EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
MPN: EPF8820ARI208-4 ✗ जीवन की समाप्तिEPF8820ARI208-4 अवलोकन
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
के लिए ड्रॉप-इन विकल्प EPF8820ARI208-4 — समान पैकेज, पिन-टू-पिन संगत। PCB रीवर्क आवश्यक करने वाले भिन्न-पैकेज पार्ट्स शामिल नहीं हैं।
इस सीरीज़ के वेरिएंट
समान श्रृंखला के मॉडल जो ड्रॉप-इन संगत हैं EPF8820ARI208-4 (समान फॉर्म फैक्टर और फुटप्रिंट) — इसमें भिन्न Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
EPF8820ARI208-3
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARI208-3N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARI208-2
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARI208-2N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARI208-1
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARC208-4
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARC208-4N
✅ ड्रॉप-इनकीमत के लिए संपर्क करें
डेटाशीट देखें →EPF8820ARI208-4 Maximum Ratings और Electrical Characteristics
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| पैकेज | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
EPF8820ARI208-4 पिन कॉन्फ़िगरेशन
| पिन 1 | I/O — User I/O pin (bank 1) |
| पिन 2 | I/O — User I/O pin (bank 1) |
| पिन 3 | VCCINT — Internal core supply 5V |
| पिन 4 | I/O — User I/O pin (bank 1) |
| पिन 5 | GND — Ground |
| पिन 6 | nCONFIG — Configuration control (active low) |
| पिन 7 | nSTATUS — Configuration status (active low) |
| पिन 8 | CONF_DONE — Configuration complete indicator |
| पिन 9 | DCLK — Configuration clock input |
| पिन 10 | DATA0 — Configuration data input |
| पिन 11 | TCK — JTAG test clock |
| पिन 12 | TMS — JTAG test mode select |
| पिन 13 | TDI — JTAG test data in |
| पिन 14 | TDO — JTAG test data out |
| पिन 15 | CLK0 — Dedicated clock input 0 |
| पिन 16 | CLK1 — Dedicated clock input 1 |
| पिन 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 18 | I/O — User I/O pin (bank 2) |
| पिन 19 | I/O — User I/O pin (bank 2) |
| पिन 20 | I/O — User I/O pin (bank 2) |
| पिन 21 | GND — Ground |
| पिन 22 | I/O — User I/O pin (bank 2) |
| पिन 23 | I/O — User I/O pin (bank 2) |
| पिन 24 | VCCINT — Internal core supply 5V |
| पिन 25 | I/O — User I/O pin (bank 3) |
| पिन 26 | I/O — User I/O pin (bank 3) |
| पिन 27 | I/O — User I/O pin (bank 3) |
| पिन 28 | GND — Ground |
| पिन 29 | I/O — User I/O pin (bank 3) |
| पिन 30 | I/O — User I/O pin (bank 3) |
| पिन 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 32 | I/O — User I/O pin (bank 3) |
| पिन 33 | I/O — User I/O pin (bank 4) |
| पिन 34 | I/O — User I/O pin (bank 4) |
| पिन 35 | GND — Ground |
| पिन 36 | CLK2 — Dedicated clock input 2 |
| पिन 37 | CLK3 — Dedicated clock input 3 |
| पिन 38 | I/O — User I/O pin (bank 4) |
| पिन 39 | I/O — User I/O pin (bank 4) |
| पिन 40 | VCCINT — Internal core supply 5V |
| पिन 41 | I/O — User I/O pin (bank 4) |
| पिन 42 | I/O — User I/O pin (bank 4) |
| पिन 43 | I/O — User I/O pin (bank 5) |
| पिन 44 | GND — Ground |
| पिन 45 | I/O — User I/O pin (bank 5) |
| पिन 46 | I/O — User I/O pin (bank 5) |
| पिन 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 48 | I/O — User I/O pin (bank 5) |
| पिन 49 | I/O — User I/O pin (bank 5) |
| पिन 50 | I/O — User I/O pin (bank 6) |
| पिन 51 | GND — Ground |
| पिन 52 | I/O — User I/O pin (bank 6) |
| पिन 53 | I/O — User I/O pin (bank 6) |
| पिन 54 | VCCINT — Internal core supply 5V |
| पिन 55 | I/O — User I/O pin (bank 6) |
| पिन 56 | I/O — User I/O pin (bank 6) |
| पिन 57 | I/O — User I/O pin (bank 7) |
| पिन 58 | GND — Ground |
| पिन 59 | I/O — User I/O pin (bank 7) |
| पिन 60 | I/O — User I/O pin (bank 7) |
| पिन 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 62 | I/O — User I/O pin (bank 7) |
| पिन 63 | I/O — User I/O pin (bank 7) |
| पिन 64 | I/O — User I/O pin (bank 8) |
| पिन 65 | GND — Ground |
| पिन 66 | I/O — User I/O pin (bank 8) |
| पिन 67 | I/O — User I/O pin (bank 8) |
| पिन 68 | VCCINT — Internal core supply 5V |
| पिन 69 | I/O — User I/O pin (bank 8) |
| पिन 70 | I/O — User I/O pin (bank 8) |
| पिन 71 | I/O — User I/O pin (bank 1) |
| पिन 72 | GND — Ground |
| पिन 73 | I/O — User I/O pin (bank 1) |
| पिन 74 | I/O — User I/O pin (bank 1) |
| पिन 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 76 | I/O — User I/O pin (bank 1) |
| पिन 77 | I/O — User I/O pin (bank 2) |
| पिन 78 | I/O — User I/O pin (bank 2) |
| पिन 79 | GND — Ground |
| पिन 80 | I/O — User I/O pin (bank 2) |
| पिन 81 | I/O — User I/O pin (bank 2) |
| पिन 82 | VCCINT — Internal core supply 5V |
| पिन 83 | I/O — User I/O pin (bank 2) |
| पिन 84 | I/O — User I/O pin (bank 3) |
| पिन 85 | I/O — User I/O pin (bank 3) |
| पिन 86 | GND — Ground |
| पिन 87 | I/O — User I/O pin (bank 3) |
| पिन 88 | I/O — User I/O pin (bank 3) |
| पिन 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 90 | I/O — User I/O pin (bank 3) |
| पिन 91 | I/O — User I/O pin (bank 4) |
| पिन 92 | I/O — User I/O pin (bank 4) |
| पिन 93 | GND — Ground |
| पिन 94 | I/O — User I/O pin (bank 4) |
| पिन 95 | I/O — User I/O pin (bank 4) |
| पिन 96 | VCCINT — Internal core supply 5V |
| पिन 97 | I/O — User I/O pin (bank 4) |
| पिन 98 | I/O — User I/O pin (bank 5) |
| पिन 99 | I/O — User I/O pin (bank 5) |
| पिन 100 | GND — Ground |
| पिन 101 | I/O — User I/O pin (bank 5) |
| पिन 102 | I/O — User I/O pin (bank 5) |
| पिन 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 104 | I/O — User I/O pin (bank 5) |
| पिन 105 | I/O — User I/O pin (bank 6) |
| पिन 106 | I/O — User I/O pin (bank 6) |
| पिन 107 | GND — Ground |
| पिन 108 | I/O — User I/O pin (bank 6) |
| पिन 109 | I/O — User I/O pin (bank 6) |
| पिन 110 | VCCINT — Internal core supply 5V |
| पिन 111 | I/O — User I/O pin (bank 6) |
| पिन 112 | I/O — User I/O pin (bank 7) |
| पिन 113 | I/O — User I/O pin (bank 7) |
| पिन 114 | GND — Ground |
| पिन 115 | I/O — User I/O pin (bank 7) |
| पिन 116 | I/O — User I/O pin (bank 7) |
| पिन 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 118 | I/O — User I/O pin (bank 7) |
| पिन 119 | I/O — User I/O pin (bank 8) |
| पिन 120 | I/O — User I/O pin (bank 8) |
| पिन 121 | GND — Ground |
| पिन 122 | I/O — User I/O pin (bank 8) |
| पिन 123 | I/O — User I/O pin (bank 8) |
| पिन 124 | VCCINT — Internal core supply 5V |
| पिन 125 | I/O — User I/O pin (bank 8) |
| पिन 126 | I/O — User I/O pin (bank 1) |
| पिन 127 | I/O — User I/O pin (bank 1) |
| पिन 128 | GND — Ground |
| पिन 129 | I/O — User I/O pin (bank 1) |
| पिन 130 | I/O — User I/O pin (bank 1) |
| पिन 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 132 | I/O — User I/O pin (bank 1) |
| पिन 133 | I/O — User I/O pin (bank 2) |
| पिन 134 | I/O — User I/O pin (bank 2) |
| पिन 135 | GND — Ground |
| पिन 136 | I/O — User I/O pin (bank 2) |
| पिन 137 | I/O — User I/O pin (bank 2) |
| पिन 138 | VCCINT — Internal core supply 5V |
| पिन 139 | I/O — User I/O pin (bank 2) |
| पिन 140 | I/O — User I/O pin (bank 3) |
| पिन 141 | I/O — User I/O pin (bank 3) |
| पिन 142 | GND — Ground |
| पिन 143 | I/O — User I/O pin (bank 3) |
| पिन 144 | I/O — User I/O pin (bank 3) |
| पिन 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 146 | I/O — User I/O pin (bank 3) |
| पिन 147 | I/O — User I/O pin (bank 4) |
| पिन 148 | I/O — User I/O pin (bank 4) |
| पिन 149 | GND — Ground |
| पिन 150 | I/O — User I/O pin (bank 4) |
| पिन 151 | I/O — User I/O pin (bank 4) |
| पिन 152 | VCCINT — Internal core supply 5V |
| पिन 153 | I/O — User I/O pin (bank 4) |
| पिन 154 | I/O — User I/O pin (bank 5) |
| पिन 155 | I/O — User I/O pin (bank 5) |
| पिन 156 | GND — Ground |
| पिन 157 | I/O — User I/O pin (bank 5) |
| पिन 158 | I/O — User I/O pin (bank 5) |
| पिन 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 160 | I/O — User I/O pin (bank 5) |
| पिन 161 | I/O — User I/O pin (bank 6) |
| पिन 162 | I/O — User I/O pin (bank 6) |
| पिन 163 | GND — Ground |
| पिन 164 | I/O — User I/O pin (bank 6) |
| पिन 165 | I/O — User I/O pin (bank 6) |
| पिन 166 | VCCINT — Internal core supply 5V |
| पिन 167 | I/O — User I/O pin (bank 6) |
| पिन 168 | I/O — User I/O pin (bank 7) |
| पिन 169 | I/O — User I/O pin (bank 7) |
| पिन 170 | GND — Ground |
| पिन 171 | I/O — User I/O pin (bank 7) |
| पिन 172 | I/O — User I/O pin (bank 7) |
| पिन 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 174 | I/O — User I/O pin (bank 7) |
| पिन 175 | I/O — User I/O pin (bank 8) |
| पिन 176 | I/O — User I/O pin (bank 8) |
| पिन 177 | GND — Ground |
| पिन 178 | I/O — User I/O pin (bank 8) |
| पिन 179 | I/O — User I/O pin (bank 8) |
| पिन 180 | VCCINT — Internal core supply 5V |
| पिन 181 | I/O — User I/O pin (bank 8) |
| पिन 182 | I/O — User I/O pin (bank 1) |
| पिन 183 | I/O — User I/O pin (bank 1) |
| पिन 184 | GND — Ground |
| पिन 185 | I/O — User I/O pin (bank 1) |
| पिन 186 | I/O — User I/O pin (bank 1) |
| पिन 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 188 | I/O — User I/O pin (bank 1) |
| पिन 189 | I/O — User I/O pin (bank 2) |
| पिन 190 | I/O — User I/O pin (bank 2) |
| पिन 191 | GND — Ground |
| पिन 192 | I/O — User I/O pin (bank 2) |
| पिन 193 | I/O — User I/O pin (bank 2) |
| पिन 194 | VCCINT — Internal core supply 5V |
| पिन 195 | I/O — User I/O pin (bank 2) |
| पिन 196 | I/O — User I/O pin (bank 3) |
| पिन 197 | I/O — User I/O pin (bank 3) |
| पिन 198 | GND — Ground |
| पिन 199 | I/O — User I/O pin (bank 3) |
| पिन 200 | I/O — User I/O pin (bank 3) |
| पिन 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| पिन 202 | I/O — User I/O pin (bank 3) |
| पिन 203 | I/O — User I/O pin (bank 4) |
| पिन 204 | I/O — User I/O pin (bank 4) |
| पिन 205 | GND — Ground |
| पिन 206 | I/O — User I/O pin (bank 4) |
| पिन 207 | I/O — User I/O pin (bank 4) |
| पिन 208 | VCCINT — Internal core supply 5V |
सामान्य अनुप्रयोग
EPF8820ARI208-4 के लिए उपयुक्त है 6 अनुप्रयोगs: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
अनुशंसित
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
अनुशंसित
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
अनुशंसित
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
अनुशंसित
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
अनुशंसित
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
अनुशंसित
अनुशंसित उत्पादों का सारांश
के लिए इंजीनियरिंग संदर्भ डेटा EPF8820ARI208-4 — तुलना, डिज़ाइन मार्गदर्शन और अनुपालन जानकारी।
चयन गाइड
विकल्पों के साथ तुलना
| पैरामीटर | यह उत्पाद | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
मुख्य विशेषताएँ
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (बनामEPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (बनामEPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (बनामDiscrete 74LS/74HC logic equivalent)
डिज़ाइन नोट्स
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
अनुपालन जानकारी
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).