EP3C10F256I7 vs EP3C10F256C6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C10F256I7 disebabkan oleh Intel dan EP3C10F256C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C10F256I7 EP3C10F256C6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
Logic Cells 10,320 logic cells —
Embedded Memory 423,936 bits —
I/O Count 182 I/O pins —
Total Terminals 256 terminals —
Package Type 256-LBGA —
Package Family LBGA —
Package Shape Square —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Terminal Form Ball —
Suhu Operasi -40°C to +125°C -40 C to +125 C (industrial, suffix 'C')
Temperature Grade Industrial —
Tegangan Pemberi Arus [DATA_NEEDED: supply voltage range] —
Core Voltage [DATA_NEEDED: core voltage] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
Lead-Free Status Lead Free —
Status RoHS [DATA_NEEDED: RoHS status] Compliant (lead-free FBGA)
REACH Status [DATA_NEEDED: REACH status] —
Manufacturer Family Cyclone III —
Logic Block Count 10,320 logic blocks —
Family — Cyclone III
Logic Elements (LE) — 10,320
Total Memory Bits — 423,936 bits
Embedded 18x18 Multipliers — 23
PLLs — 2
Maximum User I/Os — 182
Kemasan — 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
Core Voltage (VCCINT) — 1.15 V to 1.25 V (typ. 1.2 V)
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (bank-dependent)
Process Technology — 60 nm low-power CMOS
Configuration Memory — SRAM-based (external EPCS flash required)
Speed Grade — 6
Aras MSL — 3 (168 hours)

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