EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
MPN: EPF8820ARI208-4 ✗ انتهى عمره الإنتاجيEPF8820ARI208-4 نظرة عامة
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
بدائل مباشرة لـ EPF8820ARI208-4 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF8820ARI208-4 (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
EPF8820ARI208-3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARI208-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARI208-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARI208-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARI208-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARC208-4
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARC208-4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8820ARI208-4 الحدود القصوى والخصائص الكهربائية
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| العلبة | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
تكوين أطراف EPF8820ARI208-4
| دبوس 1 | I/O — User I/O pin (bank 1) |
| دبوس 2 | I/O — User I/O pin (bank 1) |
| دبوس 3 | VCCINT — Internal core supply 5V |
| دبوس 4 | I/O — User I/O pin (bank 1) |
| دبوس 5 | GND — Ground |
| دبوس 6 | nCONFIG — Configuration control (active low) |
| دبوس 7 | nSTATUS — Configuration status (active low) |
| دبوس 8 | CONF_DONE — Configuration complete indicator |
| دبوس 9 | DCLK — Configuration clock input |
| دبوس 10 | DATA0 — Configuration data input |
| دبوس 11 | TCK — JTAG test clock |
| دبوس 12 | TMS — JTAG test mode select |
| دبوس 13 | TDI — JTAG test data in |
| دبوس 14 | TDO — JTAG test data out |
| دبوس 15 | CLK0 — Dedicated clock input 0 |
| دبوس 16 | CLK1 — Dedicated clock input 1 |
| دبوس 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 18 | I/O — User I/O pin (bank 2) |
| دبوس 19 | I/O — User I/O pin (bank 2) |
| دبوس 20 | I/O — User I/O pin (bank 2) |
| دبوس 21 | GND — Ground |
| دبوس 22 | I/O — User I/O pin (bank 2) |
| دبوس 23 | I/O — User I/O pin (bank 2) |
| دبوس 24 | VCCINT — Internal core supply 5V |
| دبوس 25 | I/O — User I/O pin (bank 3) |
| دبوس 26 | I/O — User I/O pin (bank 3) |
| دبوس 27 | I/O — User I/O pin (bank 3) |
| دبوس 28 | GND — Ground |
| دبوس 29 | I/O — User I/O pin (bank 3) |
| دبوس 30 | I/O — User I/O pin (bank 3) |
| دبوس 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 32 | I/O — User I/O pin (bank 3) |
| دبوس 33 | I/O — User I/O pin (bank 4) |
| دبوس 34 | I/O — User I/O pin (bank 4) |
| دبوس 35 | GND — Ground |
| دبوس 36 | CLK2 — Dedicated clock input 2 |
| دبوس 37 | CLK3 — Dedicated clock input 3 |
| دبوس 38 | I/O — User I/O pin (bank 4) |
| دبوس 39 | I/O — User I/O pin (bank 4) |
| دبوس 40 | VCCINT — Internal core supply 5V |
| دبوس 41 | I/O — User I/O pin (bank 4) |
| دبوس 42 | I/O — User I/O pin (bank 4) |
| دبوس 43 | I/O — User I/O pin (bank 5) |
| دبوس 44 | GND — Ground |
| دبوس 45 | I/O — User I/O pin (bank 5) |
| دبوس 46 | I/O — User I/O pin (bank 5) |
| دبوس 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 48 | I/O — User I/O pin (bank 5) |
| دبوس 49 | I/O — User I/O pin (bank 5) |
| دبوس 50 | I/O — User I/O pin (bank 6) |
| دبوس 51 | GND — Ground |
| دبوس 52 | I/O — User I/O pin (bank 6) |
| دبوس 53 | I/O — User I/O pin (bank 6) |
| دبوس 54 | VCCINT — Internal core supply 5V |
| دبوس 55 | I/O — User I/O pin (bank 6) |
| دبوس 56 | I/O — User I/O pin (bank 6) |
| دبوس 57 | I/O — User I/O pin (bank 7) |
| دبوس 58 | GND — Ground |
| دبوس 59 | I/O — User I/O pin (bank 7) |
| دبوس 60 | I/O — User I/O pin (bank 7) |
| دبوس 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 62 | I/O — User I/O pin (bank 7) |
| دبوس 63 | I/O — User I/O pin (bank 7) |
| دبوس 64 | I/O — User I/O pin (bank 8) |
| دبوس 65 | GND — Ground |
| دبوس 66 | I/O — User I/O pin (bank 8) |
| دبوس 67 | I/O — User I/O pin (bank 8) |
| دبوس 68 | VCCINT — Internal core supply 5V |
| دبوس 69 | I/O — User I/O pin (bank 8) |
| دبوس 70 | I/O — User I/O pin (bank 8) |
| دبوس 71 | I/O — User I/O pin (bank 1) |
| دبوس 72 | GND — Ground |
| دبوس 73 | I/O — User I/O pin (bank 1) |
| دبوس 74 | I/O — User I/O pin (bank 1) |
| دبوس 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 76 | I/O — User I/O pin (bank 1) |
| دبوس 77 | I/O — User I/O pin (bank 2) |
| دبوس 78 | I/O — User I/O pin (bank 2) |
| دبوس 79 | GND — Ground |
| دبوس 80 | I/O — User I/O pin (bank 2) |
| دبوس 81 | I/O — User I/O pin (bank 2) |
| دبوس 82 | VCCINT — Internal core supply 5V |
| دبوس 83 | I/O — User I/O pin (bank 2) |
| دبوس 84 | I/O — User I/O pin (bank 3) |
| دبوس 85 | I/O — User I/O pin (bank 3) |
| دبوس 86 | GND — Ground |
| دبوس 87 | I/O — User I/O pin (bank 3) |
| دبوس 88 | I/O — User I/O pin (bank 3) |
| دبوس 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 90 | I/O — User I/O pin (bank 3) |
| دبوس 91 | I/O — User I/O pin (bank 4) |
| دبوس 92 | I/O — User I/O pin (bank 4) |
| دبوس 93 | GND — Ground |
| دبوس 94 | I/O — User I/O pin (bank 4) |
| دبوس 95 | I/O — User I/O pin (bank 4) |
| دبوس 96 | VCCINT — Internal core supply 5V |
| دبوس 97 | I/O — User I/O pin (bank 4) |
| دبوس 98 | I/O — User I/O pin (bank 5) |
| دبوس 99 | I/O — User I/O pin (bank 5) |
| دبوس 100 | GND — Ground |
| دبوس 101 | I/O — User I/O pin (bank 5) |
| دبوس 102 | I/O — User I/O pin (bank 5) |
| دبوس 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 104 | I/O — User I/O pin (bank 5) |
| دبوس 105 | I/O — User I/O pin (bank 6) |
| دبوس 106 | I/O — User I/O pin (bank 6) |
| دبوس 107 | GND — Ground |
| دبوس 108 | I/O — User I/O pin (bank 6) |
| دبوس 109 | I/O — User I/O pin (bank 6) |
| دبوس 110 | VCCINT — Internal core supply 5V |
| دبوس 111 | I/O — User I/O pin (bank 6) |
| دبوس 112 | I/O — User I/O pin (bank 7) |
| دبوس 113 | I/O — User I/O pin (bank 7) |
| دبوس 114 | GND — Ground |
| دبوس 115 | I/O — User I/O pin (bank 7) |
| دبوس 116 | I/O — User I/O pin (bank 7) |
| دبوس 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 118 | I/O — User I/O pin (bank 7) |
| دبوس 119 | I/O — User I/O pin (bank 8) |
| دبوس 120 | I/O — User I/O pin (bank 8) |
| دبوس 121 | GND — Ground |
| دبوس 122 | I/O — User I/O pin (bank 8) |
| دبوس 123 | I/O — User I/O pin (bank 8) |
| دبوس 124 | VCCINT — Internal core supply 5V |
| دبوس 125 | I/O — User I/O pin (bank 8) |
| دبوس 126 | I/O — User I/O pin (bank 1) |
| دبوس 127 | I/O — User I/O pin (bank 1) |
| دبوس 128 | GND — Ground |
| دبوس 129 | I/O — User I/O pin (bank 1) |
| دبوس 130 | I/O — User I/O pin (bank 1) |
| دبوس 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 132 | I/O — User I/O pin (bank 1) |
| دبوس 133 | I/O — User I/O pin (bank 2) |
| دبوس 134 | I/O — User I/O pin (bank 2) |
| دبوس 135 | GND — Ground |
| دبوس 136 | I/O — User I/O pin (bank 2) |
| دبوس 137 | I/O — User I/O pin (bank 2) |
| دبوس 138 | VCCINT — Internal core supply 5V |
| دبوس 139 | I/O — User I/O pin (bank 2) |
| دبوس 140 | I/O — User I/O pin (bank 3) |
| دبوس 141 | I/O — User I/O pin (bank 3) |
| دبوس 142 | GND — Ground |
| دبوس 143 | I/O — User I/O pin (bank 3) |
| دبوس 144 | I/O — User I/O pin (bank 3) |
| دبوس 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 146 | I/O — User I/O pin (bank 3) |
| دبوس 147 | I/O — User I/O pin (bank 4) |
| دبوس 148 | I/O — User I/O pin (bank 4) |
| دبوس 149 | GND — Ground |
| دبوس 150 | I/O — User I/O pin (bank 4) |
| دبوس 151 | I/O — User I/O pin (bank 4) |
| دبوس 152 | VCCINT — Internal core supply 5V |
| دبوس 153 | I/O — User I/O pin (bank 4) |
| دبوس 154 | I/O — User I/O pin (bank 5) |
| دبوس 155 | I/O — User I/O pin (bank 5) |
| دبوس 156 | GND — Ground |
| دبوس 157 | I/O — User I/O pin (bank 5) |
| دبوس 158 | I/O — User I/O pin (bank 5) |
| دبوس 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 160 | I/O — User I/O pin (bank 5) |
| دبوس 161 | I/O — User I/O pin (bank 6) |
| دبوس 162 | I/O — User I/O pin (bank 6) |
| دبوس 163 | GND — Ground |
| دبوس 164 | I/O — User I/O pin (bank 6) |
| دبوس 165 | I/O — User I/O pin (bank 6) |
| دبوس 166 | VCCINT — Internal core supply 5V |
| دبوس 167 | I/O — User I/O pin (bank 6) |
| دبوس 168 | I/O — User I/O pin (bank 7) |
| دبوس 169 | I/O — User I/O pin (bank 7) |
| دبوس 170 | GND — Ground |
| دبوس 171 | I/O — User I/O pin (bank 7) |
| دبوس 172 | I/O — User I/O pin (bank 7) |
| دبوس 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 174 | I/O — User I/O pin (bank 7) |
| دبوس 175 | I/O — User I/O pin (bank 8) |
| دبوس 176 | I/O — User I/O pin (bank 8) |
| دبوس 177 | GND — Ground |
| دبوس 178 | I/O — User I/O pin (bank 8) |
| دبوس 179 | I/O — User I/O pin (bank 8) |
| دبوس 180 | VCCINT — Internal core supply 5V |
| دبوس 181 | I/O — User I/O pin (bank 8) |
| دبوس 182 | I/O — User I/O pin (bank 1) |
| دبوس 183 | I/O — User I/O pin (bank 1) |
| دبوس 184 | GND — Ground |
| دبوس 185 | I/O — User I/O pin (bank 1) |
| دبوس 186 | I/O — User I/O pin (bank 1) |
| دبوس 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 188 | I/O — User I/O pin (bank 1) |
| دبوس 189 | I/O — User I/O pin (bank 2) |
| دبوس 190 | I/O — User I/O pin (bank 2) |
| دبوس 191 | GND — Ground |
| دبوس 192 | I/O — User I/O pin (bank 2) |
| دبوس 193 | I/O — User I/O pin (bank 2) |
| دبوس 194 | VCCINT — Internal core supply 5V |
| دبوس 195 | I/O — User I/O pin (bank 2) |
| دبوس 196 | I/O — User I/O pin (bank 3) |
| دبوس 197 | I/O — User I/O pin (bank 3) |
| دبوس 198 | GND — Ground |
| دبوس 199 | I/O — User I/O pin (bank 3) |
| دبوس 200 | I/O — User I/O pin (bank 3) |
| دبوس 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| دبوس 202 | I/O — User I/O pin (bank 3) |
| دبوس 203 | I/O — User I/O pin (bank 4) |
| دبوس 204 | I/O — User I/O pin (bank 4) |
| دبوس 205 | GND — Ground |
| دبوس 206 | I/O — User I/O pin (bank 4) |
| دبوس 207 | I/O — User I/O pin (bank 4) |
| دبوس 208 | VCCINT — Internal core supply 5V |
التطبيقات النموذجية
EPF8820ARI208-4 مناسب لـ 6 التطبيقs: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
موصى به
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
موصى به
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
موصى به
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
موصى به
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
موصى به
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF8820ARI208-4 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
أبرز الفروقات
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (مقابلEPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (مقابلEPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (مقابلDiscrete 74LS/74HC logic equivalent)
ملاحظات التصميم
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
معلومات الامتثال
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).