EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
MPN: EP1K30TI144-3N ✗ סוף ייצורEP1K30TI144-3N סקירה
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
חלופות תחליף ישיר עבור EP1K30TI144-3N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP1K30TI144-3N (אותו גורם צורה וטביעת רגל) — שונים ב Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K30TI144-2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TI144-3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TI144-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TC144-3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TC144-2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TI144-2NGA
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1K30TI144-3N דירוגים מרביים ומאפיינים חשמליים
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| מארז | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| טמפרטורת פעולה | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| סוג הרכבה | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
תצורת פינים של EP1K30TI144-3N
| פין 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| פין 2 | I/O — User I/O pin 2 |
| פין 3 | I/O — User I/O pin 3 |
| פין 4 | I/O — User I/O pin 4 |
| פין 5 | I/O — User I/O pin 5 |
| פין 6 | I/O — User I/O pin 6 |
| פין 7 | I/O — User I/O pin 7 |
| פין 8 | I/O — User I/O pin 8 |
| פין 9 | I/O — User I/O pin 9 |
| פין 10 | I/O — User I/O pin 10 |
| פין 11 | I/O — User I/O pin 11 |
| פין 12 | I/O — User I/O pin 12 |
| פין 13 | I/O — User I/O pin 13 |
| פין 14 | I/O — User I/O pin 14 |
| פין 15 | GND — Ground reference |
| פין 16 | VCCINT — Core 2.5 V supply |
| פין 17 | I/O — User I/O pin 17 |
| פין 18 | I/O — User I/O pin 18 |
| פין 19 | I/O — User I/O pin 19 |
| פין 20 | I/O — User I/O pin 20 |
| פין 21 | I/O — User I/O pin 21 |
| פין 22 | I/O — User I/O pin 22 |
| פין 23 | I/O — User I/O pin 23 |
| פין 24 | I/O — User I/O pin 24 |
| פין 25 | I/O — User I/O pin 25 |
| פין 26 | I/O — User I/O pin 26 |
| פין 27 | I/O — User I/O pin 27 |
| פין 28 | I/O — User I/O pin 28 |
| פין 29 | I/O — User I/O pin 29 |
| פין 30 | I/O — User I/O pin 30 |
| פין 31 | I/O — User I/O pin 31 |
| פין 32 | I/O — User I/O pin 32 |
| פין 33 | I/O — User I/O pin 33 |
| פין 34 | GND — Ground reference |
| פין 35 | I/O — User I/O pin 35 |
| פין 36 | I/O — User I/O pin 36 |
| פין 37 | I/O — User I/O pin 37 |
| פין 38 | I/O — User I/O pin 38 |
| פין 39 | I/O — User I/O pin 39 |
| פין 40 | I/O — User I/O pin 40 |
| פין 41 | I/O — User I/O pin 41 |
| פין 42 | I/O — User I/O pin 42 |
| פין 43 | VCCIO — I/O supply voltage (MultiVolt) |
| פין 44 | I/O — User I/O pin 44 |
| פין 45 | I/O — User I/O pin 45 |
| פין 46 | I/O — User I/O pin 46 |
| פין 47 | I/O — User I/O pin 47 |
| פין 48 | I/O — User I/O pin 48 |
| פין 49 | I/O — User I/O pin 49 |
| פין 50 | I/O — User I/O pin 50 |
| פין 51 | I/O — User I/O pin 51 |
| פין 52 | I/O — User I/O pin 52 |
| פין 53 | I/O — User I/O pin 53 |
| פין 54 | I/O — User I/O pin 54 |
| פין 55 | I/O — User I/O pin 55 |
| פין 56 | I/O — User I/O pin 56 |
| פין 57 | I/O — User I/O pin 57 |
| פין 58 | I/O — User I/O pin 58 |
| פין 59 | I/O — User I/O pin 59 |
| פין 60 | I/O — User I/O pin 60 |
| פין 61 | I/O — User I/O pin 61 |
| פין 62 | I/O — User I/O pin 62 |
| פין 63 | I/O — User I/O pin 63 |
| פין 64 | I/O — User I/O pin 64 |
| פין 65 | I/O — User I/O pin 65 |
| פין 66 | I/O — User I/O pin 66 |
| פין 67 | I/O — User I/O pin 67 |
| פין 68 | I/O — User I/O pin 68 |
| פין 69 | I/O — User I/O pin 69 |
| פין 70 | I/O — User I/O pin 70 |
| פין 71 | I/O — User I/O pin 71 |
| פין 72 | I/O — User I/O pin 72 |
| פין 73 | GND — Ground reference |
| פין 74 | I/O — User I/O pin 74 |
| פין 75 | I/O — User I/O pin 75 |
| פין 76 | I/O — User I/O pin 76 |
| פין 77 | I/O — User I/O pin 77 |
| פין 78 | I/O — User I/O pin 78 |
| פין 79 | I/O — User I/O pin 79 |
| פין 80 | I/O — User I/O pin 80 |
| פין 81 | I/O — User I/O pin 81 |
| פין 82 | I/O — User I/O pin 82 |
| פין 83 | I/O — User I/O pin 83 |
| פין 84 | I/O — User I/O pin 84 |
| פין 85 | I/O — User I/O pin 85 |
| פין 86 | I/O — User I/O pin 86 |
| פין 87 | I/O — User I/O pin 87 |
| פין 88 | I/O — User I/O pin 88 |
| פין 89 | I/O — User I/O pin 89 |
| פין 90 | I/O — User I/O pin 90 |
| פין 91 | I/O — User I/O pin 91 |
| פין 92 | I/O — User I/O pin 92 |
| פין 93 | I/O — User I/O pin 93 |
| פין 94 | I/O — User I/O pin 94 |
| פין 95 | I/O — User I/O pin 95 |
| פין 96 | I/O — User I/O pin 96 |
| פין 97 | I/O — User I/O pin 97 |
| פין 98 | I/O — User I/O pin 98 |
| פין 99 | I/O — User I/O pin 99 |
| פין 100 | I/O — User I/O pin 100 |
| פין 101 | I/O — User I/O pin 101 |
| פין 102 | I/O — User I/O pin 102 |
| פין 103 | DCLK — Dedicated configuration clock input |
| פין 104 | DATA0 — Configuration data input (passive serial) |
| פין 105 | nCONFIG — Configuration control (active-low reset) |
| פין 106 | nSTATUS — Configuration status (active-low) |
| פין 107 | CONF_DONE — Configuration complete (open-drain) |
| פין 108 | TDI — JTAG Test Data In |
| פין 109 | TDO — JTAG Test Data Out |
| פין 110 | TMS — JTAG Test Mode Select |
| פין 111 | TCK — JTAG Test Clock |
| פין 112 | DEV_CLRn — Device clear (optional, may be unused) |
| פין 113 | DEV_OE — Device output enable (optional) |
| פין 114 | CLK0 — Dedicated clock input 0 / global |
| פין 115 | CLK1 — Dedicated clock input 1 / global |
| פין 116 | CLK2 — Dedicated clock input 2 / global |
| פין 117 | GND — Ground reference |
| פין 118 | VCCINT — Core 2.5 V supply |
| פין 119 | CLK3 — Dedicated clock input 3 / global |
| פין 120 | I/O — User I/O pin 120 |
| פין 121 | I/O — User I/O pin 121 |
| פין 122 | I/O — User I/O pin 122 |
| פין 123 | I/O — User I/O pin 123 |
| פין 124 | I/O — User I/O pin 124 |
| פין 125 | I/O — User I/O pin 125 |
| פין 126 | I/O — User I/O pin 126 |
| פין 127 | I/O — User I/O pin 127 |
| פין 128 | I/O — User I/O pin 128 |
| פין 129 | I/O — User I/O pin 129 |
| פין 130 | I/O — User I/O pin 130 |
| פין 131 | I/O — User I/O pin 131 |
| פין 132 | I/O — User I/O pin 132 |
| פין 133 | I/O — User I/O pin 133 |
| פין 134 | I/O — User I/O pin 134 |
| פין 135 | I/O — User I/O pin 135 |
| פין 136 | I/O — User I/O pin 136 |
| פין 137 | I/O — User I/O pin 137 |
| פין 138 | I/O — User I/O pin 138 |
| פין 139 | I/O — User I/O pin 139 |
| פין 140 | I/O — User I/O pin 140 |
| פין 141 | I/O — User I/O pin 141 |
| פין 142 | I/O — User I/O pin 142 |
| פין 143 | I/O — User I/O pin 143 |
| פין 144 | I/O — User I/O pin 144 |
יישומים טיפוסיים
EP1K30TI144-3N מתאים עבור 6 יישוםs: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
מומלץ
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
מומלץ
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
מומלץ
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
מומלץ
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
מומלץ
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP1K30TI144-3N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
מבדילים עיקריים
- Highest speed grade in the EP1K30 family (לעומתEP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (לעומתEP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (לעומתEP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (לעומתEP1K10TI144-2N (smaller family member))
הערות תכנון
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
מידע על תאימות
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
