EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
MPN: EPF8820ARI208-4 ✗ Cuối đờiEPF8820ARI208-4 Tóm tắt
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
Bộ thay thế dễ dàng lắp đặt cho EPF8820ARI208-4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF8820ARI208-4 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
EPF8820ARI208-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARI208-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARI208-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARI208-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARI208-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARC208-4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARC208-4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF8820ARI208-4 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| Hộp | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
Cấu hình chân EPF8820ARI208-4
| Chân 1 | I/O — User I/O pin (bank 1) |
| Chân 2 | I/O — User I/O pin (bank 1) |
| Chân 3 | VCCINT — Internal core supply 5V |
| Chân 4 | I/O — User I/O pin (bank 1) |
| Chân 5 | GND — Ground |
| Chân 6 | nCONFIG — Configuration control (active low) |
| Chân 7 | nSTATUS — Configuration status (active low) |
| Chân 8 | CONF_DONE — Configuration complete indicator |
| Chân 9 | DCLK — Configuration clock input |
| Chân 10 | DATA0 — Configuration data input |
| Chân 11 | TCK — JTAG test clock |
| Chân 12 | TMS — JTAG test mode select |
| Chân 13 | TDI — JTAG test data in |
| Chân 14 | TDO — JTAG test data out |
| Chân 15 | CLK0 — Dedicated clock input 0 |
| Chân 16 | CLK1 — Dedicated clock input 1 |
| Chân 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 18 | I/O — User I/O pin (bank 2) |
| Chân 19 | I/O — User I/O pin (bank 2) |
| Chân 20 | I/O — User I/O pin (bank 2) |
| Chân 21 | GND — Ground |
| Chân 22 | I/O — User I/O pin (bank 2) |
| Chân 23 | I/O — User I/O pin (bank 2) |
| Chân 24 | VCCINT — Internal core supply 5V |
| Chân 25 | I/O — User I/O pin (bank 3) |
| Chân 26 | I/O — User I/O pin (bank 3) |
| Chân 27 | I/O — User I/O pin (bank 3) |
| Chân 28 | GND — Ground |
| Chân 29 | I/O — User I/O pin (bank 3) |
| Chân 30 | I/O — User I/O pin (bank 3) |
| Chân 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 32 | I/O — User I/O pin (bank 3) |
| Chân 33 | I/O — User I/O pin (bank 4) |
| Chân 34 | I/O — User I/O pin (bank 4) |
| Chân 35 | GND — Ground |
| Chân 36 | CLK2 — Dedicated clock input 2 |
| Chân 37 | CLK3 — Dedicated clock input 3 |
| Chân 38 | I/O — User I/O pin (bank 4) |
| Chân 39 | I/O — User I/O pin (bank 4) |
| Chân 40 | VCCINT — Internal core supply 5V |
| Chân 41 | I/O — User I/O pin (bank 4) |
| Chân 42 | I/O — User I/O pin (bank 4) |
| Chân 43 | I/O — User I/O pin (bank 5) |
| Chân 44 | GND — Ground |
| Chân 45 | I/O — User I/O pin (bank 5) |
| Chân 46 | I/O — User I/O pin (bank 5) |
| Chân 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 48 | I/O — User I/O pin (bank 5) |
| Chân 49 | I/O — User I/O pin (bank 5) |
| Chân 50 | I/O — User I/O pin (bank 6) |
| Chân 51 | GND — Ground |
| Chân 52 | I/O — User I/O pin (bank 6) |
| Chân 53 | I/O — User I/O pin (bank 6) |
| Chân 54 | VCCINT — Internal core supply 5V |
| Chân 55 | I/O — User I/O pin (bank 6) |
| Chân 56 | I/O — User I/O pin (bank 6) |
| Chân 57 | I/O — User I/O pin (bank 7) |
| Chân 58 | GND — Ground |
| Chân 59 | I/O — User I/O pin (bank 7) |
| Chân 60 | I/O — User I/O pin (bank 7) |
| Chân 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 62 | I/O — User I/O pin (bank 7) |
| Chân 63 | I/O — User I/O pin (bank 7) |
| Chân 64 | I/O — User I/O pin (bank 8) |
| Chân 65 | GND — Ground |
| Chân 66 | I/O — User I/O pin (bank 8) |
| Chân 67 | I/O — User I/O pin (bank 8) |
| Chân 68 | VCCINT — Internal core supply 5V |
| Chân 69 | I/O — User I/O pin (bank 8) |
| Chân 70 | I/O — User I/O pin (bank 8) |
| Chân 71 | I/O — User I/O pin (bank 1) |
| Chân 72 | GND — Ground |
| Chân 73 | I/O — User I/O pin (bank 1) |
| Chân 74 | I/O — User I/O pin (bank 1) |
| Chân 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 76 | I/O — User I/O pin (bank 1) |
| Chân 77 | I/O — User I/O pin (bank 2) |
| Chân 78 | I/O — User I/O pin (bank 2) |
| Chân 79 | GND — Ground |
| Chân 80 | I/O — User I/O pin (bank 2) |
| Chân 81 | I/O — User I/O pin (bank 2) |
| Chân 82 | VCCINT — Internal core supply 5V |
| Chân 83 | I/O — User I/O pin (bank 2) |
| Chân 84 | I/O — User I/O pin (bank 3) |
| Chân 85 | I/O — User I/O pin (bank 3) |
| Chân 86 | GND — Ground |
| Chân 87 | I/O — User I/O pin (bank 3) |
| Chân 88 | I/O — User I/O pin (bank 3) |
| Chân 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 90 | I/O — User I/O pin (bank 3) |
| Chân 91 | I/O — User I/O pin (bank 4) |
| Chân 92 | I/O — User I/O pin (bank 4) |
| Chân 93 | GND — Ground |
| Chân 94 | I/O — User I/O pin (bank 4) |
| Chân 95 | I/O — User I/O pin (bank 4) |
| Chân 96 | VCCINT — Internal core supply 5V |
| Chân 97 | I/O — User I/O pin (bank 4) |
| Chân 98 | I/O — User I/O pin (bank 5) |
| Chân 99 | I/O — User I/O pin (bank 5) |
| Chân 100 | GND — Ground |
| Chân 101 | I/O — User I/O pin (bank 5) |
| Chân 102 | I/O — User I/O pin (bank 5) |
| Chân 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 104 | I/O — User I/O pin (bank 5) |
| Chân 105 | I/O — User I/O pin (bank 6) |
| Chân 106 | I/O — User I/O pin (bank 6) |
| Chân 107 | GND — Ground |
| Chân 108 | I/O — User I/O pin (bank 6) |
| Chân 109 | I/O — User I/O pin (bank 6) |
| Chân 110 | VCCINT — Internal core supply 5V |
| Chân 111 | I/O — User I/O pin (bank 6) |
| Chân 112 | I/O — User I/O pin (bank 7) |
| Chân 113 | I/O — User I/O pin (bank 7) |
| Chân 114 | GND — Ground |
| Chân 115 | I/O — User I/O pin (bank 7) |
| Chân 116 | I/O — User I/O pin (bank 7) |
| Chân 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 118 | I/O — User I/O pin (bank 7) |
| Chân 119 | I/O — User I/O pin (bank 8) |
| Chân 120 | I/O — User I/O pin (bank 8) |
| Chân 121 | GND — Ground |
| Chân 122 | I/O — User I/O pin (bank 8) |
| Chân 123 | I/O — User I/O pin (bank 8) |
| Chân 124 | VCCINT — Internal core supply 5V |
| Chân 125 | I/O — User I/O pin (bank 8) |
| Chân 126 | I/O — User I/O pin (bank 1) |
| Chân 127 | I/O — User I/O pin (bank 1) |
| Chân 128 | GND — Ground |
| Chân 129 | I/O — User I/O pin (bank 1) |
| Chân 130 | I/O — User I/O pin (bank 1) |
| Chân 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 132 | I/O — User I/O pin (bank 1) |
| Chân 133 | I/O — User I/O pin (bank 2) |
| Chân 134 | I/O — User I/O pin (bank 2) |
| Chân 135 | GND — Ground |
| Chân 136 | I/O — User I/O pin (bank 2) |
| Chân 137 | I/O — User I/O pin (bank 2) |
| Chân 138 | VCCINT — Internal core supply 5V |
| Chân 139 | I/O — User I/O pin (bank 2) |
| Chân 140 | I/O — User I/O pin (bank 3) |
| Chân 141 | I/O — User I/O pin (bank 3) |
| Chân 142 | GND — Ground |
| Chân 143 | I/O — User I/O pin (bank 3) |
| Chân 144 | I/O — User I/O pin (bank 3) |
| Chân 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 146 | I/O — User I/O pin (bank 3) |
| Chân 147 | I/O — User I/O pin (bank 4) |
| Chân 148 | I/O — User I/O pin (bank 4) |
| Chân 149 | GND — Ground |
| Chân 150 | I/O — User I/O pin (bank 4) |
| Chân 151 | I/O — User I/O pin (bank 4) |
| Chân 152 | VCCINT — Internal core supply 5V |
| Chân 153 | I/O — User I/O pin (bank 4) |
| Chân 154 | I/O — User I/O pin (bank 5) |
| Chân 155 | I/O — User I/O pin (bank 5) |
| Chân 156 | GND — Ground |
| Chân 157 | I/O — User I/O pin (bank 5) |
| Chân 158 | I/O — User I/O pin (bank 5) |
| Chân 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 160 | I/O — User I/O pin (bank 5) |
| Chân 161 | I/O — User I/O pin (bank 6) |
| Chân 162 | I/O — User I/O pin (bank 6) |
| Chân 163 | GND — Ground |
| Chân 164 | I/O — User I/O pin (bank 6) |
| Chân 165 | I/O — User I/O pin (bank 6) |
| Chân 166 | VCCINT — Internal core supply 5V |
| Chân 167 | I/O — User I/O pin (bank 6) |
| Chân 168 | I/O — User I/O pin (bank 7) |
| Chân 169 | I/O — User I/O pin (bank 7) |
| Chân 170 | GND — Ground |
| Chân 171 | I/O — User I/O pin (bank 7) |
| Chân 172 | I/O — User I/O pin (bank 7) |
| Chân 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 174 | I/O — User I/O pin (bank 7) |
| Chân 175 | I/O — User I/O pin (bank 8) |
| Chân 176 | I/O — User I/O pin (bank 8) |
| Chân 177 | GND — Ground |
| Chân 178 | I/O — User I/O pin (bank 8) |
| Chân 179 | I/O — User I/O pin (bank 8) |
| Chân 180 | VCCINT — Internal core supply 5V |
| Chân 181 | I/O — User I/O pin (bank 8) |
| Chân 182 | I/O — User I/O pin (bank 1) |
| Chân 183 | I/O — User I/O pin (bank 1) |
| Chân 184 | GND — Ground |
| Chân 185 | I/O — User I/O pin (bank 1) |
| Chân 186 | I/O — User I/O pin (bank 1) |
| Chân 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 188 | I/O — User I/O pin (bank 1) |
| Chân 189 | I/O — User I/O pin (bank 2) |
| Chân 190 | I/O — User I/O pin (bank 2) |
| Chân 191 | GND — Ground |
| Chân 192 | I/O — User I/O pin (bank 2) |
| Chân 193 | I/O — User I/O pin (bank 2) |
| Chân 194 | VCCINT — Internal core supply 5V |
| Chân 195 | I/O — User I/O pin (bank 2) |
| Chân 196 | I/O — User I/O pin (bank 3) |
| Chân 197 | I/O — User I/O pin (bank 3) |
| Chân 198 | GND — Ground |
| Chân 199 | I/O — User I/O pin (bank 3) |
| Chân 200 | I/O — User I/O pin (bank 3) |
| Chân 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| Chân 202 | I/O — User I/O pin (bank 3) |
| Chân 203 | I/O — User I/O pin (bank 4) |
| Chân 204 | I/O — User I/O pin (bank 4) |
| Chân 205 | GND — Ground |
| Chân 206 | I/O — User I/O pin (bank 4) |
| Chân 207 | I/O — User I/O pin (bank 4) |
| Chân 208 | VCCINT — Internal core supply 5V |
Ứng dụng tiêu biểu
EPF8820ARI208-4 phù hợp cho 6 Áp dụngs: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
Được đề xuất
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
Được đề xuất
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
Được đề xuất
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
Được đề xuất
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
Được đề xuất
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF8820ARI208-4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
Bảo phân biệt quan trọng
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (vsEPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (vsEPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (vsDiscrete 74LS/74HC logic equivalent)
Ghi chú thiết kế
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
Thông tin tuân thủ
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).