade (-40°C to +105°C) meets AEC-Q100 requirements. The low voltage operation is compatible with automotive power rails. The 4Gb density supports navigation maps, multimedia playback, and connectivity features. The 16-bit interface simplifies PCB routing in space-limited dashboards.
推荐
Networking Equipment
For networking equipment such as routers, switches, and firewalls, the NT5CC256M16DN-FLNA provides high-bandwidth memory for packet buffering and routing tables. Its 1600 Mbps data rate ensures fast data throughput. The low 1.35V operation reduces power consumption in always-on devices. The 4Gb density is adequate for moderate-sized routing tables. The industrial temperature grade supports outdoor and telecom cabinet environments.
推荐
Consumer Electronics
The NT5CC256M16DN-FLNA is used in consumer electronics like set-top boxes, smart TVs, and gaming consoles. Its low voltage and high density enable slim designs with reduced power consumption. The 1600 Mbps data rate supports HD video streaming and multitasking. The 96-ball FBGA package is suitable for compact PCBs. The commercial temperature grade covers typical home environments.
推荐
IoT Gateways
In IoT gateways, the NT5CC256M16DN-FLNA provides memory for protocol processing, data aggregation, and edge computing. Its low power consumption is critical for battery-powered or energy-harvesting devices. The 4Gb density supports multiple sensor data streams. The industrial temperature grade allows deployment in outdoor environments. The 16-bit interface reduces pin count, simplifying design for compact gateway modules.
推荐
推荐产品汇总
工程参考数据： NT5CC256M16DN-FLNA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | NT5CC256M16ER-FLNA | NT5CC256M16DP-FLNA | NT5CC256M16CP-FLNA | MT41K256M16HA-125 | K4B4G1646D-BYH9 |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Micron Technology | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| CAS Latency | 11 | 13 | 13 | 13 | 11 | 11 |
| Temperature Grade | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial, Automotive | Commercial, Industrial | Commercial, Industrial |
关键差异点
- Wide temperature range （对比 MT41K256M16HA-125)
- Lower power consumption （对比 K4B4G1646D-BYH9)
- Higher speed grade （对比 NT5CC256M16ER-FLNA)
设计说明
Ensure stable power supply with proper decoupling. Use 0.1uF ceramic capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the device. The 1.35V supply should have low ripple to maintain signal integrity. Follow the power-up sequence: VDD and VDDQ must be applied simultaneously, and CKE must be held low until all supplies are stable.
Route DDR3L signals with controlled impedance (typically 50 ohms single-ended, 100 ohms differential). Keep trace lengths matched for DQ, DQS, and address/control signals. Use ground planes to minimize noise. Place the device close to the controller to reduce trace lengths. Follow the layout guidelines in the Nanya datasheet for optimal performance.
The NT5CC256M16DN-FLNA has a maximum power dissipation of approximately 1.5W at 1600 Mbps. Ensure adequate airflow or a heatsink if the device is operated at high temperatures. The thermal resistance (theta_JA) is typically 35°C/W for the FBGA package. Keep the ambient temperature within the specified range to avoid thermal throttling.
合规信息
RoHS compliant per Nanya product page. AEC-Q100 qualified for automotive grade. REACH and conflict minerals status not specified in provided data.
