EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
MPN: EPF8820ARI208-4 ✗ اختتامِ زندگیEPF8820ARI208-4 جائزہ
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
کے لیے ڈراپ اِن متبادل EPF8820ARI208-4 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF8820ARI208-4 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
EPF8820ARI208-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARI208-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARI208-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARI208-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARI208-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARC208-4
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARC208-4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF8820ARI208-4 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| پیکیج | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
EPF8820ARI208-4 پن کنفیگریشن
| پن 1 | I/O — User I/O pin (bank 1) |
| پن 2 | I/O — User I/O pin (bank 1) |
| پن 3 | VCCINT — Internal core supply 5V |
| پن 4 | I/O — User I/O pin (bank 1) |
| پن 5 | GND — Ground |
| پن 6 | nCONFIG — Configuration control (active low) |
| پن 7 | nSTATUS — Configuration status (active low) |
| پن 8 | CONF_DONE — Configuration complete indicator |
| پن 9 | DCLK — Configuration clock input |
| پن 10 | DATA0 — Configuration data input |
| پن 11 | TCK — JTAG test clock |
| پن 12 | TMS — JTAG test mode select |
| پن 13 | TDI — JTAG test data in |
| پن 14 | TDO — JTAG test data out |
| پن 15 | CLK0 — Dedicated clock input 0 |
| پن 16 | CLK1 — Dedicated clock input 1 |
| پن 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 18 | I/O — User I/O pin (bank 2) |
| پن 19 | I/O — User I/O pin (bank 2) |
| پن 20 | I/O — User I/O pin (bank 2) |
| پن 21 | GND — Ground |
| پن 22 | I/O — User I/O pin (bank 2) |
| پن 23 | I/O — User I/O pin (bank 2) |
| پن 24 | VCCINT — Internal core supply 5V |
| پن 25 | I/O — User I/O pin (bank 3) |
| پن 26 | I/O — User I/O pin (bank 3) |
| پن 27 | I/O — User I/O pin (bank 3) |
| پن 28 | GND — Ground |
| پن 29 | I/O — User I/O pin (bank 3) |
| پن 30 | I/O — User I/O pin (bank 3) |
| پن 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 32 | I/O — User I/O pin (bank 3) |
| پن 33 | I/O — User I/O pin (bank 4) |
| پن 34 | I/O — User I/O pin (bank 4) |
| پن 35 | GND — Ground |
| پن 36 | CLK2 — Dedicated clock input 2 |
| پن 37 | CLK3 — Dedicated clock input 3 |
| پن 38 | I/O — User I/O pin (bank 4) |
| پن 39 | I/O — User I/O pin (bank 4) |
| پن 40 | VCCINT — Internal core supply 5V |
| پن 41 | I/O — User I/O pin (bank 4) |
| پن 42 | I/O — User I/O pin (bank 4) |
| پن 43 | I/O — User I/O pin (bank 5) |
| پن 44 | GND — Ground |
| پن 45 | I/O — User I/O pin (bank 5) |
| پن 46 | I/O — User I/O pin (bank 5) |
| پن 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 48 | I/O — User I/O pin (bank 5) |
| پن 49 | I/O — User I/O pin (bank 5) |
| پن 50 | I/O — User I/O pin (bank 6) |
| پن 51 | GND — Ground |
| پن 52 | I/O — User I/O pin (bank 6) |
| پن 53 | I/O — User I/O pin (bank 6) |
| پن 54 | VCCINT — Internal core supply 5V |
| پن 55 | I/O — User I/O pin (bank 6) |
| پن 56 | I/O — User I/O pin (bank 6) |
| پن 57 | I/O — User I/O pin (bank 7) |
| پن 58 | GND — Ground |
| پن 59 | I/O — User I/O pin (bank 7) |
| پن 60 | I/O — User I/O pin (bank 7) |
| پن 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 62 | I/O — User I/O pin (bank 7) |
| پن 63 | I/O — User I/O pin (bank 7) |
| پن 64 | I/O — User I/O pin (bank 8) |
| پن 65 | GND — Ground |
| پن 66 | I/O — User I/O pin (bank 8) |
| پن 67 | I/O — User I/O pin (bank 8) |
| پن 68 | VCCINT — Internal core supply 5V |
| پن 69 | I/O — User I/O pin (bank 8) |
| پن 70 | I/O — User I/O pin (bank 8) |
| پن 71 | I/O — User I/O pin (bank 1) |
| پن 72 | GND — Ground |
| پن 73 | I/O — User I/O pin (bank 1) |
| پن 74 | I/O — User I/O pin (bank 1) |
| پن 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 76 | I/O — User I/O pin (bank 1) |
| پن 77 | I/O — User I/O pin (bank 2) |
| پن 78 | I/O — User I/O pin (bank 2) |
| پن 79 | GND — Ground |
| پن 80 | I/O — User I/O pin (bank 2) |
| پن 81 | I/O — User I/O pin (bank 2) |
| پن 82 | VCCINT — Internal core supply 5V |
| پن 83 | I/O — User I/O pin (bank 2) |
| پن 84 | I/O — User I/O pin (bank 3) |
| پن 85 | I/O — User I/O pin (bank 3) |
| پن 86 | GND — Ground |
| پن 87 | I/O — User I/O pin (bank 3) |
| پن 88 | I/O — User I/O pin (bank 3) |
| پن 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 90 | I/O — User I/O pin (bank 3) |
| پن 91 | I/O — User I/O pin (bank 4) |
| پن 92 | I/O — User I/O pin (bank 4) |
| پن 93 | GND — Ground |
| پن 94 | I/O — User I/O pin (bank 4) |
| پن 95 | I/O — User I/O pin (bank 4) |
| پن 96 | VCCINT — Internal core supply 5V |
| پن 97 | I/O — User I/O pin (bank 4) |
| پن 98 | I/O — User I/O pin (bank 5) |
| پن 99 | I/O — User I/O pin (bank 5) |
| پن 100 | GND — Ground |
| پن 101 | I/O — User I/O pin (bank 5) |
| پن 102 | I/O — User I/O pin (bank 5) |
| پن 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 104 | I/O — User I/O pin (bank 5) |
| پن 105 | I/O — User I/O pin (bank 6) |
| پن 106 | I/O — User I/O pin (bank 6) |
| پن 107 | GND — Ground |
| پن 108 | I/O — User I/O pin (bank 6) |
| پن 109 | I/O — User I/O pin (bank 6) |
| پن 110 | VCCINT — Internal core supply 5V |
| پن 111 | I/O — User I/O pin (bank 6) |
| پن 112 | I/O — User I/O pin (bank 7) |
| پن 113 | I/O — User I/O pin (bank 7) |
| پن 114 | GND — Ground |
| پن 115 | I/O — User I/O pin (bank 7) |
| پن 116 | I/O — User I/O pin (bank 7) |
| پن 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 118 | I/O — User I/O pin (bank 7) |
| پن 119 | I/O — User I/O pin (bank 8) |
| پن 120 | I/O — User I/O pin (bank 8) |
| پن 121 | GND — Ground |
| پن 122 | I/O — User I/O pin (bank 8) |
| پن 123 | I/O — User I/O pin (bank 8) |
| پن 124 | VCCINT — Internal core supply 5V |
| پن 125 | I/O — User I/O pin (bank 8) |
| پن 126 | I/O — User I/O pin (bank 1) |
| پن 127 | I/O — User I/O pin (bank 1) |
| پن 128 | GND — Ground |
| پن 129 | I/O — User I/O pin (bank 1) |
| پن 130 | I/O — User I/O pin (bank 1) |
| پن 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 132 | I/O — User I/O pin (bank 1) |
| پن 133 | I/O — User I/O pin (bank 2) |
| پن 134 | I/O — User I/O pin (bank 2) |
| پن 135 | GND — Ground |
| پن 136 | I/O — User I/O pin (bank 2) |
| پن 137 | I/O — User I/O pin (bank 2) |
| پن 138 | VCCINT — Internal core supply 5V |
| پن 139 | I/O — User I/O pin (bank 2) |
| پن 140 | I/O — User I/O pin (bank 3) |
| پن 141 | I/O — User I/O pin (bank 3) |
| پن 142 | GND — Ground |
| پن 143 | I/O — User I/O pin (bank 3) |
| پن 144 | I/O — User I/O pin (bank 3) |
| پن 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 146 | I/O — User I/O pin (bank 3) |
| پن 147 | I/O — User I/O pin (bank 4) |
| پن 148 | I/O — User I/O pin (bank 4) |
| پن 149 | GND — Ground |
| پن 150 | I/O — User I/O pin (bank 4) |
| پن 151 | I/O — User I/O pin (bank 4) |
| پن 152 | VCCINT — Internal core supply 5V |
| پن 153 | I/O — User I/O pin (bank 4) |
| پن 154 | I/O — User I/O pin (bank 5) |
| پن 155 | I/O — User I/O pin (bank 5) |
| پن 156 | GND — Ground |
| پن 157 | I/O — User I/O pin (bank 5) |
| پن 158 | I/O — User I/O pin (bank 5) |
| پن 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 160 | I/O — User I/O pin (bank 5) |
| پن 161 | I/O — User I/O pin (bank 6) |
| پن 162 | I/O — User I/O pin (bank 6) |
| پن 163 | GND — Ground |
| پن 164 | I/O — User I/O pin (bank 6) |
| پن 165 | I/O — User I/O pin (bank 6) |
| پن 166 | VCCINT — Internal core supply 5V |
| پن 167 | I/O — User I/O pin (bank 6) |
| پن 168 | I/O — User I/O pin (bank 7) |
| پن 169 | I/O — User I/O pin (bank 7) |
| پن 170 | GND — Ground |
| پن 171 | I/O — User I/O pin (bank 7) |
| پن 172 | I/O — User I/O pin (bank 7) |
| پن 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 174 | I/O — User I/O pin (bank 7) |
| پن 175 | I/O — User I/O pin (bank 8) |
| پن 176 | I/O — User I/O pin (bank 8) |
| پن 177 | GND — Ground |
| پن 178 | I/O — User I/O pin (bank 8) |
| پن 179 | I/O — User I/O pin (bank 8) |
| پن 180 | VCCINT — Internal core supply 5V |
| پن 181 | I/O — User I/O pin (bank 8) |
| پن 182 | I/O — User I/O pin (bank 1) |
| پن 183 | I/O — User I/O pin (bank 1) |
| پن 184 | GND — Ground |
| پن 185 | I/O — User I/O pin (bank 1) |
| پن 186 | I/O — User I/O pin (bank 1) |
| پن 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 188 | I/O — User I/O pin (bank 1) |
| پن 189 | I/O — User I/O pin (bank 2) |
| پن 190 | I/O — User I/O pin (bank 2) |
| پن 191 | GND — Ground |
| پن 192 | I/O — User I/O pin (bank 2) |
| پن 193 | I/O — User I/O pin (bank 2) |
| پن 194 | VCCINT — Internal core supply 5V |
| پن 195 | I/O — User I/O pin (bank 2) |
| پن 196 | I/O — User I/O pin (bank 3) |
| پن 197 | I/O — User I/O pin (bank 3) |
| پن 198 | GND — Ground |
| پن 199 | I/O — User I/O pin (bank 3) |
| پن 200 | I/O — User I/O pin (bank 3) |
| پن 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| پن 202 | I/O — User I/O pin (bank 3) |
| پن 203 | I/O — User I/O pin (bank 4) |
| پن 204 | I/O — User I/O pin (bank 4) |
| پن 205 | GND — Ground |
| پن 206 | I/O — User I/O pin (bank 4) |
| پن 207 | I/O — User I/O pin (bank 4) |
| پن 208 | VCCINT — Internal core supply 5V |
عام استعمالات
EPF8820ARI208-4 کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
تجویز کردہ
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
تجویز کردہ
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
تجویز کردہ
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
تجویز کردہ
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
تجویز کردہ
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF8820ARI208-4 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
اہم امتیازی خصوصیات
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (بمقابلہEPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (بمقابلہEPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (بمقابلہDiscrete 74LS/74HC logic equivalent)
ڈیزائن نوٹس
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
تعمیل کی معلومات
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).