EP3C10F256I7 vs EP3C10F256C6 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3C10F256I7 بواسطة Intel و EP3C10F256C6 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3C10F256I7 | EP3C10F256C6 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | نشط |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 10,320 logic cells | — |
| Embedded Memory | 423,936 bits | — |
| I/O Count | 182 I/O pins | — |
| Total Terminals | 256 terminals | — |
| Package Type | 256-LBGA | — |
| Package Family | LBGA | — |
| Package Shape | Square | — |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| درجة حرارة التشغيل | -40°C to +125°C | -40 C to +125 C (industrial, suffix 'C') |
| Temperature Grade | Industrial | — |
| جهد التغذية | [DATA_NEEDED: supply voltage range] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Interface | [DATA_NEEDED: configuration interfaces] | — |
| Lead-Free Status | Lead Free | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free FBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Manufacturer Family | Cyclone III | — |
| Logic Block Count | 10,320 logic blocks | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Embedded 18x18 Multipliers | — | 23 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 182 |
| العلبة | — | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Speed Grade | — | 6 |
| مستوى MSL | — | 3 (168 hours) |