EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
MPN: EP1K30TI144-3N ✗ Akhir HidupEP1K30TI144-3N Ringkasan
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
Alternatif penggantian untuk EP1K30TI144-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K30TI144-3N (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Process Technology, Package, Operating Temperature, Series.
EP1K30TI144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-2NGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-3N Rating Maksimal & Karakteristik Listrik
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| Paket | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| Suhu Kerja | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| Tipe Mounting | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
Konfigurasi Pin EP1K30TI144-3N
| Pin produk 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| Pin produk 2 | I/O — User I/O pin 2 |
| Pin produk 3 | I/O — User I/O pin 3 |
| Pin produk 4 | I/O — User I/O pin 4 |
| Pin produk 5 | I/O — User I/O pin 5 |
| Pin produk 6 | I/O — User I/O pin 6 |
| Pin produk 7 | I/O — User I/O pin 7 |
| Pin produk 8 | I/O — User I/O pin 8 |
| Pin produk 9 | I/O — User I/O pin 9 |
| Pin produk 10 | I/O — User I/O pin 10 |
| Pin produk 11 | I/O — User I/O pin 11 |
| Pin produk 12 | I/O — User I/O pin 12 |
| Pin produk 13 | I/O — User I/O pin 13 |
| Pin produk 14 | I/O — User I/O pin 14 |
| Pin produk 15 | GND — Ground reference |
| Pin produk 16 | VCCINT — Core 2.5 V supply |
| Pin produk 17 | I/O — User I/O pin 17 |
| Pin produk 18 | I/O — User I/O pin 18 |
| Pin produk 19 | I/O — User I/O pin 19 |
| Pin produk 20 | I/O — User I/O pin 20 |
| Pin produk 21 | I/O — User I/O pin 21 |
| Pin produk 22 | I/O — User I/O pin 22 |
| Pin produk 23 | I/O — User I/O pin 23 |
| Pin produk 24 | I/O — User I/O pin 24 |
| Pin produk 25 | I/O — User I/O pin 25 |
| Pin produk 26 | I/O — User I/O pin 26 |
| Pin produk 27 | I/O — User I/O pin 27 |
| Pin produk 28 | I/O — User I/O pin 28 |
| Pin produk 29 | I/O — User I/O pin 29 |
| Pin produk 30 | I/O — User I/O pin 30 |
| Pin produk 31 | I/O — User I/O pin 31 |
| Pin produk 32 | I/O — User I/O pin 32 |
| Pin produk 33 | I/O — User I/O pin 33 |
| Pin produk 34 | GND — Ground reference |
| Pin produk 35 | I/O — User I/O pin 35 |
| Pin produk 36 | I/O — User I/O pin 36 |
| Pin produk 37 | I/O — User I/O pin 37 |
| Pin produk 38 | I/O — User I/O pin 38 |
| Pin produk 39 | I/O — User I/O pin 39 |
| Pin produk 40 | I/O — User I/O pin 40 |
| Pin produk 41 | I/O — User I/O pin 41 |
| Pin produk 42 | I/O — User I/O pin 42 |
| Pin produk 43 | VCCIO — I/O supply voltage (MultiVolt) |
| Pin produk 44 | I/O — User I/O pin 44 |
| Pin produk 45 | I/O — User I/O pin 45 |
| Pin produk 46 | I/O — User I/O pin 46 |
| Pin produk 47 | I/O — User I/O pin 47 |
| Pin produk 48 | I/O — User I/O pin 48 |
| Pin produk 49 | I/O — User I/O pin 49 |
| Pin produk 50 | I/O — User I/O pin 50 |
| Pin produk 51 | I/O — User I/O pin 51 |
| Pin produk 52 | I/O — User I/O pin 52 |
| Pin produk 53 | I/O — User I/O pin 53 |
| Pin produk 54 | I/O — User I/O pin 54 |
| Pin produk 55 | I/O — User I/O pin 55 |
| Pin produk 56 | I/O — User I/O pin 56 |
| Pin produk 57 | I/O — User I/O pin 57 |
| Pin produk 58 | I/O — User I/O pin 58 |
| Pin produk 59 | I/O — User I/O pin 59 |
| Pin produk 60 | I/O — User I/O pin 60 |
| Pin produk 61 | I/O — User I/O pin 61 |
| Pin produk 62 | I/O — User I/O pin 62 |
| Pin produk 63 | I/O — User I/O pin 63 |
| Pin produk 64 | I/O — User I/O pin 64 |
| Pin produk 65 | I/O — User I/O pin 65 |
| Pin produk 66 | I/O — User I/O pin 66 |
| Pin produk 67 | I/O — User I/O pin 67 |
| Pin produk 68 | I/O — User I/O pin 68 |
| Pin produk 69 | I/O — User I/O pin 69 |
| Pin produk 70 | I/O — User I/O pin 70 |
| Pin produk 71 | I/O — User I/O pin 71 |
| Pin produk 72 | I/O — User I/O pin 72 |
| Pin produk 73 | GND — Ground reference |
| Pin produk 74 | I/O — User I/O pin 74 |
| Pin produk 75 | I/O — User I/O pin 75 |
| Pin produk 76 | I/O — User I/O pin 76 |
| Pin produk 77 | I/O — User I/O pin 77 |
| Pin produk 78 | I/O — User I/O pin 78 |
| Pin produk 79 | I/O — User I/O pin 79 |
| Pin produk 80 | I/O — User I/O pin 80 |
| Pin produk 81 | I/O — User I/O pin 81 |
| Pin produk 82 | I/O — User I/O pin 82 |
| Pin produk 83 | I/O — User I/O pin 83 |
| Pin produk 84 | I/O — User I/O pin 84 |
| Pin produk 85 | I/O — User I/O pin 85 |
| Pin produk 86 | I/O — User I/O pin 86 |
| Pin produk 87 | I/O — User I/O pin 87 |
| Pin produk 88 | I/O — User I/O pin 88 |
| Pin produk 89 | I/O — User I/O pin 89 |
| Pin produk 90 | I/O — User I/O pin 90 |
| Pin produk 91 | I/O — User I/O pin 91 |
| Pin produk 92 | I/O — User I/O pin 92 |
| Pin produk 93 | I/O — User I/O pin 93 |
| Pin produk 94 | I/O — User I/O pin 94 |
| Pin produk 95 | I/O — User I/O pin 95 |
| Pin produk 96 | I/O — User I/O pin 96 |
| Pin produk 97 | I/O — User I/O pin 97 |
| Pin produk 98 | I/O — User I/O pin 98 |
| Pin produk 99 | I/O — User I/O pin 99 |
| Pin produk 100 | I/O — User I/O pin 100 |
| Pin produk 101 | I/O — User I/O pin 101 |
| Pin produk 102 | I/O — User I/O pin 102 |
| Pin produk 103 | DCLK — Dedicated configuration clock input |
| Pin produk 104 | DATA0 — Configuration data input (passive serial) |
| Pin produk 105 | nCONFIG — Configuration control (active-low reset) |
| Pin produk 106 | nSTATUS — Configuration status (active-low) |
| Pin produk 107 | CONF_DONE — Configuration complete (open-drain) |
| Pin produk 108 | TDI — JTAG Test Data In |
| Pin produk 109 | TDO — JTAG Test Data Out |
| Pin produk 110 | TMS — JTAG Test Mode Select |
| Pin produk 111 | TCK — JTAG Test Clock |
| Pin produk 112 | DEV_CLRn — Device clear (optional, may be unused) |
| Pin produk 113 | DEV_OE — Device output enable (optional) |
| Pin produk 114 | CLK0 — Dedicated clock input 0 / global |
| Pin produk 115 | CLK1 — Dedicated clock input 1 / global |
| Pin produk 116 | CLK2 — Dedicated clock input 2 / global |
| Pin produk 117 | GND — Ground reference |
| Pin produk 118 | VCCINT — Core 2.5 V supply |
| Pin produk 119 | CLK3 — Dedicated clock input 3 / global |
| Pin produk 120 | I/O — User I/O pin 120 |
| Pin produk 121 | I/O — User I/O pin 121 |
| Pin produk 122 | I/O — User I/O pin 122 |
| Pin produk 123 | I/O — User I/O pin 123 |
| Pin produk 124 | I/O — User I/O pin 124 |
| Pin produk 125 | I/O — User I/O pin 125 |
| Pin produk 126 | I/O — User I/O pin 126 |
| Pin produk 127 | I/O — User I/O pin 127 |
| Pin produk 128 | I/O — User I/O pin 128 |
| Pin produk 129 | I/O — User I/O pin 129 |
| Pin produk 130 | I/O — User I/O pin 130 |
| Pin produk 131 | I/O — User I/O pin 131 |
| Pin produk 132 | I/O — User I/O pin 132 |
| Pin produk 133 | I/O — User I/O pin 133 |
| Pin produk 134 | I/O — User I/O pin 134 |
| Pin produk 135 | I/O — User I/O pin 135 |
| Pin produk 136 | I/O — User I/O pin 136 |
| Pin produk 137 | I/O — User I/O pin 137 |
| Pin produk 138 | I/O — User I/O pin 138 |
| Pin produk 139 | I/O — User I/O pin 139 |
| Pin produk 140 | I/O — User I/O pin 140 |
| Pin produk 141 | I/O — User I/O pin 141 |
| Pin produk 142 | I/O — User I/O pin 142 |
| Pin produk 143 | I/O — User I/O pin 143 |
| Pin produk 144 | I/O — User I/O pin 144 |
Aplikasi Umum
EP1K30TI144-3N cocok untuk 6 aplikasis: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
Direkomendasikan
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
Direkomendasikan
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
Direkomendasikan
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
Direkomendasikan
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
Direkomendasikan
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K30TI144-3N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Diferensiator Kunci
- Highest speed grade in the EP1K30 family (vsEP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (vsEP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (vsEP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (vsEP1K10TI144-2N (smaller family member))
Catatan Desain
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
Informasi Konformitas
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.