FPGA & CPLD
Products (6352)
10AX115N2F45I2SG - Arria 10 GX FPGA, 1.15M LEs, F45 | Intel
The Intel (formerly Altera) 10AX115N2F45I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/Os in a 1932-ball Flip-Chip BGA (FCBGA/FBGA) package measuring 45 x 45 mm. It is built on Intel's 20 nm process and operates from a 0.9 V core supply with industrial-grade temperature rating (-40C to +100C junction). An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure arbitrary digital logic via a hardware description language (HDL). FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, simpler) and ASICs (fixed, higher NRE). The Arria 10 family targets mid-range, transceiver-rich applications bridging Cyclone (low-cost) and Stratix (high-performance) families, and the GX sub-family adds integrated multi-gigabit transceivers for high-speed serial connectivity. Key features of the 10AX115N2F45I2SG include 1,150,000 logic elements, embedded DSP blocks for high-throughput signal processing, hard memory controllers supporting DDR4/DDR3/LPDDR3, integrated PCI Express Gen3 hard IP, and 17.4 Gbps transceivers (per Arria 10 GX family specs). The 'N2' suffix indicates normal-power operation with -2 speed grade, the 'I' indicates industrial temperature grade, '2SG' specifies Pb-free packaging in tray form. The F45 designation refers to the 45 mm BGA package family. Typical applications for this device span 4K video processing and broadcast equipment, 100G/400G optical transport networking, radar and electronic warfare signal processing, 5G fronthaul/backhaul baseband, and high-performance compute acceleration. The integrated transceivers and PCI Express Gen3 hard IP make it especially suitable for data-intensive protocols requiring both high logic density and high-speed serial I/O. When designing with this 1932-ball FCBGA, allocate a minimum of 12 PCB layers with buried vias for breakout, follow Intel's recommended power-on sequencing with monotonic ramp for the 0.9 V core, and provide thermal management capable of dissipating up to ~40 W under full utilization. Always cross-reference the specific OPN against the Arria 10 datasheet for the latest errata and power characterization. This page synthesizes distributor pricing, package-level parameters, and same-family drop-in alternatives not found in the manufacturer product page alone. All alternatives share the 45 mm FCBGA package family and pin count, enabling PCB reuse within the Arria 10 GX family.
10AX115N3F40E2LG - Arria 10 GX FPGA 1150K LE | Altera | F40 FCBGA
The Altera (Intel) 10AX115N3F40E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 600 user I/O pins in a 1517-ball Flip-Chip BGA (FCBGA) package with F40 speed grade and -2 core performance. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded DSP blocks, high-speed transceivers, and on-chip memory that can be re-programmed post-manufacture to implement arbitrary digital logic. FPGAs occupy the tier between general-purpose microcontrollers and fixed-function ASICs in the programmable logic hierarchy: FPGA -> programmable logic -> logic device -> semiconductor. They are widely used for high-throughput parallel processing, hardware-accelerated compute, and protocol bridging where CPU performance or ASIC NRE cost is prohibitive. The Arria 10 architecture integrates up to 96 full-duplex transceivers supporting data rates to 17.4 Gbps (GXT) and 12.5 Gbps (GX), hardened PCI Express Gen3 hard IP blocks, dual ARM Cortex-A9 hard processor system options (in SoC variants), and 20 nm process technology. The 10AX115 device class provides 1,518 18x19 multipliers and approximately 1,766 GMACS of fixed-point DSP throughput, targeting mid-to-high-end DSP, broadcast, and 100G/400G wireline applications. The F40 package denotes a 40 mm square FCBGA substrate with 1.0 mm ball pitch, while the -2 speed grade specifies performance and power balance for mid-bandwidth designs. This specific OPN 10AX115N3F40E2LG targets industrial/commercial temperature envelopes with the lead-free (LG) finish. It is pin-compatible with sibling OPNs in the same F40 footprint across the Arria 10 GX family. Typical applications include 100G/400G optical transport line cards, broadcast video processing (4K/8K UHD), military radar signal processing, medical imaging backplanes, and high-performance test & measurement instrumentation. Designers leverage the 17.4 Gbps transceivers for chip-to-chip and backplane serial links, while the DSP blocks accelerate FFT, FIR, and channelization functions. When designing with this device, perform signal-integrity simulation on the 17.4 Gbps SERDES channels early in the cycle and allocate sufficient PCB layers for reference-plane continuity under the BGA field. Thermal design must account for the 1517-ball FCBGA junction-to-ambient resistance and the variable power dissipation across logic utilization, with a recommended heatsink for sustained workloads above 60 percent logic utilization. This page synthesizes distributor pricing, Altera ordering code decoding, drop-in alternatives within the Arria 10 GX family, and practical design notes not consolidated in the manufacturer datasheet.
10AX115N3F40E2SG - Arria 10 GX FPGA 1.15M LE | Intel
The Intel (formerly Altera) 10AX115N3F40E2SG is a high-performance, power-efficient Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20nm process technology, offering 1,150,000 logic elements in a 1517-ball BGA (FCBGA, F40 package) and 0.9V core operation. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and configurable I/O elements that engineers can reconfigure after manufacturing to implement custom digital circuits, signal-processing pipelines, or even entire SoCs. Within the broader taxonomy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: more flexible than ASICs and far more parallel than CPUs/GPUs. The Arria 10 family specifically targets mid- to high-end applications where high transceiver bandwidth, DSP throughput, and power efficiency are simultaneously required. Key features include 600 high-speed transceivers capable of up to 17.4 Gbps (with the GX variant), integrated PCIe Gen3 hard IP blocks, variable-precision DSP blocks, and up to 68,857,856 bits of embedded memory. The device integrates hardened memory controllers, including DDR4 support, alongside a robust hard-processor subsystem option for SoC variants. The Arria 10 architecture employs an adaptive logic module (ALM) fabric that delivers 25% higher performance compared to prior mid-range FPGA families while reducing power by up to 40%. Typical applications include high-end wireless infrastructure (baseband processing, CPRI/OBSAI fronthaul), military radar and electronic warfare, broadcast video processing, medical imaging systems, and high-performance computing accelerators. The integrated transceivers and PCIe Gen3 hard IP make it particularly well-suited for backhaul and fronthaul telecom equipment as well as test and measurement instrumentation. When designing with this device, careful attention must be paid to PCB layout for the 1517-ball FCBGA: a 12+ layer stack-up with microvia technology is typical, and thermal management requires a heatsink or cold-plate solution due to the device's power envelope. Quartus Prime software is required for compilation, simulation, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10AX115N3F40I2LG - Arria 10 GX FPGA 1150K LE | Intel F40 BGA
The Intel (Altera) 10AX115N3F40I2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 embedded memory bits, and 600 user I/O pins, housed in a 1517-ball FCBGA package with industrial -40C to +100C temperature grade. The device is built on TSMC's 20nm process and pairs a hardened transceiver subsystem with a variable-precision DSP block fabric, delivering up to 1.5 Gbps LVDS performance and 14.4 Gbps backplane capability on the GX transceiver tiles. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor whose logic fabric, routing, and I/O cells are defined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit at the top of the programmable-logic hierarchy: programmable logic -> FPGA -> SoC FPGA, paralleling CPUs/GPUs but with deterministic latency and full hardware parallelism for DSP, packet processing, and high-speed serial I/O. The Arria 10 family targets mid-range applications that demand transceivers, DSP bandwidth, and memory throughput without migrating to a custom ASIC. Key features include 28.05 Mbit on-chip memory, dual ARM Cortex-A9 hard processor subsystem option, 17.4 Gbps transceiver data rate, and 1.6 Gbps DDR4 external memory interface support. The -I2 suffix denotes industrial operating temperature (TJ -40C to +100C), and LG specifies a Pb-free tray packaging format. The device is supported by Quartus Prime design software with reference designs for PCIe Gen3 x8, 100G Ethernet MAC, and JESD204B interfaces. Architecturally, the 10AX115N3F40I2LG uses a logic array block (LAB) of adaptive logic modules (ALMs), each containing an 8-input fracturable lookup table, two dedicated adders, and four registers. The GX transceiver tiles integrate PCS and PMA layers supporting protocols such as PCIe Gen3, 10G/40G Ethernet, CPRI, and Serial RapidIO. Hard memory controllers and a hard PCI Express Gen3 IP block accelerate common interface functions. Typical applications include 100G line card packet processing, software-defined radio baseband, medical imaging accelerators, broadcast video processing, and ASIC prototyping. The combination of transceivers, DSP blocks, and embedded memory makes this device well suited to data-plane offload and signal-processing workloads in communications infrastructure. When designing with this device, plan for the FCBGA-1517 thermal envelope, layer-count PCB stack-up, and power-rail sequencing (10AX family requires a specific multi-rail ramp order). Quartus Prime power-play early power estimation should be run before PCB commitment to size the core VRM and heatsink. This page synthesizes distributor stock data, industrial-grade variant alternatives, and practical design notes not found in the manufacturer datasheet alone.
10AX115N3F40I2SG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel
The Intel 10AX115N3F40I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) from Intel's Arria 10 family, featuring 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 600 user I/Os in a 1517-ball FCBGA (F40) package. Built on TSMC's 20nm process, this industrial-temperature-grade variant is supplied in a 0.9V core configuration and supports up to 17.4 Gbps transceiver data rates for high-bandwidth serial interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, memory blocks, DSP slices, and I/O routing can be reconfigured after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves belong to the larger category of application-specific integrated circuits (ASICs) and digital ICs. Arria 10 GX FPGAs target mid-range, transceiver-rich applications such as wireless infrastructure, broadcast video, and military signal processing, occupying the market segment between Cyclone (cost-optimized) and Stratix (high-performance) families. Key features include 1,150,000 logic elements, 68.86 Mbits embedded SRAM, 1,518 DSP blocks (18x19 multipliers), 24 transceivers supporting CPRI, PCIe Gen3, and 10G Ethernet, and hard memory controllers supporting DDR4 up to 1,600 Mbps. The 1517-ball FCBGA package uses Intel's flip-chip BGA technology for high pin count and superior electrical/thermal performance over wire-bond BGA variants. The architecture combines a hardened 64-bit quad-core ARM Cortex-A9 hard processor subsystem in the SoC variants, adaptive logic modules (ALMs), MLAB memory, and variable-precision DSP blocks. The 20nm process enables higher logic density and lower static power than the previous 28nm Arria V generation, with the GX family specifically optimized for serial transceiver bandwidth. Typical applications include 4K broadcast video processing, wireless backhaul (CPRI/OBSAI), test and measurement instrumentation, military radar and electronic warfare prototyping, and PCIe Gen3 acceleration cards. Industrial temperature grade (-40C to +100C junction) makes it suitable for ruggedized environments. The 10AX115N3F40I2SG specifically fits designs requiring the highest logic density in the Arria 10 family with the F40 (1517-ball) package outline. When designing with this device, ensure your PCB BGA land pattern matches the 1517-ball FCBGA specification and that the PCB stackup supports the 17.4 Gbps transceiver channels. Quartus Prime software (Pro or Standard edition) is required for design entry, synthesis, place-and-route, and timing closure. Power estimation should be performed early using the Intel PowerPlay early power estimator to size regulators and thermal solutions. This page synthesizes distributor pricing, same-package drop-in alternatives within the Arria 10 family, and practical PCB design considerations that go beyond the manufacturer datasheet alone.
10AX115N3F45E2LG - Arria 10 GX 1.15M LE FPGA | Intel | 1932-FCBGA
The Intel (formerly Altera) 10AX115N3F45E2LG is a high-density Arria 10 GX field-programmable gate array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/O in a 1932-ball flip-chip BGA (FCBGA) package. Built on a 20 nm process, it targets mid-range high-performance applications that require a balance of logic density, transceiver bandwidth, and DSP throughput without the power envelope of a Stratix-class device. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are configured after manufacture via a hardware description language (HDL) bitstream. In the broader taxonomy, an FPGA sits alongside CPUs, GPUs, and ASICs as a compute element, distinguished by reconfigurability and parallel hardware execution. The Arria 10 GX family specifically targets applications that need integrated multi-gigabit transceivers and IEEE 754-compliant hard floating-point DSP blocks. Key features include up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, variable-precision digital signal processing (DSP) blocks, and partial reconfiguration support. The device also integrates HardCopy block memory, dedicated PCle Gen3 IP cores, and supports DDR4 external memory interfaces up to 2666 Mbps, providing deterministic low-latency access to high-bandwidth system memory. Architecturally, the Arria 10 GX leverages an adaptive logic module (ALM), 20K KTM (20 kilobit) memory blocks, and a multi-clock network with up to 32 global clock trees per quadrant. The 20 nm Tri-Gate transistors and Smart Voltage ID (SmartVID) reduce both static and dynamic power relative to the prior 28 nm Arria V generation, while preserving pin-to-pin software compatibility for easier migration. Typical applications include high-end video broadcast and professional AV processing, 4K/UHD video encoding/decoding acceleration, 5G wireless baseband and remote radio units, military radar and electronic warfare, medical imaging, and ASIC prototyping. Designers also use it for test and measurement instrumentation where deterministic latency and parallel DSP are required. When designing with this device, ensure the PCB has a 1932-ball FCBGA footprint with matched-length impedance-controlled lanes for the high-speed transceivers, and provide a robust power distribution network covering the 0.9 V core, 1.2 V auxiliary, and transceiver rails. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. This page synthesizes real distributor pricing, drop-in alternatives from the same Arria 10 family, and practical design notes not typically aggregated on a single manufacturer page.
10AX115N3F45E2SG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
The Intel 10AX115N3F45E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20 nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/Os in a 1932-ball Flip-Chip BGA (FCBGA) package measuring 45 x 45 mm. The device belongs to the Arria 10 GX family (10AX115) and is the F45 package variant, qualified to the -2 speed grade with E2 temperature and industrial processing screening. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceiver tiles, all interconnected by a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-density transceivers-equipped FPGAs. Arria 10 devices target mid-range applications that demand a balance of logic capacity, transceiver bandwidth, and power efficiency, sitting between the lower-cost Cyclone family and the high-performance Stratix family in Intel's portfolio. Key features include up to 24 backplane-capable transceivers running up to 12.5 Gbps (GX variant), hardened PCIe Gen3 and Gen2 IP blocks, dual ARM Cortex-A9 MPCore hard processor system support in the SoC variants, and configurable logic elements with adaptive logic modules (ALMs). The 20 nm process allows the device to integrate 1.15 M logic elements while maintaining typical core power consumption competitive with 28 nm predecessors. Architecturally, the Arria 10 GX combines a heterogeneous fabric of ALMs, M20K embedded SRAM blocks, variable-precision DSP blocks (27 x 27 multipliers), and hard IP for memory controllers and PCIe. The transceiver tiles support protocols such as PCIe Gen3, 10 Gigabit Ethernet, CPRI, and JESD204B, while the device's hard floating-point multipliers accelerate DSP workloads in radar, beamforming, and machine-learning inference. Typical applications include wireless baseband processing, radar signal processing, military secure communications, broadcast video encoding, medical imaging accelerators, test and measurement equipment with high-speed serial interfaces, and high-performance computing (HPC) accelerator cards. The 768 user I/Os support parallel LVDS and DDR4 memory interfaces for data-intensive designs. When designing with the 10AX115N3F45E2SG, attention must be paid to PCB escape routing for the 1932-ball FCBGA; the 1.0 mm ball pitch requires HDI stack-up with micro-vias. Power integrity design must consider the device's multi-rail core, transceiver, and auxiliary supplies, each requiring decoupling and bulk capacitance sized per Intel's power distribution network guidelines.
10AX115N3F45I2LG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
The Intel 10AX115N3F45I2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) fabricated on a 20nm process, integrating approximately 1,150,000 logic elements in a 1932-ball FC-FBGA (FCBGA) package. It is a member of the Arria 10 GX family, which combines high-performance FPGA fabric with up to 28.05 Gbps transceivers and a hardened floating-point digital signal processing (DSP) block architecture. The device is specified for industrial temperature grade operation and supports 768 user I/O pins. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure digital circuits at the silicon level after manufacturing. FPGAs belong to the broader semiconductor hierarchy that includes ASICs, microcontrollers, and CPLDs. The Arria 10 GX family specifically targets mid-range applications that require the balance of high logic density, transceiver performance, and DSP throughput typical of mid-to-high-end FPGA designs. Key features of the 10AX115N3F45I2LG include up to 28.05 Gbps serial transceiver data rates, a hardened floating-point DSP block (IEEE 754 single-precision), on-chip memory resources, and integrated PCI Express Gen3 hard IP. The device is built on TSMC's 20nm process, providing favorable power-to-performance characteristics for high-throughput data processing applications. The -2 speed bin and industrial temperature grade (-40C to +100C junction) make it suitable for deployment in industrial, medical, and defense environments. Architecture highlights include a logic element fabric based on 8-input adaptive logic modules (ALMs), variable-precision DSP blocks, and a multi-ternary content-addressable memory (TCAM) per logic array block (LAB). Memory resources include M20K block memory and logic array memory (MLAB), while interconnect is supported by a multi-track routing architecture and a clock network with programmable skew and phase control. These capabilities make the part well-suited for high-throughput DSP and parallel processing tasks. Typical applications of the 10AX115N3F45I2LG include high-performance digital signal processing, software-defined radio (SDR), 4G/5G baseband and fronthaul processing, high-speed serial protocol bridging, video processing pipelines, and test and measurement instrumentation. The integrated transceivers also enable use in radar, imaging, and aerospace data-acquisition subsystems. Industrial temperature grade makes it suitable for factory automation and outdoor communication infrastructure. When designing with this FPGA, plan for a multi-rail power tree (typically 0.9V core, 1.1V/1.8V auxiliary, 2.5V/3.3V I/O, and a separate PLL analog rail), a JTAG-based configuration scheme, and adequate PCB thermal management using thermal vias beneath the FC-FBGA thermal pad. Designers should also budget for in-system programming and remote update via Active Serial (AS) or JTAG. Quartus Prime software is required for synthesis, place-and-route, and timing closure. This page synthesizes Intel Arria 10 datasheet parameters, distributor stock and pricing, drop-in package-compatible alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
10AX115N3F45I2SG - Arria 10 GX 1.15M LE FPGA | Intel | 1932-FCBGA
The Intel (Altera) 10AX115N3F45I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/Os in a 1932-ball Flip-Chip BGA (FC-FBGA) package built on TSMC's 20nm process. It operates from a 0.85V to 0.95V core supply and is offered in the -I2 industrial speed grade with operating junction temperature rated from -40C to +100C. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. Within the broader semiconductor taxonomy, an FPGA sits between general-purpose CPUs/GPUs and fixed-function ASICs, occupying the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Arria 10 GX devices target mid-range, transceiver-rich applications by combining programmable logic with hardened memory controllers, variable-precision DSP blocks, and up to 24 Gbps multi-gigabit transceivers, balancing performance, power efficiency, and integration for communication, broadcast, and compute-acceleration workloads. Key features of the 10AX115N3F45I2SG include 1,150,000 logic elements (LEs), 68,857,856 embedded memory bits, 2,738 18x19 multipliers, 24 Gbps transceivers, and hardened PCI Express Gen3 and 10 Gigabit Ethernet MAC IP blocks. The 1932-pin FCBGA package exposes 768 user I/Os and supports high-speed serial interfaces such as 10/25/40/100 Gigabit Ethernet and Interlaken, enabling single-chip connectivity for line-card and backplane designs. The Arria 10 architecture pairs a fine-grained LE fabric with column-based variable-precision DSP blocks and 20-bit, 2,000 MSPS hardened floating-point multipliers, allowing efficient implementation of FFTs, FIR filters, and matrix-math kernels. 12.5 Gbps backplane-capable transceivers and 1,866 MHz DDR4 external memory interfaces reduce system BOM cost by removing external PHY components in many designs. Typical applications include 100G line-card packet processing, wireless baseband aggregation, video broadcast processing, high-performance computing acceleration, and test and measurement equipment. The -I2 industrial speed grade and FC-FBGA thermal envelope make the device suitable for forced-air-cooled chassis without exotic thermal management. When designing with the 10AX115N3F45I2SG, use Intel Quartus Prime for synthesis, place-and-route, and timing closure. Allocate at least 6 PCB layers with continuous GND planes and follow Intel's pinout-aware power-delivery network guidelines to keep transceiver jitter within mask. Industrial-grade devices with the -I2 speed grade meet 100C junction temperature for extended-temperature chassis. This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical design notes not found in the manufacturer datasheet.
10AX115N4F40E3LG - Arria 10 GX 1.15M LE FPGA, FCBGA-1517 | Intel
The Intel 10AX115N4F40E3LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) built on TSMC's 20 nm process, integrating 1,150,000 logic elements, 68,857,856 embedded memory bits, and 600 hardware DSP blocks into a 1517-ball flip-chip BGA package measuring 40 x 40 mm. It supports up to 24 transceiver channels capable of 14.1 Gbps backplane performance for high-speed serial connectivity in communications infrastructure, broadcast video, and high-performance compute acceleration. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, embedded memory (BRAM/M20K), DSP slices, and hardened I/O and transceiver peripherals on a single die. Within the broader IC hierarchy, an FPGA sits at: FPGA -> programmable logic -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used as application-specific alternatives to ASICs where volume does not justify custom silicon, providing full hardware parallelism and reprogrammability that microcontrollers cannot match. The 10AX115N4F40E3LG delivers key features including 24 transceivers at up to 14.1 Gbps, 384 18x19 multipliers in variable-precision DSP blocks, M20K (20 Kbit) embedded memory blocks for efficient on-chip buffering, and 12-core Hard Processor System (HPS) integration depending on the device variant family. The 1517-ball FCBGA package exposes 624 general-purpose I/O pins and 24 dedicated high-speed transceiver channels, while supporting 0.85 V core operation with 1.1 V auxiliary rails. The architectural backbone combines Adaptive Logic Modules (ALMs) with a fine-grained routing fabric and hardened memory controller IP. The 20 nm process technology achieves the right balance of static and dynamic power for sustained compute workloads, while the variable-precision DSP supports both fixed and floating-point arithmetic natively, simplifying radio, video, and machine-learning inference pipelines. Typical applications include 100G/400G networking line cards with integrated MAC and forward-error-correction acceleration, 4K/8K broadcast video processing pipelines using the on-chip DSP and transceivers, military radar and electronic-warfare baseband preprocessing, medical imaging backplanes (CT, MRI, ultrasound), and high-performance compute accelerator cards. The transceivers' 14.1 Gbps capability also enables PCIe Gen3 and 10G/40G Ethernet bridging. When designing with the 10AX115N4F40E3LG, ensure a 12-layer PCB stack-up with continuous ground planes under the BGA to meet signal-integrity and JEDEC JESD51 thermal envelope. JTAG configuration via the Quartus Prime programmer is recommended for production programming. Long lead times (often 30-90 days) should be factored into inventory planning due to the specialized FCBGA package.
10AX115N4F40I3LG - Arria 10 GX FPGA 1.15M LE 1517-FCBGA | Intel
The Intel 10AX115N4F40I3LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 600 high-speed I/O pins, fabricated on a 20 nm process and housed in a 1517-ball FCBGA package. It is rated for industrial temperature operation (-40C to +100C) and operates from a 0.9 V core supply. The device integrates up to 96 full-duplex transceivers and hard PCIe Gen3 IP blocks for high-bandwidth serial I/O. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as transceivers, DSP slices, and embedded memory. FPGAs belong to the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy: FPGA -> PLD -> logic IC -> integrated circuit. Unlike ASICs, FPGAs can be reconfigured after manufacture, making them ideal for prototyping, low-volume production, and applications requiring post-deployment updates. Key features of the 10AX115N4F40I3LG include 1,150,000 logic elements (LEs), 68,857,856 bits (approximately 8 MB) of embedded M20K memory blocks, variable-precision DSP blocks supporting up to 1,500 GMACS of fixed-point throughput, and up to 96 full-duplex transceiver channels supporting data rates up to 28.05 Gbps. The 1517-ball FCBGA package provides high-density interconnect for designs requiring 600 user I/O pins, with the 'F40' suffix indicating an F1517 package, 40 mm body size, and 1.0 mm ball pitch. The Arria 10 GX architecture combines a mid-range FPGA fabric with hardened floating-point DSP, variable-precision multipliers, and a coherent memory subsystem for high-performance signal processing. The 20 nm process enables a balanced trade-off between performance and power, with device variants optimized for transceiver-rich, DSP-heavy, or general-purpose logic designs. Typical applications include high-speed data acquisition systems, 4K/8K video broadcast equipment, wireless baseband processing, military radar, medical imaging, and high-performance computing accelerators. The combination of high logic density, ample DSP resources, and multi-gigabit transceivers makes the 10AX115N4F40I3LG particularly suitable for applications that demand both parallel processing and high-bandwidth serial connectivity. When designing with this device, engineers must allocate sufficient PCB layers (typically 12+ layers with HDI microvia technology) and high-performance transceiver channel routing to support the 28 Gbps SerDes interfaces. Thermal management with heatsinks and airflow is also critical given the high integration density and 0.9 V core supply current requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the 10AX115N4F40I3LG, complementing the information available in the manufacturer datasheet with engineering-oriented guidance for component selection and PCB integration.
10AX115N4F40I3SG - Arria 10 GX 1150K LE FPGA | Intel | 1517-FCBGA
The Intel 10AX115N4F40I3SG is a high-density Arria 10 GX field-programmable gate array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and a 1517-ball Flip-Chip BGA package, specified for the industrial temperature grade. Built on Intel's 20 nm process, the Arria 10 GX family delivers up to 1.5 TFLOPs of single-precision floating-point DSP performance and integrates transceivers, hard memory controllers, and hardened PCIe Gen3 IP blocks for high-bandwidth designs. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip SRAM blocks, and programmable interconnect. FPGAs sit between general-purpose microcontrollers (fixed hardware, sequential execution) and ASICs (fixed function, lowest per-unit cost at high volume). Arria 10 GX specifically targets mid-range transceiver-based applications where 10 Gbps to 17.4 Gbps backplanes, PCIe Gen3 x8, and DDR4 memory interfaces must coexist with deterministic DSP processing. Key features include up to 28.05 Gbps transceivers, 16.7 Gbps external memory PHYs supporting DDR4 up to 2666 Mbps, hardened floating-point multipliers in DSP blocks, partial reconfiguration support, and a 1.5 GHz core fabric. The 1517-FCBGA F40 package (40 x 40 mm, 1.00 mm pitch) provides 600 user I/O pins, making the device suitable for high-pin-count systems such as 100G line cards, broadcast video processing, and radar baseband. The Arria 10 architecture combines a hard ASIC-like quad-core ARM subsystem variant (SoC SKUs) with a hardened floating-point DSP engine. The 20 nm process enables a tight power envelope (under 40 W typical for typical transceiver designs), allowing fan-cooled operation in telecom shelves. Compared to the prior Arria V generation, Arria 10 delivers approximately 2x the logic density, 4x the DSP throughput, and 2x the transceiver bandwidth while keeping the same Quartus Prime toolchain. Typical applications include 100G Ethernet MAC and framer designs, OTN/OTU4 long-haul transponders, 4K/8K broadcast video processing, PCIe Gen3 endpoint acceleration cards, FPGA-based radar and electronic-warfare signal processing, and high-speed test instrumentation. The industrial temperature grade (-40C to +100C junction) makes it well suited for outdoor telecom, military, and aerospace platforms. When designing with this device, allocate at least 8 PCB layers with continuous GND planes, follow Intel's recommended transceiver break-out region, and use the Quartus Prime PowerPlay Early Power Estimator before board layout. The 1517-BGA requires fine-pitch 1.00 mm BGA assembly capability; design-for-manufacturability rules in the device handbook must be followed to avoid via-in-pad defects. This page synthesizes distributor pricing, drop-in Arria 10 same-family alternatives, and reference design guidance not found in the manufacturer datasheet alone. Engineers comparing Arria 10 GX with Stratix 10 or competing Xilinx UltraScale parts can use the comparison table below for head-to-head specification evaluation.
10AX115N4F45E3LG - Arria 10 GX FPGA 1150K LE 28nm FCBGA | Intel
The Intel (formerly Altera) 10AX115N4F45E3LG is a high-end Arria 10 GX Field Programmable Gate Array built on TSMC's 20nm process, delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 maximum user I/O pins in a 1932-ball FCBGA package. It supports up to 96 full-duplex transceiver channels at data rates up to 17.4 Gbps for chip-to-chip, backplane, and optical link applications. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured by the end user via a hardware description language. FPGAs occupy the tier between fixed-function ASICs and microcontrollers for applications demanding high parallel throughput, deterministic latency, and post-deployment logic updates. The Arria 10 family specifically targets mid- to high-bandwidth transceiver, DSP, and memory-interface workloads where 28nm-class ASIC NRE is not justified. Key features include 1,150,000 logic elements (LEs), 68.86 Mbits embedded RAM, 3,376 DSP blocks (18x19 multipliers), 24 transceiver channels at up to 17.4 Gbps in this specific variant, dual ARM Cortex-A9 MPCore hard processor subsystem, and hard memory controllers supporting DDR4, DDR3, QDR-IV, and RLDRAM III. The hard ARM cores remove the need to instantiate a soft processor when the design needs an embedded host. The device also integrates 24 PLLs and 48 user-clock networks. Architecturally, the Arria 10 GX combines adaptive logic modules (ALMs), MLAB memory, DSP blocks, and variable-precision DSP capability into a column-based fabric. Embedded HardCopy blocks, including PCIe Gen3 x8 hard IP, simplify high-performance serial interface integration without consuming fabric resources. Typical applications include 10G/40G Ethernet bridging, OTN/SONET/SDH framer designs, radar and electronic-warfare DSP front-ends, 8K video broadcast equipment, ASIC prototyping, and PCIe accelerator cards. The hard ARM cores plus DDR4 controller make it suitable for software-defined radio baseband and industrial imaging platforms where both compute density and a host CPU are required. Design consideration: the 45mm x 45mm FCBGA with 1932 balls requires a high-density PCB stack-up (typically 12+ layers) with microvia or stacked-via technology. Thermal design must dissipate roughly 30-40 W under sustained transceiver traffic; a heatsink with adequate airflow is mandatory in most chassis environments. This page consolidates distributor pricing, drop-in same-package and cross-package alternatives, and application notes that go beyond the manufacturer datasheet to help engineers shorten sourcing and feasibility decisions.
10AX115N4F45I3LG - Arria 10 GX FPGA, 1150K LE, 1932-FCBGA | Intel
The Intel 10AX115N4F45I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) from the Intel (formerly Altera) Arria 10 family, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/Os in a 1932-ball FCBGA package. It is built on TSMC's 20 nm process and is offered in the industrial temperature grade, targeting mid-range high-performance applications where the device must operate reliably across -40 °C to +100 °C. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated functional blocks such as DSP slices, transceivers, and on-chip memory. FPGAs sit within the broader programmable logic hierarchy (PLD > CPLD > FPGA > SoC FPGA) and belong to the integrated-circuit family of general-purpose parallel computing devices. Engineers select FPGAs over fixed-function ASICs or microcontrollers when deterministic latency, parallel data-path processing, and hardware re-programmability are required. Key features of the 10AX115N4F45I3LG include up to 1,150K logic elements, 68.86 Mbit embedded memory, integrated transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and a rich hard-memory-controller + PCIe Gen2/Gen3 + external-memory-interface IP portfolio. The 1932-ball FCBGA package exposes all transceiver, memory, and GPIO pins needed for high-bandwidth system designs. The 'I3' speed grade and 'F45' 45 mm package family identify the precise ordering code within the Arria 10 GX lineup. The Arria 10 GX architecture combines a high-performance fabric with hardened IP for transceivers, PCIe, and memory controllers. This heterogeneity lets designers implement pipelined DSP chains, multi-channel ADC/DAC interfacing, and protocol bridging on a single device. The TSMC 20 nm node provides the power-performance balance required for mid-range bandwidth systems. Typical applications include high-speed data acquisition, broadcast video processing, wireless baseband, radar signal processing, test and measurement instrumentation, and high-performance compute accelerators. The integrated transceivers make the part particularly attractive for 10 Gbps backhaul links and video transport. When designing with this device, pay close attention to transceiver reference-clock routing, power-rail decoupling (the Arria 10 family requires multiple analog and digital rails), thermal management via a heat-spreader or heatsink, and PCB stack-up for high-speed serial channels. Always consult the Intel Arria 10 device datasheet for the exact pinout of the 1932-ball package. This page synthesizes distributor pricing, drop-in alternatives within the same Arria 10 GX lineup, and practical design notes not consolidated in the manufacturer datasheet.
10AX115N4F45I3SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX115N4F45I3SG is a high-density Arria 10 GX Field Programmable Gate Array built on TSMC's 20 nm process, integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/O pins in a 1932-ball FC-FBGA package with industrial -40C to +100C temperature grade. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory, DSP slices, and high-speed transceivers interconnected by a programmable routing fabric. Within the broader programmable-logic taxonomy (FPGA -> programmable logic device -> logic IC -> integrated circuit), Arria 10 GX devices occupy the mid-range, balancing transceiver bandwidth, logic density, and power efficiency for transceiver-based applications. Key features of the 10AX115N4F45I3SG include 24 transceivers at up to 17.4 Gbps for protocols such as PCIe Gen3, 10GbE, and Interlaken, 1,518 DSP blocks delivering up to 1.5 TFLOPS, hard memory controllers supporting DDR4/3 and LPDDR3, and a hard PCIe Gen3 x8 IP core. The device integrates 28 nm hard intellectual-property blocks (transceivers, PCIe, memory controllers) on a 20 nm core fabric, an Intel/TSMC heterogeneous 3D system-in-package construction. Technical depth: the 20 nm process combined with the Smart Voltage ID (SmartVID) reduces dynamic power by up to 40% versus 28 nm predecessors. Partial reconfiguration lets designers swap logic regions while the rest of the device remains active, useful for adaptive-radio and software-defined networking workloads. Typical applications include 4K/8K video broadcast and professional A/V, 100G/400G networking line cards, military radar and electronic-warfare signal processing, medical imaging accelerators, and ASIC prototyping. Design considerations include power delivery (greater than 60 W via a multi-rail SmartVID scheme), a high-pin-count FC-FBGA requiring multilayer PCB with stacked-via (Stacked-Via / Any-Layer-Via) construction, and a thermal solution sized for approximately 25 W typical board power. This page synthesizes distributor pricing, FPGA-family drop-in alternatives, and PCB/thermal design guidance that is not present in the standalone Arria 10 device datasheet, supporting faster procurement and architecture decisions.
10AX115R1F40E1SG - Arria 10 GX 1150K LE FPGA | Intel | F40 BGA
The Intel (Altera) 10AX115R1F40E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,560 bits of embedded memory, and 342 DSP blocks, fabricated on a 20nm TSMC process and housed in a 1517-ball FCBGA (F40, 40x40 mm) package. The R1 speed grade and 0.9V core voltage (E1S = enhanced -1 speed, industrial temperature range) make it suitable for mid-to-high performance mid-range applications. The Arria 10 GX family integrates up to 96 full-duplex transceivers supporting data rates up to 14.4 Gbps, hard memory controllers, variable-precision DSP, and a hard PCIe Gen3 x8 IP core, targeting throughput-intensive mid-range designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory (BRAM/M20K blocks), DSP slices, and high-speed transceiver tiles, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> CPLDs -> FPGAs -> SoC FPGAs (with integrated hard processors), and are used as application-specific accelerators or glue logic in wired communications, broadcast, defense, medical imaging, and high-performance computing. Arria 10 GX specifically occupies the mid-range, transceiver-rich position in Intel's FPGA portfolio, sitting between the lower-power Cyclone family and the high-performance Stratix family. Key features of the 10AX115R1F40E1SG include 1,150K logic elements, 68.86 Mbits embedded RAM, 342 variable-precision DSP blocks, 24 transceivers at up to 14.4 Gbps, hard PCIe Gen3 cores, 2 hard memory controllers, and 4 hard PLL per side pairs. The device supports up to 768 user I/O via 12 I/O banks with 1.2V to 3.3V single-ended and differential I/O standards (LVDS, LVCMOS, HSTL, SSTL). Configuration is supported via JTAG, active serial (AS x4), passive serial (PS), fast passive parallel (FPP), and CvP over PCIe. Architecturally, the Arria 10 GX combines a hardened peripheral set (PCIe Gen3, memory controllers, transceivers) with the Adaptive Logic Module (ALM) fabric and 20K-bit M20K memory blocks. The variable-precision DSP block supports fixed-point, floating-point, and complex arithmetic, eliminating external DSP chips in many signal-processing pipelines. Hardened IP cores shorten time-to-market and reduce soft-logic overhead, allowing designers to focus on differentiated application logic. Typical applications include 100G Ethernet line cards, OTN/WDM optical transport equipment, broadcast video processing (4K/UHD), radar and electronic warfare preprocessing, medical imaging pipelines, FPGA-based PCIe accelerator cards, and high-speed test & measurement instrumentation. The Arria 10 GX family is also deployed in defense, aerospace, and industrial imaging systems where mid-range logic density combined with high transceiver bandwidth is required. When designing with this device, pay close attention to PCB layout for the 1517-ball FCBGA: a 12+ layer stackup with buried capacitance is recommended for power integrity, and the transceiver channels require matched-length routing with controlled impedance (typically 85 ohm differential) and length matching within 150 mil. Use the Intel Quartus Prime design suite (Standard or Pro edition) for synthesis, place-and-route, and timing closure, and validate signal integrity with Intel's board-level IBIS-AMI models. This page synthesizes distributor pricing, the official Intel FPGA product page, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet - giving engineers and buyers a single-source view of the 10AX115R1F40E1SG's value, fit, and supply chain.
10AX115R1F40I1SG - Arria 10 GX FPGA, 1.15M LE, FCBGA-1517 | Intel
The Intel 10AX115R1F40I1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O in a 1517-ball Flip-Chip BGA (FCBGA) package. Built on TSMC's 20 nm process, this device belongs to the 10AX115 device class with F40 speed/power grade and the industrial temperature range. It integrates 24 transceiver channels capable of up to 14.4 Gbps, hard memory controllers, and variable-precision DSP blocks for signal-processing workloads. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit in the hierarchy: programmable logic -> ASIC alternative -> parallel processing accelerator -> semiconductor IC. They trade raw clock speed for massive parallelism and reconfigurability, making them ideal for evolving standards, low-volume ASIC replacement, and hardware-accelerated compute. Key features include 427,200 adaptive logic modules (ALMs), 1,518 embedded 18x18 multipliers, 24 high-speed transceivers with hardened PCIe Gen3 and 10G Ethernet IP, 1.15M logic elements, and hardware floating-point support. Hardened memory controllers support DDR3/DDR4 with ECC, while on-chip 20 Gbps transceivers reduce BOM cost and board complexity for high-bandwidth links. The Arria 10 architecture combines a mid-range logic fabric with high-end transceiver performance at lower power than the prior 28 nm generation, targeting 20 nm process advantages and SmartVID dynamic voltage scaling. The device supports partial reconfiguration, design security via bitstream encryption, and Quartus Prime development flow, making it a strong fit for production-grade applications. Typical applications include high-speed serial backplane bridges, 100G/400G line-card packet processing, FPGA-based hardware accelerators for data-center offload, video broadcast and studio processing, military radar front-end preprocessing, and 4K/8K video capture. Its combination of high logic density, 14.4 Gbps transceivers, and PCI Express Gen3 hard IP makes it a go-to mid-density FPGA for line-rate data planes. When designing with this device, pay close attention to PCB routing for the 1517-ball FCBGA - escape routing demands high-density interconnects with microvia stack-ups. Power-rail sequencing must respect SmartVID rails, and thermal management must dissipate up to ~30 W at full transceiver utilization. Plan configuration via JTAG, AS, or fast passive parallel (FPP) modes depending on boot-time constraints. This page synthesizes distributor pricing, drop-in package-compatible Altera/Intel Arria 10 alternatives, and practical design notes that complement the official datasheet for engineers evaluating mid-density FPGA options.
10AX115R2F40E1SG - Arria 10 GX FPGA, 1150K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) 10AX115R2F40E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/Os in a 1517-ball FCBGA (F40) package. Built on TSMC's 20nm process, the Arria 10 GX family targets mid-range, transceiver-rich applications requiring a balance of logic density, DSP throughput, and 14.2 Gbps backplane-class transceivers. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, embedded memory, DSP slices, and high-speed transceivers connected via a programmable routing fabric. FPGAs occupy a tier above general-purpose microcontrollers and below custom ASICs in the semiconductor hierarchy: programmable logic device -> FPGA -> SRAM-based FPGA -> transceiver-equipped FPGA -> Arria 10 family. Engineers select FPGAs when they need hardware parallelism, deterministic latency, or interface protocols not natively supported by microprocessors. Key differentiating features of the 10AX115R2F40E1SG include 1,150,000 logic elements (LEs), 68.86 Mbits embedded SRAM, 1,518 DSP blocks (20x19 variable precision), and integrated 14.2 Gbps GX transceivers. The device supports up to 342 GPIOs organized into multiple I/O banks with LVDS, LVTTL, LVCMOS, and high-speed memory interfaces including DDR4 with hard memory controllers. The 1517-FCBGA package measures 40 mm x 40 mm and includes an exposed thermal lid for heat-spreader attachment in thermally demanding applications. Architecturally, the Arria 10 GX family uses a 20nm tri-gate (FinFET) process with partial reconfiguration support, multi-port memory, and a hard PCIe Gen3 x8 IP block. The 10AX115R2F40E1SG speed grade (-2) and extended temperature grade (-E1) indicate a mid-tier speed bin and extended commercial operating range, suitable for data center acceleration, video broadcast, and wireless baseband prototyping. Typical applications include 4K/8K video processing pipelines, 100G Ethernet MAC aggregation, military radar and SDR front ends, medical imaging accelerators, and ASIC prototyping. Designers choose this device when transceiver count, logic density, and DSP throughput must all be balanced against power budget. When designing with the 10AX115R2F40E1SG, plan for a 0.85V/0.9V/1.1V core voltage supply, multiple PLL-decoupled regulator zones, and a multi-layer PCB with continuous reference planes. Quartus Prime provides synthesis, place-and-route, and the HardCopy ASIC migration path for volume production handoff. This page synthesizes real-time distributor pricing, drop-in same-family Arria 10 variants, and FPGA design best practices not consolidated on a single distributor page.
10AX115R2F40E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1517-FCBGA
The Intel (formerly Altera) 10AX115R2F40E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 embedded memory bits, and 342 user I/O pins, housed in a 1517-ball Flip-Chip BGA (FCBGA) package. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be reconfigured by the designer after manufacturing, consisting of configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. Within the programmable-logic hierarchy, Arria 10 GX sits in the mid-to-high-performance tier: FPGA -> mid-range FPGA -> Arria family -> Arria 10 GX, optimized for transceiver-rich applications including 25G/40G/100G backplanes, radar, and ASIC prototyping. Key features of the 10AX115R2F40E2LG include 24 high-speed serial transceivers up to 17.4 Gbps (28.3 Gbps with the -3 speed grade), two hard memory controllers for DDR4/DDR3/RLDRAM3, up to 1,518 18x19 multipliers for DSP, integrated PCI Express Gen3 hard IP blocks, and 24 fractional PLLs. The -2 speed grade and -E2 (extended) temperature rating target commercial-to-industrial deployments with a balance of performance and power. Architecturally, the device uses TSMC's 20 nm process with a heterogeneous fabric that pairs adaptive logic modules (ALMs) with hard floating-point DSP blocks and 20 Gbps transceivers. The hard IP approach delivers deterministic latency and roughly 2x better performance-per-watt versus soft implementations, making the 10AX115R2F40E2LG a strong fit for transceiver-heavy signal-processing pipelines. Typical applications include 100G/40G Ethernet line cards, OTN/SONET framer/mapper equipment, military radar signal processing, medical imaging accelerators, ASIC emulation prototyping, and high-performance computing fabric bridges. When designing with this device, plan a 12-layer stack-up with transceiver channels routed on the top layers behind short Ac coupling capacitors. Use Intel Quartus Prime Pro Edition for synthesis, place-and-route, and timing closure; consult the Arria 10 Transceiver PHY User Guide for eye-margining and adaptive equalization settings. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical board-level design notes not found in the manufacturer datasheet alone.
10AX115R2F40E2SG - Arria 10 GX FPGA 1150K LE FCBGA-1517 | Intel
The Intel 10AX115R2F40E2SG is an Arria 10 GX field-programmable gate array (FPGA) featuring 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O, housed in a 1517-ball flip-chip BGA (FCBGA) package measuring 40 x 40 mm. Built on TSMC's 20 nm process, this device integrates up to 96 full-duplex transceiver channels supporting data rates up to 17.4 Gbps (chip-to-chip), making it well suited for high-bandwidth wireline and wireless infrastructure designs. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic functionality is defined by the customer after manufacture via a configuration bitstream, allowing hardware to be re-programmed in the field. Architecturally, the Arria 10 GX sits in the hierarchy: FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. The GX variant specifically adds hardened transceivers, variable-precision DSP blocks, and embedded hard IP for PCIe Gen3, 10GbE, 40GbE, 100GbE, and Interlaken, accelerating high-throughput signal processing and protocol bridging. Key features of 10AX115R2F40E2SG include a 14.6 Gbps backplane-capable transceiver rate class, hardened 10/25/40/100 Gbps Ethernet MAC and IP cores, variable-precision DSP blocks supporting IEEE 754 single-precision floating point, and fractional synthesis PLLs. The device ships in the -E2 speed grade (mid-range), a commercial operating temperature range of 0C to 100C, and is supplied in tray packaging for prototyping and production assembly lines. Architecturally, the Arria 10 family adopts a heterogeneous approach with a hard processor subsystem, hardened floating-point DSP, and a tightly integrated core fabric tuned for signal processing throughput per watt. The 14 nm Tri-Gate process on the later Arria 10 variants offers 35% lower power than the 28 nm predecessor, and the 17.4 Gbps transceivers are designed for OTU2/OTU4 long-reach backplanes and CPRI wireless fronthaul. Typical applications include 100G optical transport network line cards, 4G/5G baseband processing, military radar signal processing, medical imaging accelerators, and high-performance compute fabric cards. The wide DSP/IO bandwidth and hardened memory controllers make it especially attractive in PCIe Gen3 x8/x16 host accelerator cards. For the -E2 commercial temperature grade specifically, the part is well matched to indoor telecom racks, prototyping, and lab equipment. When designing in this part, carefully validate the 17.4 Gbps transceiver channel placement, reference clock distribution, and decoupling network against Intel's Arria 10 GX Transceiver PHY User Guide. Use Quartus Prime Pro Edition (the supported design suite) for synthesis, place-and-route, and timing closure. Power estimation should use the Early Power Estimator (EPE) spreadsheet before committing to a board design. This page consolidates the official Intel datasheet, distributor pricing across 10 channels, and a curated set of pin-compatible Arria 10 / Arria 10 GX alternatives, alongside practical design notes that go beyond what the datasheet alone provides.
10AX115R2F40I1SG - Arria 10 GX FPGA, 1.15M LEs, 1517-BGA | Intel
The Intel 10AX115R2F40I1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/Os into a 1517-ball Flip-Chip BGA (FCBGA) package. Built on TSMC's 20 nm process, the device combines a hardened ARM Cortex-A9 subsystem variant with up to 24.0 Gbps transceivers, a rich DSP fabric, and variable-precision floating-point support, addressing high-throughput signal processing, broadcast, and wireline backhaul workloads. An FPGA is a semiconductor device whose digital logic, interconnects, I/O standards, and even analog subsystems can be reconfigured post-manufacture via a hardware description language (HDL) bitstream. In the broader taxonomy, FPGAs sit between fixed-function ASICs and software-driven processors: ASICs deliver the lowest unit cost at high volumes but cannot be updated, while processors offer flexibility at the cost of deterministic latency and per-cycle throughput. FPGAs bridge these extremes by delivering ASIC-class parallel performance with firmware-level reconfigurability, which is why they dominate in low-latency networking, prototype ASICs, and DSP-heavy pipelines. The Arria 10 family specifically targets mid-range applications where Stratix 10 performance is overkill and Cyclone V/10 cost is too restrictive. Key features of the 10AX115R2F40I1SG include the 20 nm monolithic die with embedded hard IP for PCIe Gen3 x8, 10 Gbps Ethernet MACs, Interlaken, and external memory interfaces (DDR4, QDR-IV, RLDRAM3). The F40 1517-ball package supports 342 general-purpose I/Os and exposes 12.5 Gbps / 14.1 Gbps multi-rate transceivers depending on speed grade, plus hardened floating-point operators that consume roughly 1.5x fewer logic elements than equivalent soft implementations. The architecture combines a core fabric of adaptive logic modules (ALMs) with 1,150K LEs and 2,014 18x19 variable-precision multipliers. Eight fractional PLLs and a precision clock network feed the core, transceivers, and external memory controllers. Hard memory controllers with ECC simplify DDR4-2400 implementation, and 3D-stacked silicon interposers deliver the high transceiver count without the signal-integrity penalties of organic packages. Typical applications for the 10AX115R2F40I1SG span 4K broadcast video processing, radar and electronic-warfare front ends, 100G/400G optical transport, 4G/5G baseband prototyping, and high-end medical imaging. The 'I1' suffix denotes an industrial temperature grade (–40 °C to +100 °C) and the R2 designation marks transceiver speed binning in the second tier, while the F40 package provides the full transceivers and I/O count. Engineers selecting this part typically need more DSP bandwidth than Arria V GZ but want a power/performance sweet spot between Stratix 10 and Cyclone 10 GX. When laying out a board for this device, plan 1 oz copper at minimum, a 12-layer stack-up for the transceiver channels, and a dedicated 0.9 V core supply capable of sustaining ~30 A during configuration bursts. Add a JTAG header for in-system programming, follow Intel's EMI and decoupling guidelines for F40, and confirm thermal solution sizing against the -I1 industrial ambient of 100 °C. Quartus Prime provides pin-out, power, and timing-closed reference designs to shorten integration. This page synthesizes distributor pricing, datasheet pin characteristics, same-family drop-in alternatives from the Arria 10 portfolio, and practical design notes that are not consolidated in the official datasheet, giving procurement and design engineers a single source for both selection and sourcing decisions.
10AX115R2F40I2LG - Arria 10 GX FPGA 1.15M LE FCFBGA-1517 | Intel
The Intel (formerly Altera) 10AX115R2F40I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements and 68,857,856 bits of embedded memory in a 1517-ball FC-FBGA package with 342 user I/O pins. Built on a 20 nm TSMC process, the device runs at a core voltage of 0.9 V and is offered in an industrial temperature grade. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated silicon resources such as transceivers, DSP blocks, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs), themselves a sub-class of digital integrated circuits used for high-speed parallel processing, hardware acceleration, and rapid prototyping that ASICs cannot economically match. The Arria 10 family specifically targets mid-range transceiver-rich applications between Cyclone (low cost) and Stratix (maximum performance). Key features of the 10AX115R2F40I2LG include 1.15M logic elements, 68.86 Mbits of on-site M20K block RAM, integrated 28.05 Gbps transceivers, variable-precision DSP blocks, hard memory controllers, and PCI Express hard IP blocks. The 1517-ball package exposes 24 transceiver channels and supports up to 342 general-purpose I/O running LVDS, LVCMOS, and memory interfaces such as DDR4. Architecturally, Arria 10 GX combines an adaptive logic module (ALM) fabric with hard IP cores to deliver balanced logic, memory, and serial bandwidth. The 20 nm process and 0.9 V core lower total power versus prior 28 nm Stratix V generations while sustaining comparable throughput, making the part popular for high-throughput wireless, broadcast, and test-and-measurement systems. Typical applications include 100G/400G optical line cards, wireless baseband and remote-radio-head (RRH) digital front-end processing, military radar and SIGINT, medical imaging accelerators, and high-end ASIC prototyping. The GX transceiver support is particularly valued for backhaul, fronthaul (CPRI/OBSAI), and PCIe Gen3 system integration. When designing, ensure the 1517-ball FC-FBGA land pattern matches the PCB footprint exactly, route the 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary supplies per the Intel pin connection guidelines, and respect the transceiver reference-clock jitter budget. Thermal management is critical - the device dissipates substantial power at full transceiver utilization, requiring a heatsink and adequate airflow. This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 family, and design guidance not found in the standalone manufacturer datasheet.
10AX115R2F40I2SG - Arria 10 GX FPGA 1150K LE | Intel
The Intel 10AX115R2F40I2SG is a high-density Arria 10 GX field-programmable gate array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 342 user I/O, housed in a 1517-ball FCBGA (F40) package. Built on TSMC's 20 nm process, this industrial-temperature Arria 10 GX variant integrates up to 1.5 GHz ARM Cortex-A9 hard processor subsystem support, 28.05 Gbps transceivers, and 1,518 hardened floating-point multipliers. An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric and routing are configured after manufacture by the customer. FPGAs belong to the programmable logic device (PLD) family, sitting alongside CPLDs (complex PLDs) in the broader taxonomy of programmable logic -> digital IC -> integrated circuit. They are used to implement arbitrary digital logic, DSP pipelines, high-speed serial interfaces, and memory controllers without fabricating a custom ASIC. Key features of the 10AX115R2F40I2SG include 427,200 adaptive logic modules (ALMs) organized into 35,650 logic array blocks (LABs), 1,518 variable-precision DSP blocks, and 24 transceiver channels supporting data rates up to 17.4 Gbps (chip-to-chip) and 14.1 Gbps (backplane). The device also embeds 1.54 Mb of distributed RAM, 31.5 Mb of MLAB memory, and a hard PCIe Gen3 x8 IP block for accelerator cards and compute platforms. Architecturally, the Arria 10 GX series uses a coherent, multi-rail SmartVID power delivery system with six voltage rails (0.9 V core, 0.95 V transceiver, 1.0 V, 1.2 V, 1.5 V, 1.8 V auxiliary) and integrated digital voltage regulators, simplifying board power design. The hard memory controller and partial reconfiguration support enable in-field firmware updates without system downtime. Typical applications include 100 Gbps network interface cards, high-definition video broadcast equipment, radar processing in defense and aerospace systems, medical imaging accelerators, and high-performance digital signal processing test equipment. Designers select the 10AX115R2F40I2SG when density, transceiver count, and embedded memory must coexist within a single, mid-power FPGA. When designing with this device, ensure the PCB meets the 1517-ball FCBGA escape rules (0.8 mm pitch), keep differential transceiver traces length-matched within 150 mil, and provide adequate SmartVID power supply decoupling within 100 mil of each rail pin. Quartus Prime Pro edition is required for synthesis and place-and-route of Arria 10 designs. This page synthesizes distributor pricing, drop-in alternatives from the Intel Arria 10 family, and practical design notes not found on the standard distributor product page.
10AX115R3F40E2LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
The Intel / Altera 10AX115R3F40E2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) housed in a 1517-ball FC-FBGA package with 1,150,000 logic elements (LE), 68,857,856 bits of embedded memory, and 342 user I/O pins, fabricated on a 20 nm process node. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the broader taxonomy, the 10AX115R3F40E2LG belongs to: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Arria 10 is positioned as Intel's mid-range, transceiver-rich FPGA family optimized for high-bandwidth signal processing, data acquisition, and protocol bridging between ASIC/ASSP devices. Key features of this variant include the GX transceiver tile block (up to 28.05 Gbps transceivers), a hard PCIe Gen3 / Gen2 controller IP block, 1,150,000 logic elements for parallel DSP and datapath processing, 1,518 DSP blocks for fixed/floating-point operations, and 68,857,856 embedded-memory bits distributed across M20K block RAMs and MLABs. It targets transceiver rates from 1 Gbps up to 28.05 Gbps depending on protocol (PCIe Gen3, 10G/40G Ethernet, CPRI, Interlaken, JESD204B). Typical applications include 100G/40G line-card packet processing, high-end medical imaging (CT, MRI, ultrasound front-end DSP), radar signal processing, software-defined radio baseband, test & measurement digitizer back-ends, and high-resolution video broadcast. The wide transceiver bandwidth also makes the Arria 10 GX 1150K the device of choice for ASIC prototyping where >1 MLE and high I/O count are both required. When designing with this device, plan PCB layout carefully for the 1517-ball FCBGA package: BGA break-out requires microvia or via-in-pad stack-ups, and length-matched routing for the GTx transceivers is mandatory for 25 Gbps+ links. Use Intel Quartus Prime Pro for synthesis, place-and-route, and timing closure. This page synthesizes distributor stock from DigiKey/Mouser/Octopart, design-in guidance for transceiver-based applications, and same-family Arria 10 alternatives not listed in stock feeds.