EP3C10F256I7 vs EP3C10F256C6 तुलना
विस्तृत दोनों ओर की तुलना EP3C10F256I7 द्वारा Intel और EP3C10F256C6 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3C10F256I7 | EP3C10F256C6 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | सक्रिय |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 10,320 logic cells | — |
| Embedded Memory | 423,936 bits | — |
| I/O Count | 182 I/O pins | — |
| Total Terminals | 256 terminals | — |
| Package Type | 256-LBGA | — |
| Package Family | LBGA | — |
| Package Shape | Square | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| ऑपरेटिंग तापमान | -40°C to +125°C | -40 C to +125 C (industrial, suffix 'C') |
| Temperature Grade | Industrial | — |
| सप्लाई वोल्टेज | [DATA_NEEDED: supply voltage range] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Interface | [DATA_NEEDED: configuration interfaces] | — |
| Lead-Free Status | Lead Free | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | Compliant (lead-free FBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Manufacturer Family | Cyclone III | — |
| Logic Block Count | 10,320 logic blocks | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Embedded 18x18 Multipliers | — | 23 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 182 |
| पैकेज | — | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Speed Grade | — | 6 |
| MSL स्तर | — | 3 (168 hours) |