EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
MPN: EP1K30TI144-3N ✗ انتهى عمره الإنتاجيEP1K30TI144-3N نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
بدائل مباشرة لـ EP1K30TI144-3N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1K30TI144-3N (نفس عامل الشكل والبصمة) — يختلف في Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K30TI144-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TI144-3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TI144-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TC144-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TC144-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TI144-2NGA
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K30TI144-3N الحدود القصوى والخصائص الكهربائية
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| العلبة | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| نوع التركيب | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
تكوين أطراف EP1K30TI144-3N
| دبوس 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| دبوس 2 | I/O — User I/O pin 2 |
| دبوس 3 | I/O — User I/O pin 3 |
| دبوس 4 | I/O — User I/O pin 4 |
| دبوس 5 | I/O — User I/O pin 5 |
| دبوس 6 | I/O — User I/O pin 6 |
| دبوس 7 | I/O — User I/O pin 7 |
| دبوس 8 | I/O — User I/O pin 8 |
| دبوس 9 | I/O — User I/O pin 9 |
| دبوس 10 | I/O — User I/O pin 10 |
| دبوس 11 | I/O — User I/O pin 11 |
| دبوس 12 | I/O — User I/O pin 12 |
| دبوس 13 | I/O — User I/O pin 13 |
| دبوس 14 | I/O — User I/O pin 14 |
| دبوس 15 | GND — Ground reference |
| دبوس 16 | VCCINT — Core 2.5 V supply |
| دبوس 17 | I/O — User I/O pin 17 |
| دبوس 18 | I/O — User I/O pin 18 |
| دبوس 19 | I/O — User I/O pin 19 |
| دبوس 20 | I/O — User I/O pin 20 |
| دبوس 21 | I/O — User I/O pin 21 |
| دبوس 22 | I/O — User I/O pin 22 |
| دبوس 23 | I/O — User I/O pin 23 |
| دبوس 24 | I/O — User I/O pin 24 |
| دبوس 25 | I/O — User I/O pin 25 |
| دبوس 26 | I/O — User I/O pin 26 |
| دبوس 27 | I/O — User I/O pin 27 |
| دبوس 28 | I/O — User I/O pin 28 |
| دبوس 29 | I/O — User I/O pin 29 |
| دبوس 30 | I/O — User I/O pin 30 |
| دبوس 31 | I/O — User I/O pin 31 |
| دبوس 32 | I/O — User I/O pin 32 |
| دبوس 33 | I/O — User I/O pin 33 |
| دبوس 34 | GND — Ground reference |
| دبوس 35 | I/O — User I/O pin 35 |
| دبوس 36 | I/O — User I/O pin 36 |
| دبوس 37 | I/O — User I/O pin 37 |
| دبوس 38 | I/O — User I/O pin 38 |
| دبوس 39 | I/O — User I/O pin 39 |
| دبوس 40 | I/O — User I/O pin 40 |
| دبوس 41 | I/O — User I/O pin 41 |
| دبوس 42 | I/O — User I/O pin 42 |
| دبوس 43 | VCCIO — I/O supply voltage (MultiVolt) |
| دبوس 44 | I/O — User I/O pin 44 |
| دبوس 45 | I/O — User I/O pin 45 |
| دبوس 46 | I/O — User I/O pin 46 |
| دبوس 47 | I/O — User I/O pin 47 |
| دبوس 48 | I/O — User I/O pin 48 |
| دبوس 49 | I/O — User I/O pin 49 |
| دبوس 50 | I/O — User I/O pin 50 |
| دبوس 51 | I/O — User I/O pin 51 |
| دبوس 52 | I/O — User I/O pin 52 |
| دبوس 53 | I/O — User I/O pin 53 |
| دبوس 54 | I/O — User I/O pin 54 |
| دبوس 55 | I/O — User I/O pin 55 |
| دبوس 56 | I/O — User I/O pin 56 |
| دبوس 57 | I/O — User I/O pin 57 |
| دبوس 58 | I/O — User I/O pin 58 |
| دبوس 59 | I/O — User I/O pin 59 |
| دبوس 60 | I/O — User I/O pin 60 |
| دبوس 61 | I/O — User I/O pin 61 |
| دبوس 62 | I/O — User I/O pin 62 |
| دبوس 63 | I/O — User I/O pin 63 |
| دبوس 64 | I/O — User I/O pin 64 |
| دبوس 65 | I/O — User I/O pin 65 |
| دبوس 66 | I/O — User I/O pin 66 |
| دبوس 67 | I/O — User I/O pin 67 |
| دبوس 68 | I/O — User I/O pin 68 |
| دبوس 69 | I/O — User I/O pin 69 |
| دبوس 70 | I/O — User I/O pin 70 |
| دبوس 71 | I/O — User I/O pin 71 |
| دبوس 72 | I/O — User I/O pin 72 |
| دبوس 73 | GND — Ground reference |
| دبوس 74 | I/O — User I/O pin 74 |
| دبوس 75 | I/O — User I/O pin 75 |
| دبوس 76 | I/O — User I/O pin 76 |
| دبوس 77 | I/O — User I/O pin 77 |
| دبوس 78 | I/O — User I/O pin 78 |
| دبوس 79 | I/O — User I/O pin 79 |
| دبوس 80 | I/O — User I/O pin 80 |
| دبوس 81 | I/O — User I/O pin 81 |
| دبوس 82 | I/O — User I/O pin 82 |
| دبوس 83 | I/O — User I/O pin 83 |
| دبوس 84 | I/O — User I/O pin 84 |
| دبوس 85 | I/O — User I/O pin 85 |
| دبوس 86 | I/O — User I/O pin 86 |
| دبوس 87 | I/O — User I/O pin 87 |
| دبوس 88 | I/O — User I/O pin 88 |
| دبوس 89 | I/O — User I/O pin 89 |
| دبوس 90 | I/O — User I/O pin 90 |
| دبوس 91 | I/O — User I/O pin 91 |
| دبوس 92 | I/O — User I/O pin 92 |
| دبوس 93 | I/O — User I/O pin 93 |
| دبوس 94 | I/O — User I/O pin 94 |
| دبوس 95 | I/O — User I/O pin 95 |
| دبوس 96 | I/O — User I/O pin 96 |
| دبوس 97 | I/O — User I/O pin 97 |
| دبوس 98 | I/O — User I/O pin 98 |
| دبوس 99 | I/O — User I/O pin 99 |
| دبوس 100 | I/O — User I/O pin 100 |
| دبوس 101 | I/O — User I/O pin 101 |
| دبوس 102 | I/O — User I/O pin 102 |
| دبوس 103 | DCLK — Dedicated configuration clock input |
| دبوس 104 | DATA0 — Configuration data input (passive serial) |
| دبوس 105 | nCONFIG — Configuration control (active-low reset) |
| دبوس 106 | nSTATUS — Configuration status (active-low) |
| دبوس 107 | CONF_DONE — Configuration complete (open-drain) |
| دبوس 108 | TDI — JTAG Test Data In |
| دبوس 109 | TDO — JTAG Test Data Out |
| دبوس 110 | TMS — JTAG Test Mode Select |
| دبوس 111 | TCK — JTAG Test Clock |
| دبوس 112 | DEV_CLRn — Device clear (optional, may be unused) |
| دبوس 113 | DEV_OE — Device output enable (optional) |
| دبوس 114 | CLK0 — Dedicated clock input 0 / global |
| دبوس 115 | CLK1 — Dedicated clock input 1 / global |
| دبوس 116 | CLK2 — Dedicated clock input 2 / global |
| دبوس 117 | GND — Ground reference |
| دبوس 118 | VCCINT — Core 2.5 V supply |
| دبوس 119 | CLK3 — Dedicated clock input 3 / global |
| دبوس 120 | I/O — User I/O pin 120 |
| دبوس 121 | I/O — User I/O pin 121 |
| دبوس 122 | I/O — User I/O pin 122 |
| دبوس 123 | I/O — User I/O pin 123 |
| دبوس 124 | I/O — User I/O pin 124 |
| دبوس 125 | I/O — User I/O pin 125 |
| دبوس 126 | I/O — User I/O pin 126 |
| دبوس 127 | I/O — User I/O pin 127 |
| دبوس 128 | I/O — User I/O pin 128 |
| دبوس 129 | I/O — User I/O pin 129 |
| دبوس 130 | I/O — User I/O pin 130 |
| دبوس 131 | I/O — User I/O pin 131 |
| دبوس 132 | I/O — User I/O pin 132 |
| دبوس 133 | I/O — User I/O pin 133 |
| دبوس 134 | I/O — User I/O pin 134 |
| دبوس 135 | I/O — User I/O pin 135 |
| دبوس 136 | I/O — User I/O pin 136 |
| دبوس 137 | I/O — User I/O pin 137 |
| دبوس 138 | I/O — User I/O pin 138 |
| دبوس 139 | I/O — User I/O pin 139 |
| دبوس 140 | I/O — User I/O pin 140 |
| دبوس 141 | I/O — User I/O pin 141 |
| دبوس 142 | I/O — User I/O pin 142 |
| دبوس 143 | I/O — User I/O pin 143 |
| دبوس 144 | I/O — User I/O pin 144 |
التطبيقات النموذجية
EP1K30TI144-3N مناسب لـ 6 التطبيقs: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
موصى به
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
موصى به
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
موصى به
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
موصى به
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
موصى به
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1K30TI144-3N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
أبرز الفروقات
- Highest speed grade in the EP1K30 family (مقابلEP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (مقابلEP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (مقابلEP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (مقابلEP1K10TI144-2N (smaller family member))
ملاحظات التصميم
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
معلومات الامتثال
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
