EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
MPN: EP1K30TI144-3N ✗ پایان تولیدEP1K30TI144-3N نمای کلی
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
جایگزین‌های drop-in برای EP1K30TI144-3N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP1K30TI144-3N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K30TI144-2N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TI144-3
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TI144-2
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TC144-3N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TC144-2N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TI144-2NGA
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1K30TI144-3N حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| بسته‌بندی | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| دمای کاری | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| نوع نصب | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
پیکربندی پین EP1K30TI144-3N
| پین 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| پین 2 | I/O — User I/O pin 2 |
| پین 3 | I/O — User I/O pin 3 |
| پین 4 | I/O — User I/O pin 4 |
| پین 5 | I/O — User I/O pin 5 |
| پین 6 | I/O — User I/O pin 6 |
| پین 7 | I/O — User I/O pin 7 |
| پین 8 | I/O — User I/O pin 8 |
| پین 9 | I/O — User I/O pin 9 |
| پین 10 | I/O — User I/O pin 10 |
| پین 11 | I/O — User I/O pin 11 |
| پین 12 | I/O — User I/O pin 12 |
| پین 13 | I/O — User I/O pin 13 |
| پین 14 | I/O — User I/O pin 14 |
| پین 15 | GND — Ground reference |
| پین 16 | VCCINT — Core 2.5 V supply |
| پین 17 | I/O — User I/O pin 17 |
| پین 18 | I/O — User I/O pin 18 |
| پین 19 | I/O — User I/O pin 19 |
| پین 20 | I/O — User I/O pin 20 |
| پین 21 | I/O — User I/O pin 21 |
| پین 22 | I/O — User I/O pin 22 |
| پین 23 | I/O — User I/O pin 23 |
| پین 24 | I/O — User I/O pin 24 |
| پین 25 | I/O — User I/O pin 25 |
| پین 26 | I/O — User I/O pin 26 |
| پین 27 | I/O — User I/O pin 27 |
| پین 28 | I/O — User I/O pin 28 |
| پین 29 | I/O — User I/O pin 29 |
| پین 30 | I/O — User I/O pin 30 |
| پین 31 | I/O — User I/O pin 31 |
| پین 32 | I/O — User I/O pin 32 |
| پین 33 | I/O — User I/O pin 33 |
| پین 34 | GND — Ground reference |
| پین 35 | I/O — User I/O pin 35 |
| پین 36 | I/O — User I/O pin 36 |
| پین 37 | I/O — User I/O pin 37 |
| پین 38 | I/O — User I/O pin 38 |
| پین 39 | I/O — User I/O pin 39 |
| پین 40 | I/O — User I/O pin 40 |
| پین 41 | I/O — User I/O pin 41 |
| پین 42 | I/O — User I/O pin 42 |
| پین 43 | VCCIO — I/O supply voltage (MultiVolt) |
| پین 44 | I/O — User I/O pin 44 |
| پین 45 | I/O — User I/O pin 45 |
| پین 46 | I/O — User I/O pin 46 |
| پین 47 | I/O — User I/O pin 47 |
| پین 48 | I/O — User I/O pin 48 |
| پین 49 | I/O — User I/O pin 49 |
| پین 50 | I/O — User I/O pin 50 |
| پین 51 | I/O — User I/O pin 51 |
| پین 52 | I/O — User I/O pin 52 |
| پین 53 | I/O — User I/O pin 53 |
| پین 54 | I/O — User I/O pin 54 |
| پین 55 | I/O — User I/O pin 55 |
| پین 56 | I/O — User I/O pin 56 |
| پین 57 | I/O — User I/O pin 57 |
| پین 58 | I/O — User I/O pin 58 |
| پین 59 | I/O — User I/O pin 59 |
| پین 60 | I/O — User I/O pin 60 |
| پین 61 | I/O — User I/O pin 61 |
| پین 62 | I/O — User I/O pin 62 |
| پین 63 | I/O — User I/O pin 63 |
| پین 64 | I/O — User I/O pin 64 |
| پین 65 | I/O — User I/O pin 65 |
| پین 66 | I/O — User I/O pin 66 |
| پین 67 | I/O — User I/O pin 67 |
| پین 68 | I/O — User I/O pin 68 |
| پین 69 | I/O — User I/O pin 69 |
| پین 70 | I/O — User I/O pin 70 |
| پین 71 | I/O — User I/O pin 71 |
| پین 72 | I/O — User I/O pin 72 |
| پین 73 | GND — Ground reference |
| پین 74 | I/O — User I/O pin 74 |
| پین 75 | I/O — User I/O pin 75 |
| پین 76 | I/O — User I/O pin 76 |
| پین 77 | I/O — User I/O pin 77 |
| پین 78 | I/O — User I/O pin 78 |
| پین 79 | I/O — User I/O pin 79 |
| پین 80 | I/O — User I/O pin 80 |
| پین 81 | I/O — User I/O pin 81 |
| پین 82 | I/O — User I/O pin 82 |
| پین 83 | I/O — User I/O pin 83 |
| پین 84 | I/O — User I/O pin 84 |
| پین 85 | I/O — User I/O pin 85 |
| پین 86 | I/O — User I/O pin 86 |
| پین 87 | I/O — User I/O pin 87 |
| پین 88 | I/O — User I/O pin 88 |
| پین 89 | I/O — User I/O pin 89 |
| پین 90 | I/O — User I/O pin 90 |
| پین 91 | I/O — User I/O pin 91 |
| پین 92 | I/O — User I/O pin 92 |
| پین 93 | I/O — User I/O pin 93 |
| پین 94 | I/O — User I/O pin 94 |
| پین 95 | I/O — User I/O pin 95 |
| پین 96 | I/O — User I/O pin 96 |
| پین 97 | I/O — User I/O pin 97 |
| پین 98 | I/O — User I/O pin 98 |
| پین 99 | I/O — User I/O pin 99 |
| پین 100 | I/O — User I/O pin 100 |
| پین 101 | I/O — User I/O pin 101 |
| پین 102 | I/O — User I/O pin 102 |
| پین 103 | DCLK — Dedicated configuration clock input |
| پین 104 | DATA0 — Configuration data input (passive serial) |
| پین 105 | nCONFIG — Configuration control (active-low reset) |
| پین 106 | nSTATUS — Configuration status (active-low) |
| پین 107 | CONF_DONE — Configuration complete (open-drain) |
| پین 108 | TDI — JTAG Test Data In |
| پین 109 | TDO — JTAG Test Data Out |
| پین 110 | TMS — JTAG Test Mode Select |
| پین 111 | TCK — JTAG Test Clock |
| پین 112 | DEV_CLRn — Device clear (optional, may be unused) |
| پین 113 | DEV_OE — Device output enable (optional) |
| پین 114 | CLK0 — Dedicated clock input 0 / global |
| پین 115 | CLK1 — Dedicated clock input 1 / global |
| پین 116 | CLK2 — Dedicated clock input 2 / global |
| پین 117 | GND — Ground reference |
| پین 118 | VCCINT — Core 2.5 V supply |
| پین 119 | CLK3 — Dedicated clock input 3 / global |
| پین 120 | I/O — User I/O pin 120 |
| پین 121 | I/O — User I/O pin 121 |
| پین 122 | I/O — User I/O pin 122 |
| پین 123 | I/O — User I/O pin 123 |
| پین 124 | I/O — User I/O pin 124 |
| پین 125 | I/O — User I/O pin 125 |
| پین 126 | I/O — User I/O pin 126 |
| پین 127 | I/O — User I/O pin 127 |
| پین 128 | I/O — User I/O pin 128 |
| پین 129 | I/O — User I/O pin 129 |
| پین 130 | I/O — User I/O pin 130 |
| پین 131 | I/O — User I/O pin 131 |
| پین 132 | I/O — User I/O pin 132 |
| پین 133 | I/O — User I/O pin 133 |
| پین 134 | I/O — User I/O pin 134 |
| پین 135 | I/O — User I/O pin 135 |
| پین 136 | I/O — User I/O pin 136 |
| پین 137 | I/O — User I/O pin 137 |
| پین 138 | I/O — User I/O pin 138 |
| پین 139 | I/O — User I/O pin 139 |
| پین 140 | I/O — User I/O pin 140 |
| پین 141 | I/O — User I/O pin 141 |
| پین 142 | I/O — User I/O pin 142 |
| پین 143 | I/O — User I/O pin 143 |
| پین 144 | I/O — User I/O pin 144 |
کاربردهای معمول
EP1K30TI144-3N مناسب است برای 6 کاربردs: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
پیشنهادی
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
پیشنهادی
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
پیشنهادی
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
پیشنهادی
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
پیشنهادی
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP1K30TI144-3N — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
تفاوت‌های کلیدی
- Highest speed grade in the EP1K30 family (در مقابلEP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (در مقابلEP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (در مقابلEP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (در مقابلEP1K10TI144-2N (smaller family member))
یادداشت‌های طراحی
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
اطلاعات انطباق
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
