NT5CC256M16CN-FLB - 4Gb DDR3L SDRAM | Nanya Technology
N.º da peça: NT5CC256M16CN-FLB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $10.1 | $1.010,00 |
| 500 | $9.3 | $4.650,00 |
| 1.000 | $8.6 | $8.600,00 |
NT5CC256M16CN-FLB Visão geral
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining high bandwidth. It is part of the DDR3 memory family, which uses an 8n prefetch architecture and on-die termination (ODT) to improve signal integrity at high speeds. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical.
Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), programmable CAS latency (CL) of 9, 10, 11, and 13, and a self-refresh mode for low-power standby. The device supports auto precharge, write leveling, and ZQ calibration for improved signal integrity. It also includes a temperature sensor for thermal management, enabling dynamic refresh rate adjustment.
The NT5CC256M16CN-FLB uses a 30nm-class process technology, achieving high density with low power consumption. The FBGA package provides excellent thermal and electrical performance, with a thermal resistance of . The device is RoHS compliant and supports industrial temperature ranges from -40°C to +95°C (case temperature).
Typical applications include solid-state drives (SSDs), network routers, industrial PCs, automotive infotainment systems, and embedded computing platforms. Its low voltage and high speed make it ideal for power-sensitive designs that require high memory bandwidth.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal reflections. The device requires a stable 1.35V supply and a reference voltage (VREF) for the address/command bus.
Alternativas drop-in para NT5CC256M16CN-FLB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CC256M16CN-FLB (mesmo formato e footprint) — diferindo em Package, Supply Voltage, Data Rate, Density, Memory Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CC256M16ER-FLB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
NT5CC256M16ER-EK
✅ Drop-In✓ Em estoque
$24 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →IS43TR16512B-125K
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
NT5CC256M16CN-FLB Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4 Gb (256M x 16) |
| Tensão de alimentação | 1.35 V (DDR3L) |
| Taxa de dados | 1866 Mbps (PC3-14900) |
| I/O Width | 16 bits |
| Internal Banks | 8 |
| Latência CAS | 9, 10, 11, 13 |
| Burst Length | 8, 4 (with burst chop) |
| Encapsulamento | 96-ball FBGA |
| Temperatura de operação | -40°C to +95°C (case) |
| RoHS | Compliant |
| Self-Refresh | Yes (auto and manual) |
| On-Die Termination | Yes (ODT) |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
Configuração de pinos do NT5CC256M16CN-FLB
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data I/O 0 |
| Pino A3 | DQ1 — Data I/O 1 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ2 — Data I/O 2 |
| Pino B3 | DQ3 — Data I/O 3 |
| Pino C1 | VDDQ — I/O power supply |
| Pino C2 | DQ4 — Data I/O 4 |
| Pino C3 | DQ5 — Data I/O 5 |
| Pino D1 | VSSQ — I/O ground |
| Pino D2 | DQ6 — Data I/O 6 |
| Pino D3 | DQ7 — Data I/O 7 |
Aplicações típicas
NT5CC256M16CN-FLB é adequado para 6 aplicaçãos: Solid-State Drives (SSDs), Network Routers, Industrial PCs, Automotive Infotainment, Embedded Computing, Test and Measurement Equipment.
Solid-State Drives (SSDs)
The NT5CC256M16CN-FLB provides high-density, low-power memory for SSD controllers, enabling fast data caching and buffering. Its 1866 Mbps data rate ensures high throughput, while the 1.35V supply reduces power consumption, extending battery life in portable SSDs. The industrial temperature range supports rugged environments.
Recomendado
Network Routers
In network routers, the NT5CC256M16CN-FLB serves as packet buffer memory, handling high-speed data streams. Its high bandwidth and low latency are critical for routing decisions. The 96-ball FBGA package allows compact PCB layouts, and the 1.35V operation reduces heat generation in dense networking equipment.
Recomendado
Industrial PCs
The NT5CC256M16CN-FLB is ideal for industrial PCs requiring reliable memory in harsh environments. Its -40°C to +95°C operating range ensures functionality in extreme conditions. The low power consumption and high speed make it suitable for real-time control and data acquisition systems.
Recomendado
Automotive Infotainment
For automotive infotainment systems, the NT5CC256M16CN-FLB provides the memory bandwidth needed for navigation, multimedia, and connectivity features. Its automotive temperature grade and low power consumption are essential for in-vehicle electronics. The device supports fast boot times and smooth graphics rendering.
Recomendado
Embedded Computing
The NT5CC256M16CN-FLB is used in embedded computing modules for IoT gateways and edge devices. Its low voltage and high density enable compact designs with long battery life. The device's self-refresh and temperature sensor features support power management in always-on applications.
Recomendado
Test and Measurement Equipment
In test and measurement equipment, the NT5CC256M16CN-FLB provides high-speed data buffering for oscilloscopes and logic analyzers. Its high data rate and low latency ensure accurate signal capture. The industrial temperature range allows operation in lab and field environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CC256M16CN-FLB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CC256M16ER-FLB | NT5CC256M16ER-EK | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| CAS Latency | 9, 10, 11, 13 | 9, 10, 11, 13 | 9, 10, 11 | 9, 10, 11 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Industrial temperature range (vs NT5CC256M16ER-EK)
- Higher data rate (vs MT41K256M16HA-125)
- Same-brand drop-in (vs NT5CC256M16ER-FLB)
Notas de projeto
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to reduce signal integrity issues. Follow the layout guidelines in the Nanya datasheet for impedance matching.
The FBGA package has a thermal resistance of [DATA_NEEDED: theta_JA]. Ensure adequate airflow or a heatsink if the device is operated at high temperatures and high data rates. Monitor the case temperature to stay within the -40°C to +95°C range.
Ensure the VREF voltage is properly generated and decoupled. Incorrect VREF can cause data corruption. Also, verify that the memory controller supports DDR3L (1.35V) operation; mixing with 1.5V DDR3 can damage the device.
Informações de conformidade
RoHS compliance is indicated in the datasheet. Other compliance details are not specified in the provided data.
